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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/4501Shape

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device comprising PN junction diode and Schottky barr...
- Patent number 12,341,135
- Issue date Jun 24, 2025
- Rohm Co., Ltd.
- Keiji Okumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module semiconductor device and inverter equipment, and fabri...
- Patent number 12,322,683
- Issue date Jun 3, 2025
- Rohm Co., Ltd.
- Toshio Hanada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 12,283,555
- Issue date Apr 22, 2025
- Analog Devices International Unlimited Company
- Bilge Bayrakci
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect wires including relatively low resistivity cores
- Patent number 12,266,568
- Issue date Apr 1, 2025
- Intel Corporation
- Hui Jae Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Secure semiconductor integration and method for making thereof
- Patent number 12,255,189
- Issue date Mar 18, 2025
- BroadPak Corporation
- Farhang Yazdani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond wires for interference shielding
- Patent number 12,255,153
- Issue date Mar 18, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display substrate, tiled display panel and display device
- Patent number 12,237,316
- Issue date Feb 25, 2025
- BOE Technology Group Co., Ltd.
- Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package having wirebonded multi-die stack
- Patent number 12,237,305
- Issue date Feb 25, 2025
- Intel Corporation
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and power conversion apparatus
- Patent number 12,224,220
- Issue date Feb 11, 2025
- Mitsubishi Electric Corporation
- Ken Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 12,211,821
- Issue date Jan 28, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Floating die package
- Patent number 12,176,298
- Issue date Dec 24, 2024
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier modules including semiconductor resistor and tantal...
- Patent number 12,143,077
- Issue date Nov 12, 2024
- Skyworks Solutions, Inc.
- Peter J. Zampardi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire
- Patent number 12,132,025
- Issue date Oct 29, 2024
- Nippon Micrometal Corporation
- Takashi Yamada
- C21 - METALLURGY OF IRON
Information Patent Grant
Semiconductor device packages, packaging methods, and packaged semi...
- Patent number 12,119,338
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Al bonding wire
- Patent number 12,090,578
- Issue date Sep 17, 2024
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light emitting device
- Patent number 12,084,609
- Issue date Sep 10, 2024
- Citizen Electronics Co., Ltd.
- Byungchul Hong
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Package with different types of semiconductor dies attached to a fl...
- Patent number 12,080,660
- Issue date Sep 3, 2024
- MACOM Technology Solutions Holdings, Inc.
- Xikun Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including source pad region and drain pad regi...
- Patent number 12,062,716
- Issue date Aug 13, 2024
- ANCORA SEMICONDUCTORS INC.
- Li-Fan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting substrate, method of manufacturing light-emitting su...
- Patent number 12,046,591
- Issue date Jul 23, 2024
- BOE Technology Group Co., Ltd.
- Xuan Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Impedance controlled electrical interconnection employing meta-mate...
- Patent number 12,027,465
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Christopher Wyland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple plated via arrays of different wire heights on a same subs...
- Patent number RE49987
- Issue date May 28, 2024
- Invensas LLC
- Cyprian Emeka Uzoh
Information Patent Grant
Radio frequency transmission line with finish plating on conductive...
- Patent number 11,984,423
- Issue date May 14, 2024
- Skyworks Solutions, Inc.
- Sandra Louise Petty-Weeks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ribbon wire bond
- Patent number 11,975,400
- Issue date May 7, 2024
- Texas Instruments Incorporated
- Amin Ahmad Sijelmassi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power module semiconductor device and inverter equipment, and fabri...
- Patent number 11,973,007
- Issue date Apr 30, 2024
- Rohm Co., Ltd.
- Toshio Hanada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module semiconductor device and inverter equipment, and fabri...
- Patent number 11,967,543
- Issue date Apr 23, 2024
- Rohm Co., Ltd.
- Toshio Hanada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing electronic components, corresponding electronic...
- Patent number 11,935,818
- Issue date Mar 19, 2024
- STMicroelectronics S.r.l.
- Fabio Marchisi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Smart packaging for improved medication regimen compliance
- Patent number 11,913,893
- Issue date Feb 27, 2024
- QuantaEd, LLC
- Mehran Mehregany
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising PN junction diode and Schottky barr...
- Patent number 11,894,349
- Issue date Feb 6, 2024
- Rohm Co., Ltd.
- Keiji Okumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect wires including relatively low resistivity cores
- Patent number 11,881,432
- Issue date Jan 23, 2024
- Hui Jae Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device
- Patent number 11,873,435
- Issue date Jan 16, 2024
- CITIZEN ELECTRONICS CO., LTD.
- Byungchul Hong
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
PRESS PACK POWER SEMICONDUCTOR DEVICE WITH LOCATOR STRIP
- Publication number 20250218971
