Semiconductor material

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/298Semiconductor material

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Interconnect structures
- Patent number 12,125,784
- Issue date Oct 22, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures
- Patent number 11,756,880
- Issue date Sep 12, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for manufacturing flexible electronics
- Patent number 11,688,640
- Issue date Jun 27, 2023
- Next Biometrics Group ASA
- Tian Xiao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor chip package with spring biased lid
- Patent number 11,631,624
- Issue date Apr 18, 2023
- Advanced Micro Devices, Inc.
- Kaushik Mysore Srinivasa Setty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for encapsulating a microelectronic device, comprising a ste...
- Patent number 11,254,567
- Issue date Feb 22, 2022
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Messaoud Bedjaoui
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package with floating heat spreader and process for m...
- Patent number 11,244,884
- Issue date Feb 8, 2022
- Qorvo US, Inc.
- Robert Charles Dry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures
- Patent number 11,158,573
- Issue date Oct 26, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device for use in harsh media
- Patent number 11,049,784
- Issue date Jun 29, 2021
- Melexis Technologies NV
- Appolonius Jacobus Van Der Wiel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Germanium transistor structure with underlap tip to reduce gate ind...
- Patent number 11,031,499
- Issue date Jun 8, 2021
- Intel Corporation
- Willy Rachmady
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure
- Patent number 11,011,444
- Issue date May 18, 2021
- Advanced Semiconductor Engineering, Inc.
- Ya-Yu Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Castellated superjunction transistors
- Patent number 10,985,243
- Issue date Apr 20, 2021
- Northrop Grumman Systems Corporation
- Josephine Bea Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management in integrated circuit using phononic bandgap str...
- Patent number 10,886,187
- Issue date Jan 5, 2021
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- G10 - MUSICAL INSTRUMENTS ACOUSTICS
Information Patent Grant
Internally-shielded microelectronic packages and methods for the fa...
- Patent number 10,861,774
- Issue date Dec 8, 2020
- NXP USA, INC.
- Audel Sanchez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Castellated superjunction transistors
- Patent number 10,784,341
- Issue date Sep 22, 2020
- NORTHROP GRUMNIAN SYSTEMS CORPORATION
- Josephine Bea Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with floating heat spreader and process for m...
- Patent number 10,734,301
- Issue date Aug 4, 2020
- Qorvo US, Inc.
- Robert Charles Dry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lateral bipolar junction transistor with abrupt junction and compou...
- Patent number 10,727,299
- Issue date Jul 28, 2020
- ELPIS TECHNOLOGIES INC.
- Kevin K. Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Internally-shielded microelectronic packages and methods for the fa...
- Patent number 10,629,518
- Issue date Apr 21, 2020
- NXP USA, INC.
- Audel Sanchez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for processing semiconductor dice and fabricating assemblie...
- Patent number 10,559,495
- Issue date Feb 11, 2020
- Micron Technology, Inc.
- Andrew M. Bayless
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lateral bipolar junction transistor with abrupt junction and compou...
- Patent number 10,396,154
- Issue date Aug 27, 2019
- International Business Machines Corporation
- Kevin K. Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component, method for processing a substrate and meth...
- Patent number 10,361,096
- Issue date Jul 23, 2019
- Infineon Technologies AG
- Mathias Plappert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a multilayer structure for reducing defects in se...
- Patent number 10,242,929
- Issue date Mar 26, 2019
- Semiconductor Components Industries, LLC
- David Lysacek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface passivation having reduced interface defect density
- Patent number 10,177,062
- Issue date Jan 8, 2019
- International Business Machines Corporation
- Joel P. de Souza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface passivation having reduced interface defect density
- Patent number 10,170,388
- Issue date Jan 1, 2019
- International Business Machines Corporation
- Joel P. de Souza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for processing semiconductor dice and fabricating assemblie...
- Patent number 10,163,693
- Issue date Dec 25, 2018
- Micron Technology, Inc.
- Andrew M. Bayless
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lateral bipolar junction transistor with abrupt junction and compou...
- Patent number 10,141,405
- Issue date Nov 27, 2018
- International Business Machines Corporation
- Kevin K. Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sealing cap for electronic component
- Patent number 10,103,077
- Issue date Oct 16, 2018
- Tanaka Kikinzoku Kogyo K.K.
- Sadatoshi Sonoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
P-type transparent conducting nickel oxide alloys
- Patent number 10,079,189
- Issue date Sep 18, 2018
- The Trustees of Princeton University
- Emily Ann Carter
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Selective etching of amorphous silicon over epitaxial silicon
- Patent number 9,991,129
- Issue date Jun 5, 2018
- Applied Materials, Inc.
- Geetika Bajaj
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective and conformal passivation layer for 3D high-mobility chan...
- Patent number 9,984,940
- Issue date May 29, 2018
- International Business Machines Corporation
- Jack O. Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface passivation having reduced interface defect density
