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H01L2924/01034
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ELECTRICITY
H01
Electric elements
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2924/00
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H01L2924/01034
Selenium [Se]
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Patents Grants
last 30 patents
Information
Patent Grant
Bonding wire for semiconductor devices
Patent number
12,166,006
Issue date
Dec 10, 2024
NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
Tomohiro Uno
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonding wire for semiconductor devices
Patent number
12,132,026
Issue date
Oct 29, 2024
NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
Tomohiro Uno
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Palladium-coated copper bonding wire and method for manufacturing same
Patent number
12,087,724
Issue date
Sep 10, 2024
Tanaka Denshi Kogyo K.K.
Hiroyuki Amano
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Palladium-coated copper bonding wire, wire bonding structure, semic...
Patent number
11,876,066
Issue date
Jan 16, 2024
TANAKA DENSHI KOGYO K.K.
Hiroyuki Amano
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonding wire for semiconductor device
Patent number
10,840,208
Issue date
Nov 17, 2020
NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
Tetsuya Oyamada
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Bonding wire for semiconductor device
Patent number
10,737,356
Issue date
Aug 11, 2020
Nippon Micrometal Corporation
Takashi Yamada
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Bonding wire for semiconductor device
Patent number
10,610,976
Issue date
Apr 7, 2020
Nippon Micrometal Corporation
Takashi Yamada
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Bonding wire for semiconductor device
Patent number
10,525,555
Issue date
Jan 7, 2020
Nippon Micrometal Corporation
Takashi Yamada
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Packaged semiconductor device having a shielding against electromag...
Patent number
10,455,692
Issue date
Oct 22, 2019
STMicroelectronics S.r.l.
Federico Giovanni Ziglioli
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for applying a bonding layer
Patent number
10,438,925
Issue date
Oct 8, 2019
EV Group E. Thallner GmbH
Markus Wimplinger
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Bonding wire for semiconductor device
Patent number
10,414,002
Issue date
Sep 17, 2019
Nippon Micrometal Corporation
Takashi Yamada
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Low temperature high reliability alloy for solder hierarchy
Patent number
10,322,471
Issue date
Jun 18, 2019
Alpha Assembly Solutions Inc.
Pritha Choudhury
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Bonding wire for semiconductor device
Patent number
10,137,534
Issue date
Nov 27, 2018
Nippon Micrometal Corporation
Takashi Yamada
C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information
Patent Grant
Method for applying a bonding layer
Patent number
9,627,349
Issue date
Apr 18, 2017
EV Group E. Thallner GmbH
Markus Wimplinger
B81 - MICRO-STRUCTURAL TECHNOLOGY
Patents Applications
last 30 patents
Information
Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
Publication number
20240297142
Publication date
Sep 5, 2024
NIPPON MICROMETAL CORPORATION
Daizo ODA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
Publication number
20240290743
Publication date
Aug 29, 2024
NIPPON MICROMETAL CORPORATION
Daizo ODA
G01 - MEASURING TESTING
Information
Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
Publication number
20240290745
Publication date
Aug 29, 2024
NIPPON MICROMETAL CORPORATION
Daizo ODA
G01 - MEASURING TESTING
Information
Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
Publication number
20240290744
Publication date
Aug 29, 2024
NIPPON MICROMETAL CORPORATION
Daizo ODA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
Publication number
20240266313
Publication date
Aug 8, 2024
NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
Tomohiro UNO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PHASE CHANGE INTERCONNECTS AND METHODS FOR FORMING THE SAME
Publication number
20230058704
Publication date
Feb 23, 2023
TOKYO ELECTRON LIMITED
Robert D. Clark
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICES
Publication number
20230018430
Publication date
Jan 19, 2023
NIPPON MICROMETAL CORPORATION
Daizo ODA
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
PALLADIUM-COATED COPPER BONDING WIRE, MANUFACTURING METHOD OF PALLA...
Publication number
20220005781
Publication date
Jan 6, 2022
TANAKA DENSHI KOGYO K.K.
Hiroyuki AMANO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PALLADIUM-COATED COPPER BONDING WIRE, WIRE BONDING STRUCTURE, SEMIC...
Publication number
20210366867
Publication date
Nov 25, 2021
TANAKA DENSHI KOGYO K.K.
Hiroyuki AMANO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PALLADIUM-COATED COPPER BONDING WIRE AND METHOD FOR MANUFACTURING SAME
Publication number
20210280553
Publication date
Sep 9, 2021
TANAKA DENSHI KOGYO K.K.
Hiroyuki AMANO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICES
Publication number
20200312808
Publication date
Oct 1, 2020
NIPPON MICROMETAL CORPORATION
Daizo ODA
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE
Publication number
20180133843
Publication date
May 17, 2018
NIPPON MICROMETAL CORPORATION
Takashi YAMADA
C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information
Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE
Publication number
20170365576
Publication date
Dec 21, 2017
NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
Tetsuya OYAMADA
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
PACKAGED SEMICONDUCTOR DEVICE HAVING A SHIELDING AGAINST ELECTROMAG...
Publication number
20170325329
Publication date
Nov 9, 2017
STMicroelectronics S.r.l.
Federico Giovanni Ziglioli
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE
Publication number
20170216974
Publication date
Aug 3, 2017
NIPPON MICROMETAL CORPORATION
Takashi YAMADA
C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information
Patent Application
METHOD FOR APPLYING A BONDING LAYER
Publication number
20160190092
Publication date
Jun 30, 2016
EV GROUP E. THALLNER GMBH
Markus WIMPLINGER
B81 - MICRO-STRUCTURAL TECHNOLOGY