Shape of the additional element

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H01L2224/05088

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/05088Shape of the additional element

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method for fabricating semiconductor device with slanted conductive...
- Patent number 11,935,850
- Issue date Mar 19, 2024
- NANYA TECHNOLOGY CORPORATION
- Kuo-Hui Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 11,917,875
- Issue date Feb 27, 2024
- Samsung Display Co., Ltd.
- Ki Kyung Youk
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Bond pad layout including floating conductive sections
- Patent number 11,887,949
- Issue date Jan 30, 2024
- Macronix International Co., Ltd.
- Su-Chueh Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods related to stack structures including passivati...
- Patent number 11,804,460
- Issue date Oct 31, 2023
- Skyworks Solutions, Inc.
- Jiro Yota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with slanted conductive layers and method for...
- Patent number 11,398,441
- Issue date Jul 26, 2022
- NANYA TECHNOLOGY CORPORATION
- Kuo-Hui Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack structures in electronic devices including passivation layers...
- Patent number 11,257,774
- Issue date Feb 22, 2022
- Skyworks Solutions, Inc.
- Jiro Yota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,189,583
- Issue date Nov 30, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Sheng-Chau Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad structure for bonding improvement
- Patent number 11,158,591
- Issue date Oct 26, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Chan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of forming the same
- Patent number 11,004,812
- Issue date May 11, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tuan-Yu Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level chip-size package with redistribution layer
- Patent number 10,998,267
- Issue date May 4, 2021
- Mediatek Inc.
- Yan-Liang Ji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding pad architecture using capacitive deep trench isolation (CD...
- Patent number 10,892,291
- Issue date Jan 12, 2021
- STMicroelectronics (Crolles 2) SAS
- Sonarith Chhun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad structure for bonding improvement
- Patent number 10,734,339
- Issue date Aug 4, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Chan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus and equipment
- Patent number 10,622,397
- Issue date Apr 14, 2020
- Canon Kabushiki Kaisha
- Hideaki Ishino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 10,522,487
- Issue date Dec 31, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Chau Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device
- Patent number 9,881,892
- Issue date Jan 30, 2018
- Novatek Microelectronics Corp.
- Jung-Fu Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 9,786,619
- Issue date Oct 10, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Chau Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding pad structure with dense via array
- Patent number 9,711,468
- Issue date Jul 18, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Han Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging device including via-in pad (VIP) and manuf...
- Patent number 9,646,941
- Issue date May 9, 2017
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ying-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,412,710
- Issue date Aug 9, 2016
- SII Semiconductor Corporation
- Sukehiro Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming patterned repassivation...
- Patent number 9,397,058
- Issue date Jul 19, 2016
- STATS ChipPAC Pte. Ltd.
- Xusheng Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via network structures and method therefor
- Patent number 9,269,617
- Issue date Feb 23, 2016
- NXP B.V.
- Yuan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Discrete semiconductor device package and manufacturing method
- Patent number 9,263,335
- Issue date Feb 16, 2016
- NXP B.V.
- Tim Boettcher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding pad structure with dense via array
- Patent number 9,041,204
- Issue date May 26, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Han Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Discrete semiconductor device package and manufacturing method
- Patent number 8,981,566
- Issue date Mar 17, 2015
- NXP B.V.
- Tim Boettcher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming patterned repassivation...
- Patent number 8,963,326
- Issue date Feb 24, 2015
- STATS ChipPAC, Ltd.
- Xusheng Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via network structures and method therefor
- Patent number 8,896,124
- Issue date Nov 25, 2014
- NXP B.V.
- Yuan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump pad structure
- Patent number 8,779,591
- Issue date Jul 15, 2014
- Mediatek Inc.
- Ming-Tzong Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Under land routing
- Patent number 8,368,224
- Issue date Feb 5, 2013
- Cambridge Silicon Radio Ltd.
- Zaid Aboush
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Structures and methods for improving solder bump connections in sem...
- Patent number 7,985,671
- Issue date Jul 26, 2011
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20230091325
- Publication date Mar 23, 2023
- Kabushiki Kaisha Toshiba
- Emiko INOUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD LAYOUT INCLUDING FLOATING CONDUCTIVE SECTIONS
- Publication number 20230056520
- Publication date Feb 23, 2023
- Macronix International Co., Ltd.
- Su-Chueh LO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20230015243
- Publication date Jan 19, 2023
- SAMSUNG DISPLAY CO., LTD.
- Chungi You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED ASSEMBLY INCLUDING INTERCONNECT-LEVEL BONDING PADS AND METHO...
- Publication number 20220336394
- Publication date Oct 20, 2022
- SANDISK TECHNOLOGIES LLC
- Kensuke ISHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES AND METHODS RELATED TO STACK STRUCTURES INCLUDING PASSIVATI...
- Publication number 20220336396
- Publication date Oct 20, 2022
- Skyworks Solutions, Inc.
- Jiro YOTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH SLANTED CONDUCTIVE...
- Publication number 20220093545
- Publication date Mar 24, 2022
- NANYA TECHNOLOGY CORPORATION
- KUO-HUI SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH SLANTED CONDUCTIVE LAYERS AND METHOD FOR...
- Publication number 20220084967
- Publication date Mar 17, 2022
- NANYA TECHNOLOGY CORPORATION
- KUO-HUI SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD STRUCTURE FOR BONDING IMPROVEMENT
- Publication number 20200357762
- Publication date Nov 12, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Chia-Chan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20200144207
- Publication date May 7, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sheng-Chau CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20200091097
- Publication date Mar 19, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tuan-Yu Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20180033749
- Publication date Feb 1, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Chau CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE CAPABLE OF DISPERSING STRESSES
- Publication number 20170271286
- Publication date Sep 21, 2017
- Samsung Electronics Co., Ltd.
- YOUNGBAE KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20170194273
- Publication date Jul 6, 2017
- Taiwan Semiconductor Manufacturing company Ltd.
- SHENG-CHAU CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE
- Publication number 20170133343
- Publication date May 11, 2017
- NOVATEK MICROELECTRONICS CORP.
- Jung-Fu Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20150357297
- Publication date Dec 10, 2015
- SEIKO INSTRUMENTS INC.
- Sukehiro YAMAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA NETWORK STRUCTURES AND METHOD THEREFOR
- Publication number 20150072520
- Publication date Mar 12, 2015
- NXP B.V.
- Yuan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISCRETE SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD
- Publication number 20130320551
- Publication date Dec 5, 2013
- NXP B.V.
- Tim BOETTCHER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING PAD STRUCTURE WITH DENSE VIA ARRAY
- Publication number 20130256893
- Publication date Oct 3, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Han TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Patterned Repassivation...
- Publication number 20130140691
- Publication date Jun 6, 2013
- STATS ChipPAC, Ltd.
- Xusheng Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP PAD STRUCTURE
- Publication number 20130037937
- Publication date Feb 14, 2013
- MEDIATEK INC.
- Ming-Tzong Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA NETWORK STRUCTURES AND METHOD THEREFOR
- Publication number 20120248623
- Publication date Oct 4, 2012
- Yuan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDER LAND ROUTING
- Publication number 20110006434
- Publication date Jan 13, 2011
- CAMBRIDGE SILICON RADIO LTD.
- Zaid Aboush
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Structures and Methods for Improving Solder Bump Connections in Sem...
- Publication number 20100164104
- Publication date Jul 1, 2010
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS

