Shape

Industry

CPC
H01L2924/1905

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/1905Shape

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Package for a semiconductor device
- Patent number 11,935,848
- Issue date Mar 19, 2024
- Sumitomo Electric Device Innovations, Inc.
- Ikuo Nakashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-density flip chip package for wireless transceivers
- Patent number 11,923,323
- Issue date Mar 5, 2024
- QUALCOMM Incorporated
- Ibrahim Ramez Chamas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,557,553
- Issue date Jan 17, 2023
- Sumitomo Electric Device Innovations, Inc.
- Ikuo Nakashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies having front end under embedded radio fr...
- Patent number 11,424,195
- Issue date Aug 23, 2022
- Intel Corporation
- Eliav Shaul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-density flip chip package for wireless transceivers
- Patent number 11,367,697
- Issue date Jun 21, 2022
- QUALCOMM Incorporated
- Ibrahim Ramez Chamas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduced-length bond pads for broadband power amplifiers
- Patent number 11,114,396
- Issue date Sep 7, 2021
- Cree, Inc.
- Lei Zhao
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor package having stacked substrates with cavities
- Patent number 10,692,796
- Issue date Jun 23, 2020
- Technische Hochschule Ingolstadt
- Gordon Elger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory packages and related semiconductor packages
- Patent number 10,586,775
- Issue date Mar 10, 2020
- Samsung Electronics Co., Ltd.
- Dong-Uk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Close proximity tunable inductive elements
- Patent number 10,490,621
- Issue date Nov 26, 2019
- QUALCOMM Incorporated
- Paragkumar Ajaybhai Thadesar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated passive device for RF power amplifier package
- Patent number 10,453,810
- Issue date Oct 22, 2019
- Ampleon Netherlands B.V.
- Johannes Adrianus Maria De Boet
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Gateless switch with capacitively-coupled contacts
- Patent number 10,256,334
- Issue date Apr 9, 2019
- Sensor Electronic Technology, Inc.
- Grigory Simin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier device for a magnetic resonance device and magnetic...
- Patent number 10,254,359
- Issue date Apr 9, 2019
- Siemens Aktiengesellschaft
- Adam Albrecht
- G01 - MEASURING TESTING
Information Patent Grant
Integrated passive device for RF power amplifier package
- Patent number 10,242,960
- Issue date Mar 26, 2019
- Ampleon Netherlands B.V.
- Johannes Adrianus Maria De Boet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 10,090,375
- Issue date Oct 2, 2018
- Mediatek Inc.
- Tzu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip on chip attach (passive IPD and PMIC) flip chip BGA using new...
- Patent number 9,929,130
- Issue date Mar 27, 2018
- Dialog Semiconductor GmbH
- Ian Kent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gateless switch with capacitively-coupled contacts
- Patent number 9,349,848
- Issue date May 24, 2016
- Sensor Electronic Technology, Inc.
- Grigory Simin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 9,351,404
- Issue date May 24, 2016
- Hitachi Metals, Ltd.
- Hirotaka Satake
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Antenna device and wireless apparatus
- Patent number 9,245,866
- Issue date Jan 26, 2016
- Kabushiki Kaisha Toshiba
- Yukako Tsutsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array semiconductor package and method of manufacturing t...
- Patent number 9,245,864
- Issue date Jan 26, 2016
- Seiko Instruments Inc.
- Noriyuki Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package
- Patent number 9,236,358
- Issue date Jan 12, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Ralf Reuter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe for semiconductor packages
- Patent number 9,198,281
- Issue date Nov 24, 2015
- Mediatek Inc.
- Tao Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Highly integrated miniature radio frequency module
- Patent number 9,117,835
- Issue date Aug 25, 2015
- Stalix LLC
- Danny F Ammar
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Package with integrated pre-match circuit and harmonic suppression
- Patent number 9,048,232
- Issue date Jun 2, 2015
- Dialog Semiconductor B.V.
- Laurentius Cornelis Colussi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Patterned ground shield structures and semiconductor devices
- Patent number 9,000,561
- Issue date Apr 7, 2015
- Semiconductor Manufacturing International (Shanghai) Corporation
- Xining Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ground shield structure and semiconductor device
- Patent number 8,987,839
- Issue date Mar 24, 2015
- Semiconductor Manufacturing International (Shanghai) Corporation
- Ling Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compensation network for RF transistor
- Patent number 8,981,433
- Issue date Mar 17, 2015
- NXP, B.V.
- Lukas Frederik Tiemeijer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-frequency module including a conductor with a slot therein and...
- Patent number 8,854,152
- Issue date Oct 7, 2014
- Kyocera Corporation
- Hiroshi Uchimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit die stacks with translationally compatible vias
- Patent number 8,823,162
- Issue date Sep 2, 2014
- International Business Machines Corporation
- Jimmy G. Foster
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making high-speed ceramic modules with hybrid referencin...
- Patent number 8,683,413
- Issue date Mar 25, 2014
- International Business Machines Corporation
- Wiren Dale Becker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High power semiconductor device for wireless applications and metho...
- Patent number 8,669,638
- Issue date Mar 11, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Jean Marie Boulay
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Integration of Discrete Embeddable Capacitors on Integrated Circuit...
