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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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Industries

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Patents Grantslast 30 patents

Information Patent Grant
Embedded component package structure and manufacturing method thereof
- Patent number 12,267,961
- Issue date Apr 1, 2025
- Advanced Semiconductor Engineering, Inc.
- Chien-Fan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetic package for high CTE mismatch
- Patent number 12,266,582
- Issue date Apr 1, 2025
- Qorvo US, Inc.
- Dylan Murdock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor device including forming a first...
- Patent number 12,266,612
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Pin Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective metallization of integrated circuit packages
- Patent number 12,261,123
- Issue date Mar 25, 2025
- Advanced Technical Ceramics Company
- Aaron Fitzsimmons
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and a method of manufacturing the same
- Patent number 12,261,089
- Issue date Mar 25, 2025
- Advanced Semiconductor Engineering, Inc.
- Tsung-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package having wirebonded multi-die stack
- Patent number 12,237,305
- Issue date Feb 25, 2025
- Intel Corporation
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluidic assembly encapsulating light emitting diodes
- Patent number 12,230,743
- Issue date Feb 18, 2025
- ehux, Inc.
- Kenji Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device and semiconductor device
- Patent number 12,230,623
- Issue date Feb 18, 2025
- Kioxia Corporation
- Masaki Sekine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cold plates incorporating reactive multilayer systems and S-cells
- Patent number 12,207,450
- Issue date Jan 21, 2025
- TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA INC.
- Feng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies
- Patent number 12,199,063
- Issue date Jan 14, 2025
- Intel Corporation
- Shawna M. Liff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package using a polymer substrate
- Patent number 12,187,603
- Issue date Jan 7, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Yung Woo Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packaged semiconductor device having improved reliability and inspe...
- Patent number 12,183,707
- Issue date Dec 31, 2024
- STMicroelectronics S.r.l.
- Agatino Minotti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-free frame design for silicon bridges for semiconductor packages
- Patent number 12,170,253
- Issue date Dec 17, 2024
- Intel Corporation
- Dae-Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with lead between a plurality of encapsulated...
- Patent number 12,159,816
- Issue date Dec 3, 2024
- Rohm Co., Ltd.
- Kentaro Nasu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seamless interconnect thresholds using dielectric fluid channels
- Patent number 12,154,837
- Issue date Nov 26, 2024
- Sciperio, Inc.
- Jason Benoit
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and fabrication method thereof
- Patent number 12,136,581
- Issue date Nov 5, 2024
- Samsung Electronics Co., Ltd.
- Youngho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory bandwidth aggregation using simultaneous access of stacked s...
- Patent number 12,131,796
- Issue date Oct 29, 2024
- RAMBUS INC.
- Yohan Frans
- G11 - INFORMATION STORAGE
Information Patent Grant
Hermetic package for high CTE mismatch
- Patent number 12,119,281
- Issue date Oct 15, 2024
- Qorvo US, Inc.
- Dylan Murdock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated light emitting diodes for selective fluidic assembly
- Patent number 12,119,432
- Issue date Oct 15, 2024
- eLux, Inc.
- Kenji Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing thereof
- Patent number 12,119,321
- Issue date Oct 15, 2024
- Epistar Corporation
- Shih-An Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package and method of providing die-to-die interconnects...
- Patent number 12,113,026
- Issue date Oct 8, 2024
- Intel Corporation
- Henning Braunisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection between chips by bridge chip
- Patent number 12,094,825
- Issue date Sep 17, 2024
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density interconnect device and method
- Patent number 12,094,831
- Issue date Sep 17, 2024
- Tahoe Research, LTD.
- Mihir K Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device module having vertical metallic contacts and a...
- Patent number 12,080,669
- Issue date Sep 3, 2024
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-free frame design for silicon bridges for semiconductor packages
- Patent number 12,074,121
- Issue date Aug 27, 2024
- Intel Corporation
- Dae-Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and devices for fabricating and assembling printable semico...
- Patent number 12,074,213
- Issue date Aug 27, 2024
- The Board of Trustees of the University of Illinois
- Ralph G. Nuzzo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
3D integrations and methods of making thereof
- Patent number 12,068,231
- Issue date Aug 20, 2024
- BroadPak Corporation
- Farhang Yazdani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die fine grain integrated voltage regulation
- Patent number 12,068,324
- Issue date Aug 20, 2024
- Apple Inc.
- Jared L. Zerbe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages, antenna modules, and communication dev...
- Patent number 12,068,525
- Issue date Aug 20, 2024
- Intel Corporation
