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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/0805Shape

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,170,259
- Issue date Dec 17, 2024
- Samsung Electronics Co., Ltd.
- Ju Bin Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with built-in electronic components and electronic device
- Patent number 12,148,724
- Issue date Nov 19, 2024
- Fujitsu Limited
- Yukiko Oshikubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,142,588
- Issue date Nov 12, 2024
- Samsung Electronics Co., Ltd.
- Joohee Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,142,544
- Issue date Nov 12, 2024
- Samsung Electronics Co., Ltd.
- Taehwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low temperature bonded structures
- Patent number 12,132,020
- Issue date Oct 29, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip bonding method and semiconductor chip structure
- Patent number 12,119,315
- Issue date Oct 15, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Chih-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low temperature bonded structures
- Patent number 12,100,676
- Issue date Sep 24, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor structure and method
- Patent number 12,068,287
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and display device using the same
- Patent number 12,021,056
- Issue date Jun 25, 2024
- LG Display Co., Ltd.
- Chang Hyun Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structure and method thereof
- Patent number 12,015,001
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Wen-Chuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding with uniform pattern density
- Patent number 11,996,399
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip structure and method for forming the same
- Patent number 11,848,270
- Issue date Dec 19, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hong-Seng Shue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 11,810,837
- Issue date Nov 7, 2023
- Samsung Electronics Co., Ltd.
- Chulyong Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,769,743
- Issue date Sep 26, 2023
- Samsung Electronics Co., Ltd.
- Gayoung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of room temperature covalent bonding
- Patent number 11,760,059
- Issue date Sep 19, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Qin-Yi Tong
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Hybrid bonding structure and hybrid bonding method
- Patent number 11,756,922
- Issue date Sep 12, 2023
- Huawei Technologies Co., Ltd.
- Ran He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method of manufacturing semiconductor device,...
- Patent number 11,742,374
- Issue date Aug 29, 2023
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Yoshiya Hagimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip having chip pads of different surface areas, and...
- Patent number 11,682,643
- Issue date Jun 20, 2023
- SK hynix Inc.
- Ju Il Eom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,616,036
- Issue date Mar 28, 2023
- Samsung Electronics Co., Ltd.
- Joohee Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor structure and method
- Patent number 11,587,910
- Issue date Feb 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame-based semiconductor package
- Patent number 11,469,161
- Issue date Oct 11, 2022
- Infineon Technologies AG
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,462,496
- Issue date Oct 4, 2022
- Kioxia Corporation
- Masayoshi Tagami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Switch device having a pulldown transistor and a voltage clamp
- Patent number 11,329,646
- Issue date May 10, 2022
- Infineon Technologies Austria AG
- Kennith Kin Leong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,296,045
- Issue date Apr 5, 2022
- Samsung Electronics Co., Ltd.
- Joohee Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding with uniform pattern density
- Patent number 11,257,805
- Issue date Feb 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Dun-Nian Yaung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low temperature bonded structures
- Patent number 11,244,916
- Issue date Feb 8, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pattern decomposition lithography techniques
- Patent number 11,107,786
- Issue date Aug 31, 2021
- Intel Corporation
- Charles H. Wallace
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor structure and method
- Patent number 11,037,909
- Issue date Jun 15, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding pad on a back side illuminated image sensor
- Patent number 11,011,566
- Issue date May 18, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Volume Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having electrode pad and electrode layer inter...
- Patent number 10,985,104
- Issue date Apr 20, 2021
- Kabushiki Kaisha Toshiba
- Seiji Inumiya
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
BONDING STRUCTURE FOR A HYBRID WAFER BONDING, SEMICONDUCTOR DEVICE...
- Publication number 20240413109
- Publication date Dec 12, 2024
- SK HYNIX INC.
- Young Su YUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND DISPLAY DEVICE USING THE SAME
- Publication number 20240312945
- Publication date Sep 19, 2024
- LG Display Co., Ltd.
- Chang Hyun SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE AND METHOD THEREOF
- Publication number 20240304580
- Publication date Sep 12, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- WEN-CHUAN TAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240282713
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hsuan Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING WITH UNIFORM PATTERN DENSITY
- Publication number 20240266341
- Publication date Aug 8, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO LIGHT EMITTING DIODE CHIP AND METHOD FOR MANUFACTURING THEREOF
- Publication number 20240258292
- Publication date Aug 1, 2024
- Samsung Electronics Co., Ltd.
- Sungyong MIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-WAFER BONDING FOR NAND SCALING
- Publication number 20240250007
- Publication date Jul 25, 2024
- SANDISK TECHNOLOGIES LLC
- Hiroki Yabe
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING BONDING PADS AND METHOD FOR FABRICAT...
- Publication number 20240243081
- Publication date Jul 18, 2024
- SK HYNIX INC.
- Byung Ho LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS
- Publication number 20240234210
- Publication date Jul 11, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jen-Chun Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240213223
- Publication date Jun 27, 2024
- Samsung Electronics Co., Ltd.
- Jaemok JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS FOR FABRICATING THE SAME
- Publication number 20240203855
- Publication date Jun 20, 2024
- Samsung Electronics Co., Ltd.
- Jaemok JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED STRUCTURE WITH SECURITY DIE
- Publication number 20240186269
- Publication date Jun 6, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING OF A THIN SEMICONDUCTOR DIE
- Publication number 20240170442
- Publication date May 23, 2024
- ASMPT Singapore Pte. Ltd.
- Yiu Ming CHEUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH BONDING PAD AND METHOD FOR FORM...
- Publication number 20240170350
- Publication date May 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Wei LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20240170429
- Publication date May 23, 2024
- Samsung Electronics Co., Ltd.
- Sangho Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE FOR THERMAL MANAGEMENT IN HYBRID BONDING
- Publication number 20240153894
- Publication date May 9, 2024
- International Business Machines Corporation
- John Knickerbocker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240128236
- Publication date Apr 18, 2024
- Samsung Electronics Co., Ltd.
- Hyoeun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CRUCIFORM BONDING STRUCTURE FOR 3D-IC
- Publication number 20240128216
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Lin Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE
- Publication number 20240120277
- Publication date Apr 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hong-Seng SHUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW TEMPERATURE BONDED STRUCTURES
- Publication number 20240113059
- Publication date Apr 4, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240096831
- Publication date Mar 21, 2024
- Samsung Electronics Co., Ltd.
- Enbin Jo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240079362
- Publication date Mar 7, 2024
- SK HYNIX INC.
- Jin Won PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A POLYMER LAYER
- Publication number 20240071976
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240063081
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Fung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING FOR SEMICONDUCTOR DEVICE ASSEMBLIES
- Publication number 20240063152
- Publication date Feb 22, 2024
- Micron Technology, Inc.
- Jyun Yang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240030106
- Publication date Jan 25, 2024
- ROHM CO., LTD.
- Yosui FUTAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20240030104
- Publication date Jan 25, 2024
- Samsung Electronics Co., Ltd.
- Chulyong Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE TRENCH FOR IMPROVED HYBRID BONDING
- Publication number 20240006358
- Publication date Jan 4, 2024
- Intel Corporation
- Zhihua Zou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR STORAGE DEVICE
- Publication number 20230411327
- Publication date Dec 21, 2023
- KIOXIA Corporation
- Masayoshi TAGAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230411328
- Publication date Dec 21, 2023
- KIOXIA Corporation
- Shinya ARAI
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package and method of fabricating the same