- Publication number 20240145447
- Publication date May 2, 2024
- pSemi Corporation
- Shishir Ray
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230163085
- Publication date May 25, 2023
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Ayuhiko SAITOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE FOR A SEMICONDUCTOR DEVICE
- Publication number 20230076573
- Publication date Mar 9, 2023
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Ikuo NAKASHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-DENSITY FLIP CHIP PACKAGE FOR WIRELESS TRANSCEIVERS
- Publication number 20220320021
- Publication date Oct 6, 2022
- QUALCOMM Incorporated
- Ibrahim Ramez CHAMAS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-DENSITY FLIP CHIP PACKAGE FOR WIRELESS TRANSCEIVERS
- Publication number 20210358871
- Publication date Nov 18, 2021
- QUALCOMM Incorporated
- Ibrahim Ramez CHAMAS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210035931
- Publication date Feb 4, 2021
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Ikuo NAKASHIMA
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Reduced-Length Bond Pads for Broadband Power Amplifiers
- Publication number 20200373265
- Publication date Nov 26, 2020
- Cree, Inc.
- Lei Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AMPLIFIERS WITH BROADBAND IMPEDANCE MATCHING AND METHODS OF MANUFAC...
- Publication number 20200059204
- Publication date Feb 20, 2020
- NXP USA, Inc.
- IJAZ KAHLOON
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
MICROELECTRONIC ASSEMBLIES HAVING FRONT END UNDER EMBEDDED RADIO FR...
- Publication number 20190304936
- Publication date Oct 3, 2019
- Intel Corporation
- Eliav Shaul
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MEMORY PACKAGES AND RELATED SEMICONDUCTOR PACKAGES
- Publication number 20190229076
- Publication date Jul 25, 2019
- Samsung Electronics Co., Ltd.
- Dong-Uk Kim
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Integrated Passive Device for RF Power Amplifier Package
- Publication number 20190172804
- Publication date Jun 6, 2019
- Ampleon Netherlands B.V.
- Johannes Adrianus Maria De Boet
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Integrated Passive Device for RF Power Amplifier Package
- Publication number 20180026000
- Publication date Jan 25, 2018
- Ampleon Netherlands B.V.
- Johannes Adrianus Maria De Boet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20170179055
- Publication date Jun 22, 2017
- MEDIATEK INC.
- Tzu-Hung LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip on Chip Attach (Passive IPD and PMIC) Flip Chip BGA Using New...
- Publication number 20170040309
- Publication date Feb 9, 2017
- DIALOG SEMICONDUCTOR GMBH
- Ian Kent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BALL GRID ARRAY SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING T...
- Publication number 20150123277
- Publication date May 7, 2015
- SEIKO INSTRUMENTS INC.
- Noriyuki KIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNED GROUND SHIELD STRUCTURES AND SEMICONDUCTOR DEVICES
- Publication number 20140361401
- Publication date Dec 11, 2014
- Semiconductor Manufacturing International (Shanghai) Corporation
- XINING WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GROUND SHIELD STRUCTURE AND SEMICONDUCTOR DEVICE
- Publication number 20140361417
- Publication date Dec 11, 2014
- Semiconductor Manufacturing International (Shanghai) Corporation
- LING LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip on Chip Attach (Passive IPD and PMIC) Flip Chip BGA Using New...
- Publication number 20140246773
- Publication date Sep 4, 2014
- DIALOG SEMICONDUCTOR GMBH
- Ian Kent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE
- Publication number 20140191377
- Publication date Jul 10, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Ralf Reuter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO CMOS POWER AMPLIFIER
- Publication number 20140097907
- Publication date Apr 10, 2014
- Sung Man YOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME FOR SEMICONDUCTOR PACKAGES
- Publication number 20140097012
- Publication date Apr 10, 2014
- MEDIATEK INC.
- Tao Cheng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Gateless Switch with Capacitively-Coupled Contacts
- Publication number 20140077265
- Publication date Mar 20, 2014
- SENSOR ELECTRONIC TECHNOLOGY, INC.
- Grigory Simin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package with Integrated Pre-Match Circuit and Harmonic Suppression
- Publication number 20130286620
- Publication date Oct 31, 2013
- Dialog Semiconductor B.V.
- Laurentius Cornelis Colussi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MAKING HIGH-SPEED CERAMIC MODULES WITH HYBRID REFERENCIN...
- Publication number 20130252379
- Publication date Sep 26, 2013
- Wiren D Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20130250536
- Publication date Sep 26, 2013
- Hitachi Metals, Ltd.
- Hirotaka Satake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Communication System with Configurable Capacitors
- Publication number 20130090067
- Publication date Apr 11, 2013
- BROADCOM CORPORATION
- Ahmadreza Rofougaran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA DEVICE AND WIRELESS APPARATUS
- Publication number 20120319913
- Publication date Dec 20, 2012
- Kabushiki Kaisha Toshiba
- Yukako Tsutsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Die Stacks With Translationally Compatible Vias
- Publication number 20120218024
- Publication date Aug 30, 2012
- International Business Machines Corporation
- Jimmy G. Foster, SR.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC Package With Embedded Filters
- Publication number 20120169432
- Publication date Jul 5, 2012
- Broadcom Corporation
- Ahmadreza Rofougaran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device Housing Package and Mounting Structure
- Publication number 20120147539
- Publication date Jun 14, 2012
- KYOCERA CORPORATION
- Mahiro Tsujino
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Package for a semiconductor device