- Sidharth Dalmia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,057,434
- Issue date Aug 6, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Jin Seong Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE
- Publication number 20250105179
- Publication date Mar 27, 2025
- Mitsubishi Electric Corporation
- Chikara INADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES
- Publication number 20250096194
- Publication date Mar 20, 2025
- Intel Corporation
- Shawna M. Liff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING A SUBSTRATE WITH CAVITY, AND AN INTEGRATED DEVIC...
- Publication number 20250096051
- Publication date Mar 20, 2025
- QUALCOMM Incorporated
- Jaehyun YEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICE HAVING IMPROVED RELIABILITY AND INSPE...
- Publication number 20250087623
- Publication date Mar 13, 2025
- STMicroelectronics S.r.l.
- Agatino Minotti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY BANDWIDTH AGGREGATION USING SIMULTANEOUS ACCESS OF STACKED S...
- Publication number 20250087252
- Publication date Mar 13, 2025
- Rambus Inc.
- Yohan Frans
- G11 - INFORMATION STORAGE
Information Patent Application
PACKAGING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250079243
- Publication date Mar 6, 2025
- ABSOLICS INC.
- Sungjin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING PACKAGING SUBSTRATE AND PACKAGING SUBSTRATE...
- Publication number 20250079244
- Publication date Mar 6, 2025
- ABSOLICS INC.
- Sungjin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-FREE FRAME DESIGN FOR SILICON BRIDGES FOR SEMICONDUCTOR PACKAGES
- Publication number 20250070056
- Publication date Feb 27, 2025
- Intel Corporation
- Dae-Woo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES INCLUDING DAM STRUCTURES
- Publication number 20250062167
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Hansae Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250046728
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Dongwon KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing method of a system in package having several layers a...
- Publication number 20250038121
- Publication date Jan 30, 2025
- THALES
- Damien CHALAVOUX
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Submounts with Stud Protrusions for Semiconductor Packages
- Publication number 20250038056
- Publication date Jan 30, 2025
- Wolfspeed, Inc.
- Afshin Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-FREQUENCY MODULE
- Publication number 20250022817
- Publication date Jan 16, 2025
- MURATA MANUFACTURING CO., LTD.
- Tetsurou ASHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250015064
- Publication date Jan 9, 2025
- Samsung Electronics Co., Ltd.
- Yoon Young JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250015065
- Publication date Jan 9, 2025
- Samsung Electronics Co., Ltd.
- Myungsam KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Die Fine Grain Integrated Voltage Regulation
- Publication number 20250015033
- Publication date Jan 9, 2025
- Apple Inc.
- Jared L. Zerbe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR STACKING INTEGRATED CIRCUIT WAFERS AND DIES
- Publication number 20250015045
- Publication date Jan 9, 2025
- TOKYO ELECTRON LIMITED
- H. Jim Fulford
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS...
- Publication number 20240429173
- Publication date Dec 26, 2024
- Intel Corporation
- Henning BRAUNISCH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY INTERCONNECT DEVICE AND METHOD
- Publication number 20240421098
- Publication date Dec 19, 2024
- Tahoe Research, Ltd.
- Mihir K. ROY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD
- Publication number 20240407103
- Publication date Dec 5, 2024
- LG Innotek Co., Ltd.
- Chae Young YOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240395771
- Publication date Nov 28, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Jin Seong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING
- Publication number 20240387184
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yan-Yu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Forming a Semiconductor Device Having TSV Formed Through...
- Publication number 20240387393
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Pin Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE DEVICES AND MEMORY SYSTEMS
- Publication number 20240363588
- Publication date Oct 31, 2024
- Yangtze Memory Technologies Co., Ltd.
- XuHui Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR MAKING A SECURED SUBSTRATE
- Publication number 20240355722
- Publication date Oct 24, 2024
- BroadPak Corporation
- Farhang YAZDANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240355794
- Publication date Oct 24, 2024
- Samsung Electronics Co., Ltd.
- Choongbin YIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES, ANTENNA MODULES, AND COMMUNICATION DEV...
- Publication number 20240356198
- Publication date Oct 24, 2024
- Intel Corporation
- Sidharth Dalmia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED-CIRCUIT MODULE COLLECTION AND DEPOSITION
- Publication number 20240347367
- Publication date Oct 17, 2024
- X-CELEPRINT LIMITED
- Ronald S. Cok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY SUBSTRATE ROUTING IN PACKAGE
- Publication number 20240339428
- Publication date Oct 10, 2024
- Intel Corporation
- Weng Hong TEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE SEMICONDUCTOR ASSEMBLIES AND METHODS OF MANUFACT...
- Publication number 20240339390
- Publication date Oct 10, 2024
- Lodestar Licensing Group LLC
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Embedded component package structure and manufacturing method thereof

