Semiconductor wafers

Industry

CPC
G01N21/9501

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Parent Industries

GPHYSICS G01Measuring instruments G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES G01N21/00Investigating or analysing materials by the use of optical means

Current Industry

G01N21/9501Semiconductor wafers

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Detection apparatus, detection method, exposure apparatus, exposure...
- Patent number 12,241,846
- Issue date Mar 4, 2025
- Canon Kabushiki Kaisha
- Kazuya Kijima
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wafer metrology technologies
- Patent number 12,241,924
- Issue date Mar 4, 2025
- FemtoMetrix, Inc.
- Viktor Koldiaev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and setup for detecting surface haze of materials
- Patent number 12,241,845
- Issue date Mar 4, 2025
- Beijing Tongmei Xtal Technology Co., Ltd.
- Wei Gao
- G01 - MEASURING TESTING
Information Patent Grant
Method for defect inspection, system, and computer-readable medium
- Patent number 12,235,223
- Issue date Feb 25, 2025
- HITACHI HIGH-TECH CORPORATION
- Takanori Kondo
- G01 - MEASURING TESTING
Information Patent Grant
Wafer storage devices configured to measure physical properties of...
- Patent number 12,237,189
- Issue date Feb 25, 2025
- Micron Technology, Inc.
- Nagasubramaniyan Chandrasekaran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pupil ellipsometry measurement apparatus and method and method of f...
- Patent number 12,228,499
- Issue date Feb 18, 2025
- Samsung Electronics Co., Ltd.
- Jaehwang Jung
- G01 - MEASURING TESTING
Information Patent Grant
Inspection substrate
- Patent number 12,220,839
- Issue date Feb 11, 2025
- Disco Corporation
- Yoshikatsu Soejima
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method and device for detecting placement of wafers in wafer cassette
- Patent number 12,217,988
- Issue date Feb 4, 2025
- Hon Hai Precision Industry Co., Ltd.
- Yu-Ting Chou
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
ULED chip, uLED substrate and method for manufacturing the same, el...
- Patent number 12,218,273
- Issue date Feb 4, 2025
- BOE Technology Group Co., Ltd.
- Yuju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-contact apparatus for measuring wafer thickness
- Patent number 12,209,853
- Issue date Jan 28, 2025
- Fujikoshi Machinery Corp.
- Chihiro Miyagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Edge defect detection via image analytics
- Patent number 12,211,195
- Issue date Jan 28, 2025
- Applied Materials, Inc.
- Yash Chhabra
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Measurement system and measurement method
- Patent number 12,203,870
- Issue date Jan 21, 2025
- Skyverse Technology Co., Ltd.
- Lu Chen
- G01 - MEASURING TESTING
Information Patent Grant
Process tool for analyzing bonded workpiece interface
- Patent number 12,205,855
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hau-Yi Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ingot evaluation method and detecting apparatus
- Patent number 12,203,871
- Issue date Jan 21, 2025
- GlobalWafers Co., Ltd.
- Hsiu Chi Liang
- G01 - MEASURING TESTING
Information Patent Grant
Pattern inspection device and pattern inspection method
- Patent number 12,205,272
- Issue date Jan 21, 2025
- NuFlare Technology, Inc.
- Hiromu Inoue
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for inspecting pattern defects
- Patent number 12,196,687
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ju-Ying Chen
- G01 - MEASURING TESTING
Information Patent Grant
Inspection apparatus and method of inspecting wafer
- Patent number 12,196,669
- Issue date Jan 14, 2025
- Samsung Electronics Co., Ltd.
- Martin Priwisch
- G01 - MEASURING TESTING
Information Patent Grant
Defect inspection apparatus and defect inspection method
- Patent number 12,196,673
- Issue date Jan 14, 2025
- HITACHI HIGH-TECH CORPORATION
- Takeru Utsugi
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus for efficient high harmonic generation
- Patent number 12,196,688
- Issue date Jan 14, 2025
- ASML Netherlands B.V.
- Petrus Wilhelmus Smorenburg
- G01 - MEASURING TESTING
Information Patent Grant
System and method for determining post bonding overlay
- Patent number 12,197,137
