Self-assembly processes

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CPC
H01L2224/02315

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/02315Self-assembly processes

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method
- Patent number 11,855,014
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 11,855,016
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device including electrical connections on an encapsulat...
- Patent number 11,676,928
- Issue date Jun 13, 2023
- STMicroelectronics (Grenoble 2) SAS
- Romain Coffy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polymer resin and compression mold chip scale package
- Patent number 11,508,679
- Issue date Nov 22, 2022
- Semiconductor Components Industries, LLC
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out structure and method of forming
- Patent number 11,276,656
- Issue date Mar 15, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 11,211,346
- Issue date Dec 28, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming contact holes in a fan out package
- Patent number 11,164,829
- Issue date Nov 2, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Feng-Cheng Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming contact holes in a fan out package
- Patent number 11,152,316
- Issue date Oct 19, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Feng-Cheng Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out interconnect structure and method for forming same
- Patent number 11,133,274
- Issue date Sep 28, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device including electrical connections on an encapsulat...
- Patent number 11,114,404
- Issue date Sep 7, 2021
- STMicroelectronics (Grenoble 2) SAS
- Romain Coffy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 10,867,941
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polymer resin and compression mold chip scale package
- Patent number 10,825,786
- Issue date Nov 3, 2020
- Semiconductor Components Industries, LLC
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System on package architecture including structures on die back side
- Patent number 10,777,538
- Issue date Sep 15, 2020
- Intel Corporation
- Fay Hua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out interconnect structure and method for forming same
- Patent number 10,700,025
- Issue date Jun 30, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out structure and method of forming
- Patent number 10,679,953
- Issue date Jun 9, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having a composite barrier layer
- Patent number 10,665,556
- Issue date May 26, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Yu Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming wafer level ground plane...
- Patent number 10,651,139
- Issue date May 12, 2020
- JCET Semiconductor (Shaoxing) Co., Ltd.
- Guruprasad G. Badakere
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging devices and methods of manufacture thereof
- Patent number 10,629,555
- Issue date Apr 21, 2020
- Taiwan Semiconductor Manufacturing Company
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices and corresponding device
- Patent number 10,483,220
- Issue date Nov 19, 2019
- STIMICROELECTRONICS S.R.L.
- Andrea Paleari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out structure and method of forming
- Patent number 10,366,959
- Issue date Jul 30, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 10,340,236
- Issue date Jul 2, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System on package architecture including structures on die back side
- Patent number 10,304,804
- Issue date May 28, 2019
- Intel Corporation
- Fay Hua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 10,297,560
- Issue date May 21, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polymer resin and compression mold chip scale package
- Patent number 10,283,466
- Issue date May 7, 2019
- Semiconductor Components Industries, LLC
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming redistribution layer
- Patent number 10,134,694
- Issue date Nov 20, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Fei Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating redistribution circuit structure
- Patent number 10,074,623
- Issue date Sep 11, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tzung-Hui Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture thereof
- Patent number 10,043,768
- Issue date Aug 7, 2018
- Infineon Technologies AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming contact holes in a fan out package
- Patent number 9,947,629
- Issue date Apr 17, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Feng-Cheng Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package, redistribution circuit structure, and m...
- Patent number 9,899,342
- Issue date Feb 20, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tzung-Hui Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 9,871,009
- Issue date Jan 16, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE INCLUDING ELECTRICAL CONNECTIONS ON AN ENCAPSULAT...
- Publication number 20210366865
- Publication date Nov 25, 2021
- STMicroelectronics (Grenoble 2) SAS
- Romain COFFY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE INCLUDING ELECTRICAL CONNECTIONS ON AN ENCAPSULAT...
- Publication number 20200194397
- Publication date Jun 18, 2020
- STMicroelectronics (Grenoble 2) SAS
- Romain COFFY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Manufacture
- Publication number 20190326236
- Publication date Oct 24, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method
- Publication number 20190273055
- Publication date Sep 5, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLYMER RESIN AND COMPRESSION MOLD CHIP SCALE PACKAGE
- Publication number 20190221532
- Publication date Jul 18, 2019
- Semiconductor Components Industries, LLC
- Yusheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming Contact Holes in a Fan Out Package
- Publication number 20180240764
- Publication date Aug 23, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Feng-Cheng Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method
- Publication number 20180158789
- Publication date Jun 7, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING REDISTRIBUTION CIRCUIT STRUCTURE
- Publication number 20180151521
- Publication date May 31, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tzung-Hui Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY PACKAGE ON PACKAGE DEVICES CREATED THROUGH A SELF ASSE...
- Publication number 20180096975
- Publication date Apr 5, 2018
- Intel Corporation
- Fay Hua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Manufacture
- Publication number 20180090457
- Publication date Mar 29, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20180068963
- Publication date Mar 8, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Yu WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Fan-Out Structure and Method of Forming
- Publication number 20180026001
- Publication date Jan 25, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20180005967
- Publication date Jan 4, 2018
- RENESAS ELECTRONICS CORPORATION
- Akira YAJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method
- Publication number 20170365564
- Publication date Dec 21, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLYMER RESIN AND COMPRESSION MOLD CHIP SCALE PACKAGE
- Publication number 20170345779
- Publication date Nov 30, 2017
- Semiconductor Components Industries, LLC
- Yusheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED FAN-OUT PACKAGE, REDISTRIBUTION CIRCUIT STRUCTURE, AND M...
- Publication number 20170271283
- Publication date Sep 21, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tzung-Hui Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Manufacture
- Publication number 20170250147
- Publication date Aug 31, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING DEVICE
- Publication number 20170221840
- Publication date Aug 3, 2017
- STMicroelectronics S.r.l.
- Andrea Paleari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20170162519
- Publication date Jun 8, 2017
- Amkor Technology, Inc.
- Yeong Beom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Fan-Out Structure and Method of Forming
- Publication number 20170141053
- Publication date May 18, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
- Publication number 20170062362
- Publication date Mar 2, 2017
- RENESAS ELECTRONICS CORPORATION
- Hiroaki SEKIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20170062361
- Publication date Mar 2, 2017
- RENESAS ELECTRONICS CORPORATION
- Akira YAJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20170040267
- Publication date Feb 9, 2017
- RENESAS ELECTRONICS CORPORATION
- Akira YAJlMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT PACKAGES AND METHODS OF FORMING SAME
- Publication number 20170033063
- Publication date Feb 2, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging Devices and Methods of Manufacture Thereof
- Publication number 20170033064
- Publication date Feb 2, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Manufacture Thereof
- Publication number 20160379945
- Publication date Dec 29, 2016
- INFINEON TECHNOLOGIES AG
- Thorston MEYER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20160351511
- Publication date Dec 1, 2016
- J-DEVICES CORPORATION
- Kiyoaki HASHIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PRODUCING A SEMICONDUCTOR DEVICE WITH PROTRUDING CONTACTS
- Publication number 20160351515
- Publication date Dec 1, 2016
- ams AG
- Jochen Kraft
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH COMPOSITE BARRIER LAYER UNDER REDISTRI...
- Publication number 20160322316
- Publication date Nov 3, 2016
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Yu WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Wafer Level Ground Plane...
- Publication number 20160293558
- Publication date Oct 6, 2016
- STATS ChipPAC Pte Ltd.
- Guruprasad G. Badakere
- H01 - BASIC ELECTRIC ELEMENTS