- Publication date Jul 3, 2025
- LITTELFUSE, INC.
- Thomas Spann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC MODULES HAVING ELECTRICAL CONNECTION ELEMENTS IN THE FOR...
- Publication number 20250219008
- Publication date Jul 3, 2025
- Heraeus Electronics GmbH & Co. KG
- Marcel NEUBAUER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250210475
- Publication date Jun 26, 2025
- ROHM CO., LTD.
- Ryotaro KAKIZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT WIRES INCLUDING RELATIVELY LOW RESISTIVITY CORES
- Publication number 20250201629
- Publication date Jun 19, 2025
- Intel Corporation
- HUI JAE YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING THE SAME, AND...
- Publication number 20250192098
- Publication date Jun 12, 2025
- Mitsubishi Electric Corporation
- Yuji SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE HAVING WIREBONDED MULTI-DIE STACK
- Publication number 20250167180
- Publication date May 22, 2025
- Intel Corporation
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY SUBSTRATE, TILED DISPLAY PANEL AND DISPLAY DEVICE
- Publication number 20250149522
- Publication date May 8, 2025
- BOE TECHNOLOGY GROUP CO., LTD.
- Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED POWER DIE PACKAGE WITH VERTICAL INTERCONNECT
- Publication number 20250140734
- Publication date May 1, 2025
- Infineon Technologies Austria AG
- Lee Siang Tey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR DEVICE
- Publication number 20250140737
- Publication date May 1, 2025
- Mitsubishi Electric Corporation
- Koichi TOKUBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS
- Publication number 20250118705
- Publication date Apr 10, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250087622
- Publication date Mar 13, 2025
- RENESAS ELECTRONICS CORPORATION
- Kazuaki OSAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METALLIZATIONS FOR SEMICONDUCTOR POWER DEVICES
- Publication number 20250081579
- Publication date Mar 6, 2025
- Wolfspeed, Inc.
- Jonathan Van Buskirk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER AMPLIFIER SYSTEMS INCLUDING CONTROL INTERFACE AND WIRE BOND PAD
- Publication number 20250030386
- Publication date Jan 23, 2025
- Skyworks Solutions, Inc.
- Weimin Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES, PACKAGING METHODS, AND PACKAGED SEMI...
- Publication number 20240395792
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jie CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE
- Publication number 20240376380
- Publication date Nov 14, 2024
- Citizen Electronics Co., Ltd.
- Byungchul HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR BONDED BODY, BONDED BODY, MANUFACTURING ME...
- Publication number 20240339368
- Publication date Oct 10, 2024
- FUJIFILM CORPORATION
- Atsushi NAKAMURA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
LIGHT-EMITTING SUBSTRATE, METHOD OF MANUFACTURING LIGHT-EMITTING SU...
- Publication number 20240339444
- Publication date Oct 10, 2024
- BOE TECHNOLOGY GROUP CO., LTD.
- Xuan Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR PACKAGE INCLUDING A PASSIVE ELECTRONIC COMPONEN...
- Publication number 20240312936
- Publication date Sep 19, 2024
- Infineon Technologies Austria AG
- Joon Shyan Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20240304588
- Publication date Sep 12, 2024
- Fuji Electric Co., Ltd.
- Akio YAMANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE SEMICONDUCTOR DEVICE AND INVERTER EQUIPMENT, AND FABRI...
- Publication number 20240282675
- Publication date Aug 22, 2024
- ROHM CO., LTD.
- Toshio HANADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH DIE SUPPORT MEMBERS AND A...
- Publication number 20240274583
- Publication date Aug 15, 2024
- Micron Technology, Inc.
- Seng Kim Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RIBBON WIRE BOND
- Publication number 20240269764
- Publication date Aug 15, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Amin Ahmad Sijelmassi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER MODULE
- Publication number 20240222349
- Publication date Jul 4, 2024
- Mitsubishi Electric Corporation
- Kenta NAKAHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PRODUCING ELECTRONIC COMPONENTS, CORRESPONDING ELECTRONIC...
- Publication number 20240203834
- Publication date Jun 20, 2024
- STMicroelectronics S.r.l.
- Fabio MARCHISI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE WITH IMPROVED ELECTRICAL COMPONENTS
- Publication number 20240203932
- Publication date Jun 20, 2024
- DANFOSS SILICON POWER GMBH
- Tobias SCHUETZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE COMPRISING PN JUNCTION DIODE AND SCHOTTKY BARR...
- Publication number 20240120322
- Publication date Apr 11, 2024
- Rohm Co., Ltd.
- Keiji Okumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT WIRES INCLUDING RELATIVELY LOW RESISTIVITY CORES
- Publication number 20240112952
- Publication date Apr 4, 2024
- Intel Corporation
- HUI JAE YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOCUMENT STRUCTURE FORMATION
- Publication number 20240105669
- Publication date Mar 28, 2024
- INFINEON TECHNOLOGIES AG
- Jens Pohl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED CONNECTION MEANS
- Publication number 20240096844
- Publication date Mar 21, 2024
- SIEMENS AKTIENGESELLSCHAFT
- PHILIPP KNEISSL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Al BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20240071978
- Publication date Feb 29, 2024
- NIPPON MICROMETAL CORPORATION
- Yuya SUTO
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device comprising PN junction diode and Schottky barr...

