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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/2505Shape

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Patents Grantslast 30 patents

Information Patent Grant
Package and package-on-package structure having elliptical columns...
- Patent number 12,051,634
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Huan Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density substrate routing in package
- Patent number 12,051,667
- Issue date Jul 30, 2024
- Intel Corporation
- Weng Hong Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-on-lead semiconductor device, and corresponding method of manu...
- Patent number 11,887,959
- Issue date Jan 30, 2024
- STMicroelectronics S.r.l.
- Michele Derai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 11,830,798
- Issue date Nov 28, 2023
- Advanced Semiconductor Engineering, Inc.
- You-Lung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density substrate routing in package
- Patent number 11,810,884
- Issue date Nov 7, 2023
- Intel Corporation
- Weng Hong Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and package-on-package structure having elliptical columns...
- Patent number 11,756,849
- Issue date Sep 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Huan Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,710,715
- Issue date Jul 25, 2023
- Samsung Electronics Co., Ltd.
- Joo Hyung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing
- Patent number 11,430,776
- Issue date Aug 30, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and package-on-package structure having elliptical columns...
- Patent number 11,404,341
- Issue date Aug 2, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Huan Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density substrate routing in package
- Patent number 11,251,150
- Issue date Feb 15, 2022
- Intel Corporation
- Weng Hong Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density substrate routing in package
- Patent number 10,861,815
- Issue date Dec 8, 2020
- Intel Corporation
- Weng Hong Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density substrate routing in package
- Patent number 10,438,915
- Issue date Oct 8, 2019
- Intel Corporation
- Weng Hong Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and production method therefor
- Patent number 10,236,244
- Issue date Mar 19, 2019
- Fuji Electric Co., Ltd.
- Keisuke Ogura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density substrate routing in package
- Patent number 10,199,346
- Issue date Feb 5, 2019
- Intel Corporation
- Weng Hong Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density substrate routing in BBUL package
- Patent number 9,929,119
- Issue date Mar 27, 2018
- Intel Corporation
- Weng Hong Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with interposer structure and m...
- Patent number 9,659,897
- Issue date May 23, 2017
- STATS ChipPAC Pte. Ltd.
- Zigmund Ramirez Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density substrate routing in BBUL package
- Patent number 9,437,569
- Issue date Sep 6, 2016
- Intel Corporation
- Weng Hong Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with interposer structure and m...
- Patent number 9,355,983
- Issue date May 31, 2016
- Stats Chippac Ltd.
- Zigmund Ramirez Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density substrate routing in BBUL package
- Patent number 9,171,816
- Issue date Oct 27, 2015
- Intel Corporation
- Weng Hong Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting method of electronic components, manufacturing method of e...
- Patent number 7,906,370
- Issue date Mar 15, 2011
- TDK Corporation
- Takaaki Morita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
HIGH DENSITY SUBSTRATE ROUTING IN PACKAGE
- Publication number 20240339428
- Publication date Oct 10, 2024
- Intel Corporation
- Weng Hong TEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices and Methods of Manufacturing
- Publication number 20220359489
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20220302008
- Publication date Sep 22, 2022
- Advanced Semiconductor Engineering, Inc.
- You-Lung YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-ON-LEAD SEMICONDUCTOR DEVICE, AND CORRESPONDING METHOD OF MANU...
- Publication number 20220199564
- Publication date Jun 23, 2022
- STMicroelectronics S.r.l
- Michele DERAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING
- Publication number 20210391317
- Publication date Dec 16, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20210384153
- Publication date Dec 9, 2021
- Samsung Electronics Co., Ltd.
- Joo Hyung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY SUBSTRATE ROUTING IN PACKAGE
- Publication number 20190393180
- Publication date Dec 26, 2019
- Intel Corporation
- Weng Hong Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY SUBSTRATE ROUTING IN PACKAGE
- Publication number 20190139926
- Publication date May 9, 2019
- Intel Corporation
- Weng Hong Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY SUBSTRATE ROUTING IN PACKAGE
- Publication number 20180145047
- Publication date May 24, 2018
- Intel Corporation
- Weng Hong Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY SUBSTRATE ROUTING IN BBUL PACKAGE
- Publication number 20150194406
- Publication date Jul 9, 2015
- Intel Corporation
- Weng Hong Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY SUBSTRATE ROUTING IN BBUL PACKAGE
- Publication number 20140159228
- Publication date Jun 12, 2014
- Weng Hong Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mounting method of electronic components, manufacturing method of e...
- Publication number 20080211086
- Publication date Sep 4, 2008
- TDK Corporation
- Takaaki Morita
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Package and package-on-package structure having elliptical columns...

High density substrate routing in package

Chip-on-lead semiconductor device, and corresponding method of manu...

Semiconductor device package

High density substrate routing in package

Package and package-on-package structure having elliptical columns...

Semiconductor package

Semiconductor devices and methods of manufacturing

Package and package-on-package structure having elliptical columns...

High density substrate routing in package

High density substrate routing in package

High density substrate routing in package

Semiconductor device and production method therefor

High density substrate routing in package

High density substrate routing in BBUL package

Integrated circuit packaging system with interposer structure and m...

High density substrate routing in BBUL package

Integrated circuit packaging system with interposer structure and m...

High density substrate routing in BBUL package

Mounting method of electronic components, manufacturing method of e...

Patents Applicationslast 30 patents

HIGH DENSITY SUBSTRATE ROUTING IN PACKAGE

Semiconductor Devices and Methods of Manufacturing

SEMICONDUCTOR DEVICE PACKAGE

CHIP-ON-LEAD SEMICONDUCTOR DEVICE, AND CORRESPONDING METHOD OF MANU...

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING

SEMICONDUCTOR PACKAGE

HIGH DENSITY SUBSTRATE ROUTING IN PACKAGE

HIGH DENSITY SUBSTRATE ROUTING IN PACKAGE

HIGH DENSITY SUBSTRATE ROUTING IN PACKAGE

HIGH DENSITY SUBSTRATE ROUTING IN BBUL PACKAGE

HIGH DENSITY SUBSTRATE ROUTING IN BBUL PACKAGE

Mounting method of electronic components, manufacturing method of e...