- Issue date Jan 14, 2025
- KLA Corporation
- Franz Zach
- G01 - MEASURING TESTING
Information Patent Grant
Method and system of surface topography measurement for lithography
- Patent number 12,189,306
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yung-Yao Lee
- G01 - MEASURING TESTING
Information Patent Grant
Method of calibrating coordinate position identification accuracy o...
- Patent number 12,188,880
- Issue date Jan 7, 2025
- Sumco Corporation
- Keiichiro Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inspecting apparatus
- Patent number 12,181,691
- Issue date Dec 31, 2024
- Disco Corporation
- Nobuyuki Kimura
- G01 - MEASURING TESTING
Information Patent Grant
Photoresist characteristics analysis method and characteristics ana...
- Patent number 12,174,113
- Issue date Dec 24, 2024
- FEMTO DEPLOYMENTS INC.
- Akira Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High resolution multispectral multi-field-of-view imaging system fo...
- Patent number 12,174,128
- Issue date Dec 24, 2024
- Onto Innovation Inc.
- John A Tejada
- G01 - MEASURING TESTING
Information Patent Grant
Mapping device and a loadport having the same
- Patent number 12,174,127
- Issue date Dec 24, 2024
- Hiwin Technologies Corp.
- Jonus Liu
- G01 - MEASURING TESTING
Information Patent Grant
IC fabrication flow with dynamic sampling for measurement
- Patent number 12,169,178
- Issue date Dec 17, 2024
- Texas Instruments Incorporated
- Jonas Hoehenberger
- G01 - MEASURING TESTING
Information Patent Grant
Optical diagnostics of semiconductor process using hyperspectral im...
- Patent number 12,165,937
- Issue date Dec 10, 2024
- Tokyo Electron Limited
- Yan Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Metrology method and apparatus for of determining a complex-valued...
- Patent number 12,164,233
- Issue date Dec 10, 2024
- ASML Netherlands B.V.
- Alexander Prasetya Konijnenberg
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Coded LED or other light for target imaging or analysis
- Patent number 12,165,372
- Issue date Dec 10, 2024
- Emcode Photonics LLC
- Shrenik Deliwala
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
Testing Apparatus and Testing Method
- Publication number 20250076215
- Publication date Mar 6, 2025
- TOKYO ELECTRON LIMITED
- Hiroyuki NAKAYAMA
- G01 - MEASURING TESTING
Information Patent Application
MULTIDIRECTIONAL ILLUMINATION FOR HYBRID BONDING DEFECT DETECTION
- Publication number 20250076212
- Publication date Mar 6, 2025
- Applied Materials, Inc.
- Venkatakaushik VOLETI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR ENHANCED INSPECTION OF SURFACES WITH SPECULAR...
- Publication number 20250076183
- Publication date Mar 6, 2025
- ORBOTECH LTD.
- Haim Chayet
- G01 - MEASURING TESTING
Information Patent Application
FOREIGN SUBSTANCE INSPECTION METHOD, FOREIGN SUBSTANCE INSPECTION A...
- Publication number 20250076213
- Publication date Mar 6, 2025
- Canon Kabushiki Kaisha
- TOSHIKI ITO
- G01 - MEASURING TESTING
Information Patent Application
SPECTRAL ANGULAR METROLOGY
- Publication number 20250076208
- Publication date Mar 6, 2025
- KLA Corporation
- Amnon Manassen
- G01 - MEASURING TESTING
Information Patent Application
METHOD OF INSPECTING A MARK ENGRAVED ON A SEMICONDUCTOR PACKAGE
- Publication number 20250078249
- Publication date Mar 6, 2025
- SAMSUNG ELECTRONICS CO., LTD.
- Minwoo JEON
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ILLUMINATION LIGHT SOURCE AND SUBSTRATE INSPECTION APPARATUS INCLUD...
- Publication number 20250067680
- Publication date Feb 27, 2025
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Dong Hoon SONG
- G01 - MEASURING TESTING
Information Patent Application
DETERMINATION METHOD AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20250067664
- Publication date Feb 27, 2025
- TOKYO ELECTRON LIMITED
- Hirokazu UEDA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM AND METHOD FOR DETERMINING PARAMETERS OF PATTERNED STRUCTURE...
- Publication number 20250067683
- Publication date Feb 27, 2025
- NOVA LTD
- Amir Shayari
- G01 - MEASURING TESTING
Information Patent Application
SYSTEM AND METHOD FOR DURATION-BASED SAMPLE PATH ADJUSTMENT
- Publication number 20250060317
- Publication date Feb 20, 2025
- KLA Corporation
- Arthur Kalman
- G01 - MEASURING TESTING
