Selectivity

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CPC
H01J2237/3346

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Parent Industries

HELECTRICITY H01Electric elements H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS H01J2237/00Discharge tubes exposing object to beam

Current Industry

H01J2237/3346Selectivity

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Plasma etching techniques
- Patent number 11,482,423
- Issue date Oct 25, 2022
- Tokyo Electron Limited
- Pingshan Luan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching method and etching device
- Patent number 11,443,952
- Issue date Sep 13, 2022
- Tokyo Electron Limited
- Akitaka Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chamber conditioning and removal processes
- Patent number 11,328,909
- Issue date May 10, 2022
- Applied Materials, Inc.
- Hanshen Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma etching apparatus and method
- Patent number 10,861,678
- Issue date Dec 8, 2020
- Tokyo Electron Limited
- Akira Koshiishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective atomic layer etching
- Patent number 10,847,375
- Issue date Nov 24, 2020
- Lam Research Corporation
- Chia-Chun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power modulation for etching high aspect ratio features
- Patent number 10,410,873
- Issue date Sep 10, 2019
- Tokyo Electron Limited
- Hiroto Ohtake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma etching apparatus and method
- Patent number 10,229,815
- Issue date Mar 12, 2019
- Tokyo Electron Limited
- Akira Koshiishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch suppression with germanium
- Patent number 9,576,809
- Issue date Feb 21, 2017
- Applied Materials, Inc.
- Mikhail Korolik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing touch screen panels using a dry etching ap...
- Patent number 9,552,122
- Issue date Jan 24, 2017
- Samsung Display Co., Ltd.
- Bong-Sub Song
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Etching method
- Patent number 9,105,585
- Issue date Aug 11, 2015
- Tokyo Electron Limited
- Hironori Matsuoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for improving solar cell efficiency and mechan...
- Patent number 8,828,517
- Issue date Sep 9, 2014
- Solexel, Inc.
- David Xuan-Qi Wang
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Gas cluster ion beam etching process for Si-containing and Ge-conta...
- Patent number 8,513,138
- Issue date Aug 20, 2013
- TEL Epion Inc.
- Yan Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low ceiling temperature process for a plasma reactor with heated so...
- Patent number 6,818,140
- Issue date Nov 16, 2004
- Jian Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma reactor having RF power applicator and a dual-purpose window
- Patent number 6,790,311
- Issue date Sep 14, 2004
- Kenneth S Collins
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Inductively coupled RF plasma reactor and plasma chamber enclosure...
- Patent number 6,736,931
- Issue date May 18, 2004
- Kenneth S. Collins
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma reactor having an inductive antenna coupling power through a...
- Patent number 6,623,596
- Issue date Sep 23, 2003
- Applied Materials, Inc.
- Kenneth S. Collins
- A21 - BAKING EDIBLE DOUGHS
Information Patent Grant
Parallel-plate electrode plasma reactor having an inductive antenna...
- Patent number 6,572,732
- Issue date Jun 3, 2003
- Applied Materials Inc.
- Kenneth S. Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal control apparatus for inductively coupled RF plasma reactor...
- Patent number 6,514,376
- Issue date Feb 4, 2003
- Applied Materials Inc.
- Kenneth Collins
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Inductively coupled RF Plasma reactor having an overhead solenoidal...
- Patent number 6,454,898
- Issue date Sep 24, 2002
- Applied Materials, Inc.
- Kenneth Collins
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Inductively coupled RF plasma reactor having an antenna adjacent a...
- Patent number 6,444,085
- Issue date Sep 3, 2002
- Applied Materials Inc.
- Kenneth S. Collins
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma reactor with heated source of a polymer-hardening precursor...
- Patent number 6,440,866
- Issue date Aug 27, 2002
- Applied Materials, Inc.
- Kenneth S. Collins
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma reactor having a dual mode RF power application
- Patent number 6,365,063
- Issue date Apr 2, 2002
- Applied Materials, Inc.
- Kenneth S Collins
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Parallel-plate electrode reactor having an inductive antenna coupli...
- Patent number 6,361,644
- Issue date Mar 26, 2002
- Applied Materials, Inc.
- Kenneth S. Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High pressure high non-reactive diluent gas content high plasma ion...
- Patent number 6,238,588
- Issue date May 29, 2001
- Applied Materials, Inc.
- Kenneth Collins
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Scavenging fluorine in a planar inductively coupled plasma reactor
- Patent number 6,217,785
- Issue date Apr 17, 2001
- Applied Materials, Inc.
- Kenneth S. Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma reactor with heated source of a polymer-hardening precursor...
- Patent number 6,218,312
- Issue date Apr 17, 2001
- Applied Materials Inc.
- Kenneth S. Collins
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Oxide etch process with high selectivity to nitride suitable for us...
- Patent number 6,184,150
- Issue date Feb 6, 2001
- Applied Materials Inc.
- Chan-Lon Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductively coupled RF plasma reactor having an overhead solenoidal...
- Patent number 6,165,311
- Issue date Dec 26, 2000
- Applied Materials, Inc.
- Kenneth S. Collins
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Helicon wave plasma processing apparatus
- Patent number 6,096,160
- Issue date Aug 1, 2000
- Sony Corporation
