Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps

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H01L22/20

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements

Current Industry

H01L22/20Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps

Industries

Patents Grantslast 30 patents

Information Patent Grant
Structure and method for fabricating a computing system with an int...
- Patent number 11,967,528
- Issue date Apr 23, 2024
- Apple Inc.
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing overlay results with absolute reference for se...
- Patent number 11,966,171
- Issue date Apr 23, 2024
- Tokyo Electron Limited
- Anton J. deVilliers
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and apparatus for automatically processing wafers
- Patent number 11,961,772
- Issue date Apr 16, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Peng Yang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor wafer evaluation method and semiconductor wafer manuf...
- Patent number 11,955,390
- Issue date Apr 9, 2024
- Sumco Corporation
- Takahiro Nagasawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process monitoring of deep structures with X-ray scatterometry
- Patent number 11,955,391
- Issue date Apr 9, 2024
- KLA-Tencor Corporation
- Antonio Arion Gellineau
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Semiconductor processing tools with improved performance by use of...
- Patent number 11,947,888
- Issue date Apr 2, 2024
- Applied Materials, Inc.
- Stephen Moffatt
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Inspection method for detecting a defective bonding interface in a...
- Patent number 11,942,379
- Issue date Mar 26, 2024
- UNITY SEMICONDUCTOR
- Dario Alliata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip, semiconductor device and manufacturing method o...
- Patent number 11,942,471
- Issue date Mar 26, 2024
- Renesas Electronics Corporation
- Yoshito Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for improving sensitivity of wafer detection,...
- Patent number 11,935,244
- Issue date Mar 19, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ran Du
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Backside metal patterning die singulation system and related methods
- Patent number 11,929,285
- Issue date Mar 12, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temperature measurement for substrate carrier using a heater elemen...
- Patent number 11,929,241
- Issue date Mar 12, 2024
- Applied Materials, Inc.
- Phillip Criminale
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate heating unit, substrate processing apparatus, and substra...
- Patent number 11,923,213
- Issue date Mar 5, 2024
- Semes Co., Ltd.
- Tae Shin Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lateral recess measurement in a semiconductor specimen
- Patent number 11,921,063
- Issue date Mar 5, 2024
- Applied Materials Israel Ltd.
- Michael Chemama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing system and method of supporting plasma ignition
- Patent number 11,923,174
- Issue date Mar 5, 2024
- Tokyo Electron Limited
- Yuji Kitamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing method
- Patent number 11,915,951
- Issue date Feb 27, 2024
- HITACHI HIGH-TECH CORPORATION
- Hiroyuki Kobayashi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Detection structure and detection method
- Patent number 11,915,985
- Issue date Feb 27, 2024
- CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO., LTD.
- Qin Kong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photolithography alignment process for bonded wafers
- Patent number 11,916,022
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yeong-Jyh Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect singulation
- Patent number 11,908,705
- Issue date Feb 20, 2024
- Texas Instruments Incorporated
- Chih-Chien Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package, method of bonding workpieces and method of m...
- Patent number 11,908,843
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Bingchien Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer evaluation apparatus and semiconductor wafer ma...
- Patent number 11,906,569
- Issue date Feb 20, 2024
- Showa Denko K.K.
- Koichi Murata
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and system for controlling profile of critical dimension
- Patent number 11,908,754
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jun Shimada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated aligned stealth laser with blade and grinding apparatus...
- Patent number 11,901,171
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Tung Wu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of processing wafer
- Patent number 11,894,271
- Issue date Feb 6, 2024
- Disco Corporation
- Karl Heinz Priewasser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pre and post processing metrology apparatus
- Patent number 11,881,436
- Issue date Jan 23, 2024
- Applied Materials, Inc.
- Jun-Liang Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test circuit and test method
- Patent number 11,876,021
- Issue date Jan 16, 2024
- Kabushiki Kaisha Toshiba
- Daiki Kiribuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonic systems to enable top-side wafer-level optical and electri...
- Patent number 11,867,944
- Issue date Jan 9, 2024
- Ayar Labs, Inc.
- Roy Edward Meade
- G02 - OPTICS
Information Patent Grant
Method of manufacturing silicon carbide semiconductor device
- Patent number 11,869,814
- Issue date Jan 9, 2024
- Fuji Electric Co., Ltd.
- Hidetatsu Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Asymmetry correction via oriented wafer loading
- Patent number 11,869,815
- Issue date Jan 9, 2024
- Applied Materials, Inc.
- Eric Lau
- B24 - GRINDING POLISHING
Information Patent Grant
Planarization apparatus, planarization process, and method of manuf...
- Patent number 11,869,813
- Issue date Jan 9, 2024
- Canon Kabushiki Kaisha
- Xiaoming Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pixel array of image sensor and method of manufacturing the same
- Patent number 11,869,913
- Issue date Jan 9, 2024
- Samsung Electronics Co., Ltd.