Information Patent Application
HYBRID X-RAY AND OPTICAL METROLOGY AND NAVIGATION
- Publication number 20250060324
- Publication date Feb 20, 2025
- TOKYO ELECTRON LIMITED
- Francisco Machuca
- G01 - MEASURING TESTING
Information Patent Application
OPTICAL MEASUREMENT APPARATUS AND OPTICAL MEASUREMENT METHOD
- Publication number 20250052667
- Publication date Feb 13, 2025
- SAMSUNG ELECTRONICS CO., LTD.
- Jooyoun KANG
- G01 - MEASURING TESTING
Information Patent Application
DUAL LENS INSPECTION DEVICE
- Publication number 20250052690
- Publication date Feb 13, 2025
- SUN YANG OPTICS DEVELOPMENT CO., LTD.
- SHENG CHE WU
- G01 - MEASURING TESTING
Information Patent Application
INSPECTION APPARATUS, LINEARLY MOVABLE BEAM DISPLACER, AND METHOD
- Publication number 20250044236
- Publication date Feb 6, 2025
- ASML NETHERLANDS B.V.
- Douglas C. CAPPELLI
- G01 - MEASURING TESTING
Information Patent Application
THIN FILM THICKNESS ADJUSTMENTS FOR THREE-DIMENSIONAL INTERFEROMETR...
- Publication number 20250044073
- Publication date Feb 6, 2025
- ORBOTECH LTD.
- Yulia Lovsky
- G01 - MEASURING TESTING
Information Patent Application
Surface Inspection Device
- Publication number 20250044240
- Publication date Feb 6, 2025
- Hitachi High-Tech Corporation
- Ayumi TOMIYAMA
- G01 - MEASURING TESTING
Information Patent Application
EDGE DEFECT DETECTION VIA IMAGE ANALYTICS
- Publication number 20250045900
- Publication date Feb 6, 2025
- Applied Materials, Inc.
- Yash Chhabra
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SYSTEMS AND METHODS FOR INSPECTING A SUBSTRATE
- Publication number 20250027887
- Publication date Jan 23, 2025
- Applied Materials, Inc.
- Srikanth V. Racherla
- G01 - MEASURING TESTING
Information Patent Application
DEVICE OF INSPECTING DEFECTS OF WAFER DICED OR ALIGNED
- Publication number 20250027885
- Publication date Jan 23, 2025
- YAYATECH CO., LTD.
- Chien-Cheng CHEN
- G01 - MEASURING TESTING
Information Patent Application
DEFECT INSPECTION METHOD AND DEFECT INSPECTION SYSTEM
- Publication number 20250027886
- Publication date Jan 23, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- SHAO-CHIEN CHIU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DEEP LEARNING BASED MODE SELECTION FOR INSPECTION
- Publication number 20250020598
- Publication date Jan 16, 2025
- KLA Corporation
- Rajkumar Theagarajan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD OF OPTIMIZING OVERLAY MEASUREMENT CONDITION AND OVERLAY MEAS...
- Publication number 20250012736
- Publication date Jan 9, 2025
- Samsung Electronics Co., Ltd.
- Dohun Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Multiple Pass Optical Measurements Of Semiconductor Structures
- Publication number 20250012734
- Publication date Jan 9, 2025
- KLA Corporation
- Zhengquan Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL METROLOGY WITH INFLUENCE MAP OF UNKNOWN SECTION
- Publication number 20250012737
- Publication date Jan 9, 2025
- ONTO INNOVATION INC.
- Yiliang LIU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PHOTO RESPONSE NON-UNIFORMITY CORRECTION DURING SEMICONDUCTOR INSPE...
- Publication number 20250003888
- Publication date Jan 2, 2025
- Onto Innovation Inc.
- John M. Thornell
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HYBRID METROLOGY METHOD AND SYSTEM
- Publication number 20250003882
- Publication date Jan 2, 2025
- NOVA LTD
- GILAD BARAK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MONITORING INFLUENCE OF DEFECTS IN FEW-LAYER TWO-DIMENSI...
- Publication number 20250003893
- Publication date Jan 2, 2025
- Tsinghua University
- Dameng Liu
- G01 - MEASURING TESTING
Information Patent Application
FOCUS-LESS INSPECTION APPARATUS AND METHOD
- Publication number 20240426766
- Publication date Dec 26, 2024
- KOH YOUNG TECHNOLOGY INC.
- Chan Kwon LEE
- G01 - MEASURING TESTING
Information Patent Application
COMBINATION OF MULTIWAVELENGTH RAMAN AND SPECTROSCOPIC ELLIPSOMETRY...
- Publication number 20240418633
- Publication date Dec 19, 2024
- KLA Corporation
- Shova Subedi
- G01 - MEASURING TESTING
Information Patent Application
OVERLAY MEASUREMENT APPARATUS AND OVERLAY MEASUREMENT METHOD
- Publication number 20240410835
- Publication date Dec 12, 2024
- AUROS Technology, Inc.
- Seong Yun CHOI
- G01 - MEASURING TESTING