High-density flip chip package for wireless transceivers

Semiconductor device

Microelectronic assemblies having front end under embedded radio fr...

High-density flip chip package for wireless transceivers

Reduced-length bond pads for broadband power amplifiers

Semiconductor package having stacked substrates with cavities

Memory packages and related semiconductor packages

Close proximity tunable inductive elements

Integrated passive device for RF power amplifier package

Gateless switch with capacitively-coupled contacts

Power amplifier device for a magnetic resonance device and magnetic...

Integrated passive device for RF power amplifier package

Semiconductor structure

Chip on chip attach (passive IPD and PMIC) flip chip BGA using new...

Gateless switch with capacitively-coupled contacts

Electronic device

Antenna device and wireless apparatus

Ball grid array semiconductor package and method of manufacturing t...

Integrated circuit package

Leadframe for semiconductor packages

Highly integrated miniature radio frequency module

Package with integrated pre-match circuit and harmonic suppression

Patterned ground shield structures and semiconductor devices

Ground shield structure and semiconductor device

Compensation network for RF transistor

High-frequency module including a conductor with a slot therein and...

Integrated circuit die stacks with translationally compatible vias

Method for making high-speed ceramic modules with hybrid referencin...

High power semiconductor device for wireless applications and metho...

Patents Applicationslast 30 patents

Integration of Discrete Embeddable Capacitors on Integrated Circuit...

SEMICONDUCTOR DEVICE

PACKAGE FOR A SEMICONDUCTOR DEVICE

HIGH-DENSITY FLIP CHIP PACKAGE FOR WIRELESS TRANSCEIVERS

HIGH-DENSITY FLIP CHIP PACKAGE FOR WIRELESS TRANSCEIVERS

SEMICONDUCTOR DEVICE

Reduced-Length Bond Pads for Broadband Power Amplifiers

AMPLIFIERS WITH BROADBAND IMPEDANCE MATCHING AND METHODS OF MANUFAC...

MICROELECTRONIC ASSEMBLIES HAVING FRONT END UNDER EMBEDDED RADIO FR...

MEMORY PACKAGES AND RELATED SEMICONDUCTOR PACKAGES

Integrated Passive Device for RF Power Amplifier Package

Integrated Passive Device for RF Power Amplifier Package

SEMICONDUCTOR STRUCTURE

Chip on Chip Attach (Passive IPD and PMIC) Flip Chip BGA Using New...

BALL GRID ARRAY SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING T...

PATTERNED GROUND SHIELD STRUCTURES AND SEMICONDUCTOR DEVICES

GROUND SHIELD STRUCTURE AND SEMICONDUCTOR DEVICE

Chip on Chip Attach (Passive IPD and PMIC) Flip Chip BGA Using New...

INTEGRATED CIRCUIT PACKAGE

MICRO CMOS POWER AMPLIFIER

LEADFRAME FOR SEMICONDUCTOR PACKAGES

Gateless Switch with Capacitively-Coupled Contacts

Package with Integrated Pre-Match Circuit and Harmonic Suppression

METHOD FOR MAKING HIGH-SPEED CERAMIC MODULES WITH HYBRID REFERENCIN...

ELECTRONIC DEVICE

Communication System with Configurable Capacitors

ANTENNA DEVICE AND WIRELESS APPARATUS

Integrated Circuit Die Stacks With Translationally Compatible Vias

IC Package With Embedded Filters

Device Housing Package and Mounting Structure