- Dongmin Keum
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED STEALTH LASER FOR WAFER EDGE TRIMMING PROCESS
- Publication number 20240136174
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Tung Wu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-WAVELENGTH SELECTION METHOD FOR OVERLAY MEASUREMENT, AND OVER...
- Publication number 20240134290
- Publication date Apr 25, 2024
- Samsung Electronics Co., Ltd.
- Inbeom Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240136301
- Publication date Apr 25, 2024
- Power Master Semiconductor Co., Ltd.
- Sangwoo PAK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR EVALUATING SEMICONDUCTOR WAFER, METHOD FOR SELECTING SEM...
- Publication number 20240128130
- Publication date Apr 18, 2024
- Shin-Etsu Handotai Co., Ltd.
- Junya SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROSTATIC FIELD STRENGTH MEASUREMENT
- Publication number 20240118329
- Publication date Apr 11, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Ming Da YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING WAFER AND WAFER PROCESSING APPARATUS
- Publication number 20240120215
- Publication date Apr 11, 2024
- Disco Corporation
- Hayato IGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER CRYSTALLIZATION MONITORING DEVICE AND METHOD OF LASER CRYSTAL...
- Publication number 20240118221
- Publication date Apr 11, 2024
- SAMSUNG DISPLAY CO., LTD.
- JI-HWAN KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO DEVICE ARRANGEMENT IN DONOR SUBSTRATE
- Publication number 20240096684
- Publication date Mar 21, 2024
- VueReal Inc.
- Gholamreza Chaji
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM AND METHOD FOR DETERMINING POST BONDING OVERLAY
- Publication number 20240094642
- Publication date Mar 21, 2024
- KLA Corporation
- Franz Zach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MACHINE-LEARNING IN MULTI-STEP SEMICONDUCTOR FABRICATION PROCESSES
- Publication number 20240096713
- Publication date Mar 21, 2024
- LAM RESEARCH CORPORATION
- Yan Zhang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240088124
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- HSIANG-TAI LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM FORMING APPARATUS, AND METHOD OF MANUFACTURING SEMICONDUCTOR...
- Publication number 20240084456
- Publication date Mar 14, 2024
- KIOXIA Corporation
- Kazuhiro KATONO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ASYMMETRY CORRECTION VIA ORIENTED WAFER LOADING
- Publication number 20240087965
- Publication date Mar 14, 2024
- Applied Materials, Inc.
- Eric Lau
- B24 - GRINDING POLISHING
Information Patent Application
DIMENSIONAL METROLOGY USING NON-LINEAR OPTICS
- Publication number 20240077302
- Publication date Mar 7, 2024
- FemtoMetrix, Inc.
- David L. Adler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SCANNING IMPEDANCE MEASUREMENT IN A RADIO FREQUENCY PLASMA PROCESSI...
- Publication number 20240079212
- Publication date Mar 7, 2024
- Applied Materials, Inc.
- Yue GUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Publication number 20240071794
- Publication date Feb 29, 2024
- TOKYO ELECTRON LIMITED
- Takumi Honda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC FABRICATION FLOW WITH CONTINUOUS DYNAMIC SAMPLING FOR AUTO-VISUA...
- Publication number 20240071837
- Publication date Feb 29, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Bin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC DEVICE
- Publication number 20240071840
- Publication date Feb 29, 2024
- InnoLux Corporation
- Cheng-Chi WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAYOUT METHOD OF SEMICONDUCTOR, INSPECTION METHOD OF WAFER, MANUFAC...
- Publication number 20240071841
- Publication date Feb 29, 2024
- Samsung Electronics Co., Ltd.
- Sumin PARK
- B24 - GRINDING POLISHING
Information Patent Application
Method and device for optimizing an amount of testing with respect...
- Publication number 20240055304
- Publication date Feb 15, 2024
- ROBERT BOSCH GmbH
- Sebastian Bayer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND TECHNIQUES FOR OPTICAL MEASUREMENT OF THIN FILMS
- Publication number 20240055282
- Publication date Feb 15, 2024
- LAM RESEARCH CORPORATION
- Liu Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Selectable Monolithic or External Scalable Die-to-Die Interconnecti...
- Publication number 20240047353
- Publication date Feb 8, 2024
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
USING SEQUENCE MINING TO PREDICT QUALITY AND YIELD
- Publication number 20240047279
- Publication date Feb 8, 2024
- International Business Machines Corporation
- Robert Jeffrey Baseman
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
LASER PROCESSING APPARATUS AND LASER PROCESSING METHOD
- Publication number 20240030021
- Publication date Jan 25, 2024
- TOKYO ELECTRON LIMITED
- Yohei YAMASHITA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Illumination apparatus
- Publication number 20240019106
- Publication date Jan 18, 2024
- Optovate Limited
- Jonathan HARROLD
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
STACKED SUBSTRATE MANUFACTURING METHOD, STACKED SUBSTRATE MANUFACTU...
- Publication number 20240021447
- Publication date Jan 18, 2024
- Nikon Corporation
- Isao SUGAYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF DETERMINING CONTROL PARAMETERS OF A DEVICE MANUFACTURING...
- Publication number 20240012337
- Publication date Jan 11, 2024
- ASML NETHERLANDS B.V.
- Wim Tjibbo TEL
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Method and Apparatus for Production Process Optimization based on D...
- Publication number 20240012877
- Publication date Jan 11, 2024
- ROBERT BOSCH GmbH
- Stefan Patrick Lindt
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CMOS WELL REGIONS WITH HIGH DOPANT ACTIVATION LEVEL AND REDUCED EXT...
- Publication number 20240006246
- Publication date Jan 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Fan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A METHOD OF MONITORING A LITHOGRAPHIC PROCESS
- Publication number 20240004309
- Publication date Jan 4, 2024
- ASML NETHERLANDS B.V.
- Hendrik Adriaan VAN LAARHOVEN
- H01 - BASIC ELECTRIC ELEMENTS

Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Structure and method for fabricating a computing system with an int...

Method for producing overlay results with absolute reference for se...

Method and apparatus for automatically processing wafers

Semiconductor wafer evaluation method and semiconductor wafer manuf...

Process monitoring of deep structures with X-ray scatterometry

Semiconductor processing tools with improved performance by use of...

Inspection method for detecting a defective bonding interface in a...

Semiconductor chip, semiconductor device and manufacturing method o...

Method and apparatus for improving sensitivity of wafer detection,...

Backside metal patterning die singulation system and related methods

Temperature measurement for substrate carrier using a heater elemen...

Substrate heating unit, substrate processing apparatus, and substra...

Lateral recess measurement in a semiconductor specimen

Plasma processing system and method of supporting plasma ignition

Plasma processing method

Detection structure and detection method

Photolithography alignment process for bonded wafers

Interconnect singulation

Semiconductor package, method of bonding workpieces and method of m...

Semiconductor wafer evaluation apparatus and semiconductor wafer ma...

Method and system for controlling profile of critical dimension

Integrated aligned stealth laser with blade and grinding apparatus...

Method of processing wafer

Pre and post processing metrology apparatus

Test circuit and test method

Photonic systems to enable top-side wafer-level optical and electri...

Method of manufacturing silicon carbide semiconductor device

Asymmetry correction via oriented wafer loading

Planarization apparatus, planarization process, and method of manuf...

Pixel array of image sensor and method of manufacturing the same

Patents Applicationslast 30 patents

INTEGRATED STEALTH LASER FOR WAFER EDGE TRIMMING PROCESS

MULTI-WAVELENGTH SELECTION METHOD FOR OVERLAY MEASUREMENT, AND OVER...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

METHOD FOR EVALUATING SEMICONDUCTOR WAFER, METHOD FOR SELECTING SEM...

ELECTROSTATIC FIELD STRENGTH MEASUREMENT

METHOD OF PROCESSING WAFER AND WAFER PROCESSING APPARATUS

LASER CRYSTALLIZATION MONITORING DEVICE AND METHOD OF LASER CRYSTAL...

MICRO DEVICE ARRANGEMENT IN DONOR SUBSTRATE

SYSTEM AND METHOD FOR DETERMINING POST BONDING OVERLAY

MACHINE-LEARNING IN MULTI-STEP SEMICONDUCTOR FABRICATION PROCESSES

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

FILM FORMING APPARATUS, AND METHOD OF MANUFACTURING SEMICONDUCTOR...

ASYMMETRY CORRECTION VIA ORIENTED WAFER LOADING

DIMENSIONAL METROLOGY USING NON-LINEAR OPTICS

SCANNING IMPEDANCE MEASUREMENT IN A RADIO FREQUENCY PLASMA PROCESSI...

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

IC FABRICATION FLOW WITH CONTINUOUS DYNAMIC SAMPLING FOR AUTO-VISUA...

METHOD FOR MANUFACTURING ELECTRONIC DEVICE

LAYOUT METHOD OF SEMICONDUCTOR, INSPECTION METHOD OF WAFER, MANUFAC...

Method and device for optimizing an amount of testing with respect...

SYSTEMS AND TECHNIQUES FOR OPTICAL MEASUREMENT OF THIN FILMS

Selectable Monolithic or External Scalable Die-to-Die Interconnecti...

USING SEQUENCE MINING TO PREDICT QUALITY AND YIELD

LASER PROCESSING APPARATUS AND LASER PROCESSING METHOD

Illumination apparatus

STACKED SUBSTRATE MANUFACTURING METHOD, STACKED SUBSTRATE MANUFACTU...

METHOD OF DETERMINING CONTROL PARAMETERS OF A DEVICE MANUFACTURING...

Method and Apparatus for Production Process Optimization based on D...

CMOS WELL REGIONS WITH HIGH DOPANT ACTIVATION LEVEL AND REDUCED EXT...

A METHOD OF MONITORING A LITHOGRAPHIC PROCESS