Power module semiconductor device and inverter equipment, and fabri...

Semiconductor packages

Interconnect wires including relatively low resistivity cores

Secure semiconductor integration and method for making thereof

Wire bond wires for interference shielding

Display substrate, tiled display panel and display device

Integrated circuit package having wirebonded multi-die stack

Semiconductor module and power conversion apparatus

Package-on-package assembly with wire bond vias

Floating die package

Power amplifier modules including semiconductor resistor and tantal...

Bonding wire

Semiconductor device packages, packaging methods, and packaged semi...

Al bonding wire

Light emitting device

Package with different types of semiconductor dies attached to a fl...

Semiconductor device including source pad region and drain pad regi...

Light-emitting substrate, method of manufacturing light-emitting su...

Impedance controlled electrical interconnection employing meta-mate...

Multiple plated via arrays of different wire heights on a same subs...

Radio frequency transmission line with finish plating on conductive...

Ribbon wire bond

Power module semiconductor device and inverter equipment, and fabri...

Power module semiconductor device and inverter equipment, and fabri...

Method of producing electronic components, corresponding electronic...

Smart packaging for improved medication regimen compliance

Semiconductor device comprising PN junction diode and Schottky barr...

Interconnect wires including relatively low resistivity cores

Light emitting device

Patents Applicationslast 30 patents

PRESS PACK POWER SEMICONDUCTOR DEVICE WITH LOCATOR STRIP

ELECTRONIC MODULES HAVING ELECTRICAL CONNECTION ELEMENTS IN THE FOR...

SEMICONDUCTOR DEVICE

INTERCONNECT WIRES INCLUDING RELATIVELY LOW RESISTIVITY CORES

SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING THE SAME, AND...

INTEGRATED CIRCUIT PACKAGE HAVING WIREBONDED MULTI-DIE STACK

DISPLAY SUBSTRATE, TILED DISPLAY PANEL AND DISPLAY DEVICE

MOLDED POWER DIE PACKAGE WITH VERTICAL INTERCONNECT

SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR DEVICE

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS

SEMICONDUCTOR DEVICE

METALLIZATIONS FOR SEMICONDUCTOR POWER DEVICES

POWER AMPLIFIER SYSTEMS INCLUDING CONTROL INTERFACE AND WIRE BOND PAD

SEMICONDUCTOR DEVICE PACKAGES, PACKAGING METHODS, AND PACKAGED SEMI...

LIGHT EMITTING DEVICE

MANUFACTURING METHOD FOR BONDED BODY, BONDED BODY, MANUFACTURING ME...

LIGHT-EMITTING SUBSTRATE, METHOD OF MANUFACTURING LIGHT-EMITTING SU...

POWER SEMICONDUCTOR PACKAGE INCLUDING A PASSIVE ELECTRONIC COMPONEN...

SEMICONDUCTOR MODULE

POWER MODULE SEMICONDUCTOR DEVICE AND INVERTER EQUIPMENT, AND FABRI...

STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH DIE SUPPORT MEMBERS AND A...

RIBBON WIRE BOND

POWER MODULE

METHOD OF PRODUCING ELECTRONIC COMPONENTS, CORRESPONDING ELECTRONIC...

POWER MODULE WITH IMPROVED ELECTRICAL COMPONENTS

SEMICONDUCTOR DEVICE COMPRISING PN JUNCTION DIODE AND SCHOTTKY BARR...

INTERCONNECT WIRES INCLUDING RELATIVELY LOW RESISTIVITY CORES

DOCUMENT STRUCTURE FORMATION

BONDED CONNECTION MEANS

Al BONDING WIRE FOR SEMICONDUCTOR DEVICES