Self-assembly processes

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and method

Semiconductor device and method of manufacture

Electronic device including electrical connections on an encapsulat...

Polymer resin and compression mold chip scale package

Integrated fan-out structure and method of forming

Semiconductor device and method of manufacture

Method of forming contact holes in a fan out package

Method of forming contact holes in a fan out package

Fan-out interconnect structure and method for forming same

Electronic device including electrical connections on an encapsulat...

Semiconductor device and method

Polymer resin and compression mold chip scale package

System on package architecture including structures on die back side

Fan-out interconnect structure and method for forming same

Integrated fan-out structure and method of forming

Semiconductor structure having a composite barrier layer

Semiconductor device and method of forming wafer level ground plane...

Packaging devices and methods of manufacture thereof

Method of manufacturing semiconductor devices and corresponding device

Integrated fan-out structure and method of forming

Semiconductor device and method of manufacture

System on package architecture including structures on die back side

Semiconductor device and method

Polymer resin and compression mold chip scale package

Method of forming redistribution layer

Method of fabricating redistribution circuit structure

Semiconductor device and method of manufacture thereof

Method of forming contact holes in a fan out package

Integrated fan-out package, redistribution circuit structure, and m...

Semiconductor device and method

Patents Applicationslast 30 patents

ELECTRONIC DEVICE INCLUDING ELECTRICAL CONNECTIONS ON AN ENCAPSULAT...

ELECTRONIC DEVICE INCLUDING ELECTRICAL CONNECTIONS ON AN ENCAPSULAT...

Semiconductor Device and Method of Manufacture

Semiconductor Device and Method

POLYMER RESIN AND COMPRESSION MOLD CHIP SCALE PACKAGE

Method of Forming Contact Holes in a Fan Out Package

Semiconductor Device and Method

METHOD OF FABRICATING REDISTRIBUTION CIRCUIT STRUCTURE

HIGH DENSITY PACKAGE ON PACKAGE DEVICES CREATED THROUGH A SELF ASSE...

Semiconductor Device and Method of Manufacture

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

Integrated Fan-Out Structure and Method of Forming

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

Semiconductor Device and Method

POLYMER RESIN AND COMPRESSION MOLD CHIP SCALE PACKAGE

INTEGRATED FAN-OUT PACKAGE, REDISTRIBUTION CIRCUIT STRUCTURE, AND M...

Semiconductor Device and Method of Manufacture

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Integrated Fan-Out Structure and Method of Forming

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

FAN-OUT PACKAGES AND METHODS OF FORMING SAME

Packaging Devices and Methods of Manufacture Thereof

Semiconductor Device and Method of Manufacture Thereof

SEMICONDUCTOR PACKAGE

METHOD OF PRODUCING A SEMICONDUCTOR DEVICE WITH PROTRUDING CONTACTS

SEMICONDUCTOR STRUCTURE WITH COMPOSITE BARRIER LAYER UNDER REDISTRI...

Semiconductor Device and Method of Forming Wafer Level Ground Plane...