Semiconductor wafers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Detection apparatus, detection method, exposure apparatus, exposure...

Wafer metrology technologies

Method and setup for detecting surface haze of materials

Method for defect inspection, system, and computer-readable medium

Wafer storage devices configured to measure physical properties of...

Pupil ellipsometry measurement apparatus and method and method of f...

Inspection substrate

Method and device for detecting placement of wafers in wafer cassette

ULED chip, uLED substrate and method for manufacturing the same, el...

Non-contact apparatus for measuring wafer thickness

Edge defect detection via image analytics

Measurement system and measurement method

Process tool for analyzing bonded workpiece interface

Ingot evaluation method and detecting apparatus

Pattern inspection device and pattern inspection method

Method for inspecting pattern defects

Inspection apparatus and method of inspecting wafer

Defect inspection apparatus and defect inspection method

Method and apparatus for efficient high harmonic generation

System and method for determining post bonding overlay

Method and system of surface topography measurement for lithography

Method of calibrating coordinate position identification accuracy o...

Inspecting apparatus

Photoresist characteristics analysis method and characteristics ana...

High resolution multispectral multi-field-of-view imaging system fo...

Mapping device and a loadport having the same

IC fabrication flow with dynamic sampling for measurement

Optical diagnostics of semiconductor process using hyperspectral im...

Metrology method and apparatus for of determining a complex-valued...

Coded LED or other light for target imaging or analysis

Patents Applicationslast 30 patents

Testing Apparatus and Testing Method

MULTIDIRECTIONAL ILLUMINATION FOR HYBRID BONDING DEFECT DETECTION

SYSTEM AND METHOD FOR ENHANCED INSPECTION OF SURFACES WITH SPECULAR...

FOREIGN SUBSTANCE INSPECTION METHOD, FOREIGN SUBSTANCE INSPECTION A...

SPECTRAL ANGULAR METROLOGY

METHOD OF INSPECTING A MARK ENGRAVED ON A SEMICONDUCTOR PACKAGE

ILLUMINATION LIGHT SOURCE AND SUBSTRATE INSPECTION APPARATUS INCLUD...

DETERMINATION METHOD AND SUBSTRATE PROCESSING APPARATUS

SYSTEM AND METHOD FOR DETERMINING PARAMETERS OF PATTERNED STRUCTURE...

SYSTEM AND METHOD FOR DURATION-BASED SAMPLE PATH ADJUSTMENT

HYBRID X-RAY AND OPTICAL METROLOGY AND NAVIGATION

OPTICAL MEASUREMENT APPARATUS AND OPTICAL MEASUREMENT METHOD

DUAL LENS INSPECTION DEVICE

INSPECTION APPARATUS, LINEARLY MOVABLE BEAM DISPLACER, AND METHOD

THIN FILM THICKNESS ADJUSTMENTS FOR THREE-DIMENSIONAL INTERFEROMETR...

Surface Inspection Device

EDGE DEFECT DETECTION VIA IMAGE ANALYTICS

SYSTEMS AND METHODS FOR INSPECTING A SUBSTRATE

DEVICE OF INSPECTING DEFECTS OF WAFER DICED OR ALIGNED

DEFECT INSPECTION METHOD AND DEFECT INSPECTION SYSTEM

DEEP LEARNING BASED MODE SELECTION FOR INSPECTION

METHOD OF OPTIMIZING OVERLAY MEASUREMENT CONDITION AND OVERLAY MEAS...

Multiple Pass Optical Measurements Of Semiconductor Structures

OPTICAL METROLOGY WITH INFLUENCE MAP OF UNKNOWN SECTION

PHOTO RESPONSE NON-UNIFORMITY CORRECTION DURING SEMICONDUCTOR INSPE...

HYBRID METROLOGY METHOD AND SYSTEM

METHOD FOR MONITORING INFLUENCE OF DEFECTS IN FEW-LAYER TWO-DIMENSI...

FOCUS-LESS INSPECTION APPARATUS AND METHOD

COMBINATION OF MULTIWAVELENGTH RAMAN AND SPECTROSCOPIC ELLIPSOMETRY...

OVERLAY MEASUREMENT APPARATUS AND OVERLAY MEASUREMENT METHOD