- Shingo Kadomura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Vacuum processing chamber having multi-mode access
- Patent number 6,095,083
- Issue date Aug 1, 2000
- Applied Materiels, Inc.
- Michael Rice
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR DRY ETCHING USING PLASMA
- Publication number 20240412979
- Publication date Dec 12, 2024
- Research & Business Foundation Sungkyunkwan University
- Geun Young YEOM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS
- Publication number 20240355590
- Publication date Oct 24, 2024
- TOKYO ELECTRON LIMITED
- Takayuki KATSUNUMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS
- Publication number 20240321562
- Publication date Sep 26, 2024
- TOKYO ELECTRON LIMITED
- Koki MUKAIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING PROCESSING METHOD
- Publication number 20240312789
- Publication date Sep 19, 2024
- Hitachi High-Tech Corporation
- Takashi HATTORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING METHOD
- Publication number 20240304456
- Publication date Sep 12, 2024
- Hitachi High-Tech Corporation
- Koichi TAKASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS
- Publication number 20240297027
- Publication date Sep 5, 2024
- Hitachi High-Tech Corporation
- Soichiro ETO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA-ASSISTED FILM REMOVAL FOR WAFER FABRICATION
- Publication number 20240242939
- Publication date Jul 18, 2024
- Micron Technology, Inc.
- Chao Lin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING METHOD AND PLASMA PROCESSING APPARATUS
- Publication number 20240234163
- Publication date Jul 11, 2024
- TOKYO ELECTRON LIMITED
- Shoi SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING METHOD AND PLASMA PROCESSING APPARATUS
- Publication number 20240213032
- Publication date Jun 27, 2024
- TOKYO ELECTRON LIMITED
- Koki MUKAIYAMA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ETCHING METHOD AND PLASMA PROCESSING APPARATUS
- Publication number 20240213031
- Publication date Jun 27, 2024
- TOKYO ELECTRON LIMITED
- Atsuki HASHIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAST GAS SWITCHING
- Publication number 20240203695
- Publication date Jun 20, 2024
- Applied Materials, Inc.
- Toan Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VOLTAGE WAVEFORM CONTROLLING METHOD, SUBSTRATE PROCESSING METHOD, A...
- Publication number 20240170255
- Publication date May 23, 2024
- ASMSUNG ELECTRONICS CO., LTD.
- Hyong seo YOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING METHOD, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, ETCH...
- Publication number 20240162047
- Publication date May 16, 2024
- TOKYO ELECTRON LIMITED
- Takahiro YOKOYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD
- Publication number 20240162046
- Publication date May 16, 2024
- WONIK IPS CO., LTD.
- Min Su KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCING ASPECT RATIO DEPENDENT ETCH WITH DIRECT CURRENT BIAS PULSING
- Publication number 20240162007
- Publication date May 16, 2024
- Applied Materials, Inc.
- Deyang LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multiple State Pulsing for High Aspect Ratio Etch
- Publication number 20240120205
- Publication date Apr 11, 2024
- LAM RESEARCH CORPORATION
- Aniruddha Joi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and Method for Plasma Process Uniformity Control
- Publication number 20240120181
- Publication date Apr 11, 2024
- TOKYO ELECTRON LIMITED
- Sergey Voronin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
In-Situ Adsorbate Formation for Dielectric Etch
- Publication number 20240112888
- Publication date Apr 4, 2024
- TOKYO ELECTRON LIMITED
- Du Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
In-Situ Adsorbate Formation for Plasma Etch Process
- Publication number 20240112887
- Publication date Apr 4, 2024
- TOKYO ELECTRON LIMITED
- Du Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Aspect Ratio Contact (HARC) Etch
- Publication number 20240096640
- Publication date Mar 21, 2024
- TOKYO ELECTRON LIMITED
- Pingshan Luan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA ETCHING METHOD AND METHOD FOR MANUFACTURING SEMICONDUCTOR EL...
- Publication number 20240038546
- Publication date Feb 1, 2024
- SHOWA DENKO K.K.
- Kazuma MATSUI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ETCHING METHOD AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
- Publication number 20230395389
- Publication date Dec 7, 2023
- Resonac Corporation
- Jumpei IWASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING METHOD AND SEMICONDUCTOR ELEMENT MANUFACTURING METHOD
- Publication number 20230290643
- Publication date Sep 14, 2023
- SHOWA DENKO K,K,
- Kazuma MATSUI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PLASMA PROCESSING METHOD AND PLASMA PROCESSING SYSTEM
- Publication number 20230268190
- Publication date Aug 24, 2023
- TOKYO ELECTRON LIMITED
- Atsuki HASHIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING METHOD AND PLASMA PROCESSING SYSTEM
- Publication number 20230230844
- Publication date Jul 20, 2023
- TOKYO ELECTRON LIMITED
- Maju TOMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA-BASED METHOD FOR DELAYERING OF CIRCUITS
- Publication number 20230223273
- Publication date Jul 13, 2023
- National Technology & Engineering Solutions of Sandia, LLC
- Randy J. Shul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF TREATING SUBSTRATE AND APPARATUS FOR TREATING SUBSTRATE
- Publication number 20230215699
- Publication date Jul 6, 2023
- SEMES CO., LTD.
- Myoungsub NOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR PROCESSING SUBSTRATE USING PLASMA
- Publication number 20230197412
- Publication date Jun 22, 2023
- SEMES CO, LTD.
- Seong Gil LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING SUBSTRATE
- Publication number 20230154731
- Publication date May 18, 2023
- TES CO., LTD.
- Bong-Soo KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20230124597
- Publication date Apr 20, 2023
- TOKYO ELECTRON LIMITED
- Nobuhiro TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS

Selectivity

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Plasma etching techniques

Etching method and etching device

Chamber conditioning and removal processes

Plasma etching apparatus and method

Selective atomic layer etching

Power modulation for etching high aspect ratio features

Plasma etching apparatus and method

Etch suppression with germanium

Method for manufacturing touch screen panels using a dry etching ap...

Etching method

Structure and method for improving solar cell efficiency and mechan...

Gas cluster ion beam etching process for Si-containing and Ge-conta...

Low ceiling temperature process for a plasma reactor with heated so...

Plasma reactor having RF power applicator and a dual-purpose window

Inductively coupled RF plasma reactor and plasma chamber enclosure...

Plasma reactor having an inductive antenna coupling power through a...

Parallel-plate electrode plasma reactor having an inductive antenna...

Thermal control apparatus for inductively coupled RF plasma reactor...

Inductively coupled RF Plasma reactor having an overhead solenoidal...

Inductively coupled RF plasma reactor having an antenna adjacent a...

Plasma reactor with heated source of a polymer-hardening precursor...

Plasma reactor having a dual mode RF power application

Parallel-plate electrode reactor having an inductive antenna coupli...

High pressure high non-reactive diluent gas content high plasma ion...

Scavenging fluorine in a planar inductively coupled plasma reactor

Plasma reactor with heated source of a polymer-hardening precursor...

Oxide etch process with high selectivity to nitride suitable for us...

Inductively coupled RF plasma reactor having an overhead solenoidal...

Helicon wave plasma processing apparatus

Vacuum processing chamber having multi-mode access

Patents Applicationslast 30 patents

METHOD FOR DRY ETCHING USING PLASMA

PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS

PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS

ETCHING PROCESSING METHOD

PLASMA PROCESSING METHOD

PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS

PLASMA-ASSISTED FILM REMOVAL FOR WAFER FABRICATION

ETCHING METHOD AND PLASMA PROCESSING APPARATUS

ETCHING METHOD AND PLASMA PROCESSING APPARATUS

ETCHING METHOD AND PLASMA PROCESSING APPARATUS

FAST GAS SWITCHING

VOLTAGE WAVEFORM CONTROLLING METHOD, SUBSTRATE PROCESSING METHOD, A...

ETCHING METHOD, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, ETCH...

SUBSTRATE PROCESSING METHOD

REDUCING ASPECT RATIO DEPENDENT ETCH WITH DIRECT CURRENT BIAS PULSING

Multiple State Pulsing for High Aspect Ratio Etch

System and Method for Plasma Process Uniformity Control

In-Situ Adsorbate Formation for Dielectric Etch

In-Situ Adsorbate Formation for Plasma Etch Process

High Aspect Ratio Contact (HARC) Etch

PLASMA ETCHING METHOD AND METHOD FOR MANUFACTURING SEMICONDUCTOR EL...

ETCHING METHOD AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

ETCHING METHOD AND SEMICONDUCTOR ELEMENT MANUFACTURING METHOD

PLASMA PROCESSING METHOD AND PLASMA PROCESSING SYSTEM

ETCHING METHOD AND PLASMA PROCESSING SYSTEM

PLASMA-BASED METHOD FOR DELAYERING OF CIRCUITS

METHOD OF TREATING SUBSTRATE AND APPARATUS FOR TREATING SUBSTRATE

APPARATUS AND METHOD FOR PROCESSING SUBSTRATE USING PLASMA

METHOD OF PROCESSING SUBSTRATE

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS