Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps

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CPC
H01L22/20

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements

Current Industry

H01L22/20Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps

Industries

Patents Grantslast 30 patents

Information Patent Grant
Showerhead for process tool
- Patent number 12,180,589
- Issue date Dec 31, 2024
- Tokyo Electron Limited
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Integrated aligned stealth laser for wafer edge trimming process
- Patent number 12,183,571
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for adjusting surface topography of a substrate support app...
- Patent number 12,183,621
- Issue date Dec 31, 2024
- Micron Technology, Inc.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 12,165,932
- Issue date Dec 10, 2024
- LG Display Co., Ltd.
- Seeun Kim
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Shift control method in manufacture of semiconductor device
- Patent number 12,148,733
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for use in wafer processing
- Patent number 12,148,640
- Issue date Nov 19, 2024
- Infineon Technologies AG
- Thomas Fischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Iterative formation of damascene interconnects
- Patent number 12,148,721
- Issue date Nov 19, 2024
- Raytheon Company
- Eric R. Miller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process window optimizer
- Patent number 12,141,507
- Issue date Nov 12, 2024
- ASML Netherlands B.V.
- Stefan Hunsche
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Staircase etch control in forming three-dimensional memory device
- Patent number 12,142,575
- Issue date Nov 12, 2024
- Yangtza Memory Technologies Co., Ltd.
- Zhenyu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated substrate measurement system to improve manufacturing pr...
- Patent number 12,136,557
- Issue date Nov 5, 2024
- Applied Materials, Inc.
- Upendra V. Ummethala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-stage substrate processing system
- Patent number 12,125,722
- Issue date Oct 22, 2024
- ASM IP Holding B.V.
- Yukihiro Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Implementation of deep neural networks for testing and quality cont...
- Patent number 12,124,247
- Issue date Oct 22, 2024
- SanDisk Technologies LLC
- Fei Zhou
- G05 - CONTROLLING REGULATING
Information Patent Grant
Method and apparatus for coating photoresist over a substrate
- Patent number 12,124,168
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jing Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Compensation method for overlay deviation
- Patent number 12,124,175
- Issue date Oct 22, 2024
- Semiconductor Manufacturing South China Corporation
- Hai Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Distribution output device and operating method
- Patent number 12,111,879
- Issue date Oct 8, 2024
- Samsung Electronics Co., Ltd.
- Hakgyun Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Random characteristic evaluation of subject maps
- Patent number 12,107,019
- Issue date Oct 1, 2024
- Kabushiki Kaisha Toshiba
- Shun Hirao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and device for testing array substrate, and computer readabl...
- Patent number 12,107,020
- Issue date Oct 1, 2024
- HKC CORPORATION LIMITED
- Peixin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patterning method and overlay measurement method
- Patent number 12,106,962
- Issue date Oct 1, 2024
- United Microelectronics Corp.
- Yi Jing Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser dicing system and method for dicing semiconductor structure i...
- Patent number 12,106,985
- Issue date Oct 1, 2024
- Yangtze Memory Technologies Co., Ltd.
- Liquan Cai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process monitoring method and process monitoring system
- Patent number 12,107,021
- Issue date Oct 1, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Chunyang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for producing at least one modification in a s...
- Patent number 12,107,017
- Issue date Oct 1, 2024
- Infineon Technologies AG
- Ralf Rieske
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
QFN device having a mechanism that enables an inspectable solder jo...
- Patent number 12,087,673
- Issue date Sep 10, 2024
- Texas Instruments Incorporated
- Abram Castro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-dispersion component in an electronic chip
- Patent number 12,087,683
- Issue date Sep 10, 2024
- STMicroelectronics (Rousset) SAS
- François Tailliet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selectable monolithic or external scalable die-to-die interconnecti...
- Patent number 12,087,689
- Issue date Sep 10, 2024
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wavelet system and method for ameliorating misregistration and asym...
- Patent number 12,080,610
- Issue date Sep 3, 2024
- KLA Corporation
- Lilach Saltoun
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Device manufacturing methods
- Patent number 12,078,935
- Issue date Sep 3, 2024
- ASML Netherlands B.V.
- Rizvi Rahman
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method and system for processing wafer
- Patent number 12,074,074
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Po-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Data analysis method, electronic device, and storage medium for gra...
- Patent number 12,074,075
- Issue date Aug 27, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Yukun Li
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Selective transfer of micro devices
- Patent number 12,075,565
- Issue date Aug 27, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image display device and method for manufacturing image display device
- Patent number 12,068,440