Shape of the additional element

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for fabricating semiconductor device with slanted conductive...

Display device

Bond pad layout including floating conductive sections

Devices and methods related to stack structures including passivati...

Semiconductor device with slanted conductive layers and method for...

Stack structures in electronic devices including passivation layers...

Semiconductor structure and manufacturing method thereof

Bond pad structure for bonding improvement

Package structure and method of forming the same

Wafer-level chip-size package with redistribution layer

Bonding pad architecture using capacitive deep trench isolation (CD...

Bond pad structure for bonding improvement

Semiconductor apparatus and equipment

Semiconductor structure and manufacturing method thereof

Integrated circuit device

Semiconductor structure and manufacturing method thereof

Bonding pad structure with dense via array

Semiconductor packaging device including via-in pad (VIP) and manuf...

Semiconductor device

Semiconductor device and method of forming patterned repassivation...

Via network structures and method therefor

Discrete semiconductor device package and manufacturing method

Bonding pad structure with dense via array

Discrete semiconductor device package and manufacturing method

Semiconductor device and method of forming patterned repassivation...

Via network structures and method therefor

Bump pad structure

Under land routing

Structures and methods for improving solder bump connections in sem...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

BOND PAD LAYOUT INCLUDING FLOATING CONDUCTIVE SECTIONS

DISPLAY DEVICE

BONDED ASSEMBLY INCLUDING INTERCONNECT-LEVEL BONDING PADS AND METHO...

DEVICES AND METHODS RELATED TO STACK STRUCTURES INCLUDING PASSIVATI...

METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH SLANTED CONDUCTIVE...

SEMICONDUCTOR DEVICE WITH SLANTED CONDUCTIVE LAYERS AND METHOD FOR...

BOND PAD STRUCTURE FOR BONDING IMPROVEMENT

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE CAPABLE OF DISPERSING STRESSES

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

INTEGRATED CIRCUIT DEVICE

SEMICONDUCTOR DEVICE

VIA NETWORK STRUCTURES AND METHOD THEREFOR

DISCRETE SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD

BONDING PAD STRUCTURE WITH DENSE VIA ARRAY

Semiconductor Device and Method of Forming Patterned Repassivation...

BUMP PAD STRUCTURE

VIA NETWORK STRUCTURES AND METHOD THEREFOR

UNDER LAND ROUTING

Structures and Methods for Improving Solder Bump Connections in Sem...