Package with built-in electronic components and electronic device

Semiconductor device and method of manufacturing the same

Semiconductor package

Low temperature bonded structures

Chip bonding method and semiconductor chip structure

Low temperature bonded structures

Stacked semiconductor structure and method

Electronic device and display device using the same

Bonding structure and method thereof

Hybrid bonding with uniform pattern density

Chip structure and method for forming the same

Semiconductor packages

Semiconductor package

Method of room temperature covalent bonding

Hybrid bonding structure and hybrid bonding method

Semiconductor device, method of manufacturing semiconductor device,...

Semiconductor chip having chip pads of different surface areas, and...

Semiconductor device and method of manufacturing the same

Stacked semiconductor structure and method

Lead frame-based semiconductor package

Semiconductor device

Switch device having a pulldown transistor and a voltage clamp

Semiconductor device and method of manufacturing the same

Hybrid bonding with uniform pattern density

Low temperature bonded structures

Pattern decomposition lithography techniques

Stacked semiconductor structure and method

Bonding pad on a back side illuminated image sensor

Semiconductor device having electrode pad and electrode layer inter...

Patents Applicationslast 30 patents

BONDING STRUCTURE FOR A HYBRID WAFER BONDING, SEMICONDUCTOR DEVICE...

ELECTRONIC DEVICE AND DISPLAY DEVICE USING THE SAME

BONDING STRUCTURE AND METHOD THEREOF

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

HYBRID BONDING WITH UNIFORM PATTERN DENSITY

MICRO LIGHT EMITTING DIODE CHIP AND METHOD FOR MANUFACTURING THEREOF

MULTI-WAFER BONDING FOR NAND SCALING

SEMICONDUCTOR DEVICE INCLUDING BONDING PADS AND METHOD FOR FABRICAT...

INTEGRATED CIRCUIT PACKAGES AND METHODS

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR PACKAGES AND METHODS FOR FABRICATING THE SAME

BONDED STRUCTURE WITH SECURITY DIE

HYBRID BONDING OF A THIN SEMICONDUCTOR DIE

SEMICONDUCTOR DEVICE STRUCTURE WITH BONDING PAD AND METHOD FOR FORM...

SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

STRUCTURE FOR THERMAL MANAGEMENT IN HYBRID BONDING

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

CRUCIFORM BONDING STRUCTURE FOR 3D-IC

CHIP STRUCTURE

LOW TEMPERATURE BONDED STRUCTURES

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE WITH A POLYMER LAYER

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

HYBRID BONDING FOR SEMICONDUCTOR DEVICE ASSEMBLIES

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGES

SUBSTRATE TRENCH FOR IMPROVED HYBRID BONDING

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR STORAGE DEVICE

SEMICONDUCTOR DEVICE