- Patent number 9,984,949
- Issue date May 29, 2018
- International Business Machines Corporation
- Joel P. de Souza
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING STRESS CONTROL LAYER AND METHODS OF...
- Publication number 20240413034
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chieh-Lung Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES
- Publication number 20240379539
- Publication date Nov 14, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATED STRUCTURE AND SEMICONDUCTOR ELEMENT
- Publication number 20240312854
- Publication date Sep 19, 2024
- FLOSFIA INC.
- Hiroyuki ANDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION IN SEMICONDUCTOR DEVICES
- Publication number 20240274485
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Che Chi Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240128178
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hung LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORROSION REDUCTION AT LIQUID METAL/METAL INTERFACES BY SELECTIVE I...
- Publication number 20240120246
- Publication date Apr 11, 2024
- Meta Platforms Technologies, LLC
- Omar Awartani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MESA DEVICE WITH STACK THIN FILM PASSIVATION
- Publication number 20240055312
- Publication date Feb 15, 2024
- Littelfuse Semiconductor (Wuxi) Co., Ltd
- Glenda Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES
- Publication number 20240047344
- Publication date Feb 8, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF DIAMOND COMPOSITE WAFER
- Publication number 20240047297
- Publication date Feb 8, 2024
- nD-HI Technologies Lab, Inc.
- Ho-Ming TONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stress-Reduced Silicon Photonics Semiconductor Wafer
- Publication number 20230369242
- Publication date Nov 16, 2023
- Newport Fab, LLC dba Tower Semiconductor Newport Beach
- Oleg Martynov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Module with Liquid Dielectric Encapsulant
- Publication number 20230360989
- Publication date Nov 9, 2023
- INFINEON TECHNOLOGIES AG
- Georg Troska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH ADAPTIVE MULTI-LAYER ENCAPSULATION...
- Publication number 20230197543
- Publication date Jun 22, 2023
- Intel Corporation
- Liang He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device
- Publication number 20230178654
- Publication date Jun 8, 2023
- SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- Shunpei Yamazaki
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE ASSEMBLY AND METHOD OF MANUFACTURING
- Publication number 20230137612
- Publication date May 4, 2023
- NEXPERIA B.V.
- Randolph Estal Flauta
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...
- Publication number 20230005803
- Publication date Jan 5, 2023
- STMicroelectronics S.r.l
- Giovanni GRAZIOSI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MASK ENCAPSULATION TO PREVENT DEGRADATION DURING FABRICATION OF HIG...
- Publication number 20220406610
- Publication date Dec 22, 2022
- LAM RESEARCH CORPORATION
- Kapu Sirish REDDY
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING A SEMICONDUCTOR P...
- Publication number 20220102253
- Publication date Mar 31, 2022
- Infineon Technologies Austria AG
- Thomas Beer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES
- Publication number 20220013456
- Publication date Jan 13, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Cyprian Emeka UZOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR TEMPERATURE MODIFICATION IN BONDING STACK...
- Publication number 20210296192
- Publication date Sep 23, 2021
- Micron Technology, Inc.
- Andrew M. Bayless
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20210272866
- Publication date Sep 2, 2021
- Advanced Semiconductor Engineering, Inc.
- Ya-Yu HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal Management in Integrated Circuit Using Phononic Bandgap Str...
- Publication number 20210151357
- Publication date May 20, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISLOCATION GLIDE SUPPRESSION FOR MISFIT DISLOCATION FREE HETEROEPI...
- Publication number 20210111087
- Publication date Apr 15, 2021
- The Regents of the University of California
- John Bowers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR ENCAPSULATING A MICROELECTRONIC DEVICE, COMPRISING A STE...
- Publication number 20210047177
- Publication date Feb 18, 2021
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Messaoud BEDJAOUI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
FAN-OUT SEMICONDUCTOR PACKAGE STRUCTURE AND PACKAGING METHOD THEREOF
- Publication number 20210050275
- Publication date Feb 18, 2021
- Powertech Technology Inc.
- Shang-Yu CHANG-CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20210050273
- Publication date Feb 18, 2021
- Advanced Semiconductor Engineering, Inc.
- Ya-Yu HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CASTELLATED SUPERJUNCTION TRANSISTORS
- Publication number 20200373384
- Publication date Nov 26, 2020
- Northrop Grumman Systems Corporation
- JOSEPHINE BEA CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH FLOATING HEAT SPREADER AND PROCESS FOR M...
- Publication number 20200343157
- Publication date Oct 29, 2020
- Qorvo US, Inc.
- Robert Charles Dry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CASTELLATED SUPERJUNCTION TRANSISTORS
- Publication number 20200235202
- Publication date Jul 23, 2020
- Northrop Grumman Systems Corporation
- JOSEPHINE BEA CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERNALLY-SHIELDED MICROELECTRONIC PACKAGES AND METHODS FOR THE FA...
- Publication number 20200211932
- Publication date Jul 2, 2020
- NXP USA, Inc.
- AUDEL SANCHEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP PACKAGE WITH SPRING BIASED LID
- Publication number 20200185294
- Publication date Jun 11, 2020
- ADVANCED MICRO DEVICES, INC.
- Kaushik Mysore Srinivasa Setty
- H01 - BASIC ELECTRIC ELEMENTS

