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SEMICONDUCTOR PACKAGE STRUCTURE
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Publication number 20240153839
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Publication date May 9, 2024
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Taiwan Semiconductor Manufacturing Company, Ltd.
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Shu-Shen Yeh
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H01 - BASIC ELECTRIC ELEMENTS
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POWER SEMICONDUCTOR DEVICE
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Publication number 20240136257
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Publication date Apr 25, 2024
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Mitsubishi Electric Corporation
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Takuya SAKAMOTO
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H01 - BASIC ELECTRIC ELEMENTS
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PACKAGE STRUCTURE
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Publication number 20240047313
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Publication date Feb 8, 2024
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Integrated Silicon Solution Inc.
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Cheng-Fu YU
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGE
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Publication number 20230317539
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Publication date Oct 5, 2023
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Samsung Electronics Co., Ltd.
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Bo In NOH
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H01 - BASIC ELECTRIC ELEMENTS
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BONDED STRUCTURES
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Publication number 20230268300
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Publication date Aug 24, 2023
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ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
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Cyprian Emeka Uzoh
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H01 - BASIC ELECTRIC ELEMENTS
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POWER MODULE
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Publication number 20230187305
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Publication date Jun 15, 2023
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Hitachi Astemo, Ltd.
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Hiromi SHIMAZU
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H01 - BASIC ELECTRIC ELEMENTS
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Chip Package with Contact Clip
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Publication number 20230094566
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Publication date Mar 30, 2023
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INFINEON TECHNOLOGIES AG
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Horst Theuss
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE
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Publication number 20230083522
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Publication date Mar 16, 2023
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KIOXIA Corporation
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Takayuki IDE
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H01 - BASIC ELECTRIC ELEMENTS
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