Hermetic package for high CTE mismatch

Method for forming a semiconductor device including forming a first...

Selective metallization of integrated circuit packages

Semiconductor device package and a method of manufacturing the same

Integrated circuit package having wirebonded multi-die stack

Fluidic assembly encapsulating light emitting diodes

Method for manufacturing semiconductor device and semiconductor device

Cold plates incorporating reactive multilayer systems and S-cells

Microelectronic assemblies

Semiconductor package using a polymer substrate

Packaged semiconductor device having improved reliability and inspe...

Metal-free frame design for silicon bridges for semiconductor packages

Semiconductor device with lead between a plurality of encapsulated...

Seamless interconnect thresholds using dielectric fluid channels

Semiconductor package structure and fabrication method thereof

Memory bandwidth aggregation using simultaneous access of stacked s...

Hermetic package for high CTE mismatch

Encapsulated light emitting diodes for selective fluidic assembly

Semiconductor device and a method of manufacturing thereof

Multi-chip package and method of providing die-to-die interconnects...

Interconnection between chips by bridge chip

High density interconnect device and method

Semiconductor device module having vertical metallic contacts and a...

Metal-free frame design for silicon bridges for semiconductor packages

Methods and devices for fabricating and assembling printable semico...

3D integrations and methods of making thereof

Multi-die fine grain integrated voltage regulation

Integrated circuit packages, antenna modules, and communication dev...

Semiconductor package and manufacturing method thereof

Patents Applicationslast 30 patents

SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE

MICROELECTRONIC ASSEMBLIES

PACKAGE COMPRISING A SUBSTRATE WITH CAVITY, AND AN INTEGRATED DEVIC...

PACKAGED SEMICONDUCTOR DEVICE HAVING IMPROVED RELIABILITY AND INSPE...

MEMORY BANDWIDTH AGGREGATION USING SIMULTANEOUS ACCESS OF STACKED S...

PACKAGING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

METHOD OF MANUFACTURING PACKAGING SUBSTRATE AND PACKAGING SUBSTRATE...

METAL-FREE FRAME DESIGN FOR SILICON BRIDGES FOR SEMICONDUCTOR PACKAGES

SEMICONDUCTOR PACKAGES INCLUDING DAM STRUCTURES

SEMICONDUCTOR PACKAGE

Manufacturing method of a system in package having several layers a...

Submounts with Stud Protrusions for Semiconductor Packages

HIGH-FREQUENCY MODULE

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR PACKAGE

Multi-Die Fine Grain Integrated Voltage Regulation

METHOD FOR STACKING INTEGRATED CIRCUIT WAFERS AND DIES

MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS...

HIGH DENSITY INTERCONNECT DEVICE AND METHOD

CIRCUIT BOARD

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING

Method for Forming a Semiconductor Device Having TSV Formed Through...

CHIP PACKAGE DEVICES AND MEMORY SYSTEMS

APPARATUS AND METHOD FOR MAKING A SECURED SUBSTRATE

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

INTEGRATED CIRCUIT PACKAGES, ANTENNA MODULES, AND COMMUNICATION DEV...

INTEGRATED-CIRCUIT MODULE COLLECTION AND DEPOSITION

HIGH DENSITY SUBSTRATE ROUTING IN PACKAGE

PACKAGE-ON-PACKAGE SEMICONDUCTOR ASSEMBLIES AND METHODS OF MANUFACT...