- Issue date Aug 20, 2024
- Nichia Corporation
- Hajime Akimoto
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR WAFER TEMPERATURE MEASUREMENT METHOD
- Publication number 20240421008
- Publication date Dec 19, 2024
- KIOXIA Corporation
- Shunsuke OKADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR FABRICATION CONTROL SYSTEM
- Publication number 20240419156
- Publication date Dec 19, 2024
- Analog Devices International Unlimited Company
- Julius Seville Mallari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MATERIAL MONITORING SYSTEM, PROCESSING APPARATUS, METHOD OF MANUFAC...
- Publication number 20240421007
- Publication date Dec 19, 2024
- Kokusai Electric Corporation
- Kentaro GOSHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS, BONDING METHOD AND ARTICLE MANUFACTURING METHOD
- Publication number 20240421117
- Publication date Dec 19, 2024
- Canon Kabushiki Kaisha
- KIYOTAKA NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR PRODUCING AT LEAST ONE MODIFICATION IN A S...
- Publication number 20240413023
- Publication date Dec 12, 2024
- INFINEON TECHNOLOGIES AG
- Ralf RIESKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE AND METHOD OF INCREASING PIN ALIGNMENT A...
- Publication number 20240404961
- Publication date Dec 5, 2024
- INFINEON TECHNOLOGIES AG
- Alexander Herbrandt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING METHOD AND PROCESSING SYSTEM
- Publication number 20240404852
- Publication date Dec 5, 2024
- TOKYO ELECTRON LIMITED
- Yohei YAMASHITA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
APRIORI APPLICATION WITH DYNAMIC DIGITAL CORRECTION (DDC) FUNCTION
- Publication number 20240404893
- Publication date Dec 5, 2024
- Applied Materials, Inc.
- Shih-Hao KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR CONTROLLING CHEMICAL MECHANICAL PLANARIZATION
- Publication number 20240404894
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Wei HSU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
COMPUTATIONAL WAFER INSPECTION
- Publication number 20240403537
- Publication date Dec 5, 2024
- ASML NETHERLANDS B.V.
- Christophe David FOUQUET
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MANUFACTURING METHOD OF A HEAT DISSIPATION SUBSTRATE EQUIPPED WITH...
- Publication number 20240395565
- Publication date Nov 28, 2024
- LX Semicon Co., Ltd.
- Min Yup JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR REAL TIME ETCH PROCESS COMPENSATION CONTROL
- Publication number 20240395637
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chansyun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MID-MANUFACTURING SEMICONDUCTOR WAFER LAYER TESTING
- Publication number 20240395638
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Feng-Chien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER DEVICE AND METHOD OF MANUFACTURING DISPLAY DEVICE USING THE SAME
- Publication number 20240395574
- Publication date Nov 28, 2024
- SAMSUNG DISPLAY CO., LTD.
- DEOKJAE KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF GROUP III-V SEMICONDUCTOR PACKAGE
- Publication number 20240387300
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-An Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND TEST METHOD THEREOF
- Publication number 20240387297
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR ADJUSTING THE GAP BETWEEN A WAFER AND A TOP P...
- Publication number 20240387299
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sheng-Chan LI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ROENTGEN INTEGRATED METROLOGY FOR HYBRID BONDING PROCESS CONTROL IN...
- Publication number 20240387448
- Publication date Nov 21, 2024
- TOKYO ELECTRON LIMITED
- Francisco MACHUCA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR COATING PHOTORESIST OVER A SUBSTRATE
- Publication number 20240377750
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing CHANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Non-Intrusive Method for 2D/3D Mapping Plasma Parameters
- Publication number 20240377331
- Publication date Nov 14, 2024
- TOKYO ELECTRON LIMITED
- Qiang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20240379465
- Publication date Nov 14, 2024
- SAMSUNG DISPLAY CO., LTD.
- Deok Jun CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR SLURRY QUALITY MONITORING
- Publication number 20240375238
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- CHIH-CHIANG TSENG
- B24 - GRINDING POLISHING
Information Patent Application
SELECTIVE TRANSFER OF MICRO DEVICES
- Publication number 20240381531
- Publication date Nov 14, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR WAFERS AND METHOD OF MANUFACT...
- Publication number 20240379341
- Publication date Nov 14, 2024
- GlobalWafers Japan Co., Ltd.
- Ken HAYAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Providing Wafer Test Data of at Least One Wafer with Sem...
- Publication number 20240379466
- Publication date Nov 14, 2024
- ROBERT BOSCH GmbH
- Timo Pfrommer
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SHIFT CONTROL METHOD IN MANUFACTURE OF SEMICONDUCTOR DEVICE
- Publication number 20240379617
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHODS FOR CONTROLLING AN AMOUNT OF PRIMER IN A PRIMER...
- Publication number 20240379467
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Pei-Yi SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Publication number 20240371661
- Publication date Nov 7, 2024
- TOKYO ELECTRON LIMITED
- Masataka GOSHO
- B08 - CLEANING
Information Patent Application
USING CUMULATIVE HEAT AMOUNT DATA TO QUALIFY HOT PLATE USED FOR POS...
- Publication number 20240371639
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Cheng Chao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR MONITORING SUBSTRATE PROCESSING APPARATUS
- Publication number 20240371611
- Publication date Nov 7, 2024
- Samsung Electronics Co., Ltd.
- SEJIN OH
- H01 - BASIC ELECTRIC ELEMENTS

Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Showerhead for process tool

Integrated aligned stealth laser for wafer edge trimming process

Methods for adjusting surface topography of a substrate support app...

Display device

Shift control method in manufacture of semiconductor device

Method and apparatus for use in wafer processing

Iterative formation of damascene interconnects

Process window optimizer

Staircase etch control in forming three-dimensional memory device

Integrated substrate measurement system to improve manufacturing pr...

Multi-stage substrate processing system

Implementation of deep neural networks for testing and quality cont...

Method and apparatus for coating photoresist over a substrate

Compensation method for overlay deviation

Distribution output device and operating method

Random characteristic evaluation of subject maps

Method and device for testing array substrate, and computer readabl...

Patterning method and overlay measurement method

Laser dicing system and method for dicing semiconductor structure i...

Process monitoring method and process monitoring system

Method and apparatus for producing at least one modification in a s...

QFN device having a mechanism that enables an inspectable solder jo...

Low-dispersion component in an electronic chip

Selectable monolithic or external scalable die-to-die interconnecti...

Wavelet system and method for ameliorating misregistration and asym...

Device manufacturing methods

Method and system for processing wafer

Data analysis method, electronic device, and storage medium for gra...

Selective transfer of micro devices

Image display device and method for manufacturing image display device

Patents Applicationslast 30 patents

SEMICONDUCTOR WAFER TEMPERATURE MEASUREMENT METHOD

SEMICONDUCTOR FABRICATION CONTROL SYSTEM

MATERIAL MONITORING SYSTEM, PROCESSING APPARATUS, METHOD OF MANUFAC...

BONDING APPARATUS, BONDING METHOD AND ARTICLE MANUFACTURING METHOD

METHOD AND APPARATUS FOR PRODUCING AT LEAST ONE MODIFICATION IN A S...

POWER SEMICONDUCTOR MODULE AND METHOD OF INCREASING PIN ALIGNMENT A...

PROCESSING METHOD AND PROCESSING SYSTEM

APRIORI APPLICATION WITH DYNAMIC DIGITAL CORRECTION (DDC) FUNCTION

SYSTEM AND METHOD FOR CONTROLLING CHEMICAL MECHANICAL PLANARIZATION

COMPUTATIONAL WAFER INSPECTION

MANUFACTURING METHOD OF A HEAT DISSIPATION SUBSTRATE EQUIPPED WITH...

METHODS FOR REAL TIME ETCH PROCESS COMPENSATION CONTROL

MID-MANUFACTURING SEMICONDUCTOR WAFER LAYER TESTING

LASER DEVICE AND METHOD OF MANUFACTURING DISPLAY DEVICE USING THE SAME

MANUFACTURING METHOD OF GROUP III-V SEMICONDUCTOR PACKAGE

SEMICONDUCTOR STRUCTURE AND TEST METHOD THEREOF

METHOD AND SYSTEM FOR ADJUSTING THE GAP BETWEEN A WAFER AND A TOP P...

ROENTGEN INTEGRATED METROLOGY FOR HYBRID BONDING PROCESS CONTROL IN...

METHOD AND APPARATUS FOR COATING PHOTORESIST OVER A SUBSTRATE

Non-Intrusive Method for 2D/3D Mapping Plasma Parameters

DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME

METHOD AND SYSTEM FOR SLURRY QUALITY MONITORING

SELECTIVE TRANSFER OF MICRO DEVICES

METHOD OF MANUFACTURING SEMICONDUCTOR WAFERS AND METHOD OF MANUFACT...

Method for Providing Wafer Test Data of at Least One Wafer with Sem...

SHIFT CONTROL METHOD IN MANUFACTURE OF SEMICONDUCTOR DEVICE

SYSTEM AND METHODS FOR CONTROLLING AN AMOUNT OF PRIMER IN A PRIMER...

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

USING CUMULATIVE HEAT AMOUNT DATA TO QUALIFY HOT PLATE USED FOR POS...

METHOD AND SYSTEM FOR MONITORING SUBSTRATE PROCESSING APPARATUS