Semiconductor material

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Interconnect structures

Interconnect structures

Systems and methods for manufacturing flexible electronics

Semiconductor chip package with spring biased lid

Method for encapsulating a microelectronic device, comprising a ste...

Semiconductor package with floating heat spreader and process for m...

Interconnect structures

Semiconductor device for use in harsh media

Germanium transistor structure with underlap tip to reduce gate ind...

Semiconductor package structure

Castellated superjunction transistors

Thermal management in integrated circuit using phononic bandgap str...

Internally-shielded microelectronic packages and methods for the fa...

Castellated superjunction transistors

Semiconductor package with floating heat spreader and process for m...

Lateral bipolar junction transistor with abrupt junction and compou...

Internally-shielded microelectronic packages and methods for the fa...

Methods for processing semiconductor dice and fabricating assemblie...

Lateral bipolar junction transistor with abrupt junction and compou...

Semiconductor component, method for processing a substrate and meth...

Method of forming a multilayer structure for reducing defects in se...

Surface passivation having reduced interface defect density

Surface passivation having reduced interface defect density

Methods for processing semiconductor dice and fabricating assemblie...

Lateral bipolar junction transistor with abrupt junction and compou...

Sealing cap for electronic component

P-type transparent conducting nickel oxide alloys

Selective etching of amorphous silicon over epitaxial silicon

Selective and conformal passivation layer for 3D high-mobility chan...

Surface passivation having reduced interface defect density

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE INCLUDING STRESS CONTROL LAYER AND METHODS OF...

INTERCONNECT STRUCTURES

LAMINATED STRUCTURE AND SEMICONDUCTOR ELEMENT

HEAT DISSIPATION IN SEMICONDUCTOR DEVICES

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

CORROSION REDUCTION AT LIQUID METAL/METAL INTERFACES BY SELECTIVE I...

MESA DEVICE WITH STACK THIN FILM PASSIVATION

INTERCONNECT STRUCTURES

MANUFACTURING METHOD OF DIAMOND COMPOSITE WAFER

Stress-Reduced Silicon Photonics Semiconductor Wafer

Semiconductor Module with Liquid Dielectric Encapsulant

MICROELECTRONIC ASSEMBLIES WITH ADAPTIVE MULTI-LAYER ENCAPSULATION...

Semiconductor Device

SEMICONDUCTOR PACKAGE ASSEMBLY AND METHOD OF MANUFACTURING

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...

MASK ENCAPSULATION TO PREVENT DEGRADATION DURING FABRICATION OF HIG...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING A SEMICONDUCTOR P...

INTERCONNECT STRUCTURES

METHODS AND APPARATUS FOR TEMPERATURE MODIFICATION IN BONDING STACK...

SEMICONDUCTOR PACKAGE STRUCTURE

Thermal Management in Integrated Circuit Using Phononic Bandgap Str...

DISLOCATION GLIDE SUPPRESSION FOR MISFIT DISLOCATION FREE HETEROEPI...

METHOD FOR ENCAPSULATING A MICROELECTRONIC DEVICE, COMPRISING A STE...

FAN-OUT SEMICONDUCTOR PACKAGE STRUCTURE AND PACKAGING METHOD THEREOF

SEMICONDUCTOR PACKAGE STRUCTURE

CASTELLATED SUPERJUNCTION TRANSISTORS

SEMICONDUCTOR PACKAGE WITH FLOATING HEAT SPREADER AND PROCESS FOR M...

CASTELLATED SUPERJUNCTION TRANSISTORS

INTERNALLY-SHIELDED MICROELECTRONIC PACKAGES AND METHODS FOR THE FA...

SEMICONDUCTOR CHIP PACKAGE WITH SPRING BIASED LID