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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/0501Shape

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with composite conductive features and method...
- Patent number 12,218,087
- Issue date Feb 4, 2025
- NANYA TECHNOLOGY CORPORATION
- Teng-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passivation structure with planar top surfaces
- Patent number 12,218,022
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Hsiu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip parts
- Patent number 12,218,123
- Issue date Feb 4, 2025
- Rohm Co., Ltd.
- Keisuke Fukae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier structures between external electrical connectors
- Patent number 12,218,035
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Chun Miao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of semiconductor device
- Patent number 12,191,266
- Issue date Jan 7, 2025
- Kabushiki Kaisha Toshiba
- Emiko Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of an electronic apparatus
- Patent number 12,191,277
- Issue date Jan 7, 2025
- INNOLUX CORPORATION
- Ming-Chang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing package structure
- Patent number 12,183,695
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,183,701
- Issue date Dec 31, 2024
- Rohm Co., Ltd.
- Bungo Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate and semiconductor package including the same
- Patent number 12,176,308
- Issue date Dec 24, 2024
- Samsung Electronics Co., Ltd.
- Youngkyu Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip structure
- Patent number 12,176,245
- Issue date Dec 24, 2024
- Samsung Electronics Co., Ltd.
- Sangjun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,165,960
- Issue date Dec 10, 2024
- Rohm Co., Ltd.
- Hiroaki Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,165,998
- Issue date Dec 10, 2024
- Fuji Electric Co., Ltd.
- Tohru Shirakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,165,997
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Hung Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor with integrated passive components
- Patent number 12,159,845
- Issue date Dec 3, 2024
- NXP USA, INC.
- Humayun Kabir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 12,159,882
- Issue date Dec 3, 2024
- KYOCERA Coporation
- Hiroaki Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with barrier layer
- Patent number 12,148,722
- Issue date Nov 19, 2024
- NANYA TECHNOLOGY CORPORATION
- Ming-Hung Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Efficient redistribution layer topology
- Patent number 12,142,586
- Issue date Nov 12, 2024
- Texas Instruments Incorporated
- Vivek Swaminathan Sridharan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,142,588
- Issue date Nov 12, 2024
- Samsung Electronics Co., Ltd.
- Joohee Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 12,142,587
- Issue date Nov 12, 2024
- Samsung Electronics Co., Ltd.
- Jinho Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip bonding method and semiconductor chip structure
- Patent number 12,119,315
- Issue date Oct 15, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Chih-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patterned and planarized under-bump metallization
- Patent number 12,119,316
- Issue date Oct 15, 2024
- NXP USA, INC.
- Namrata Kanth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 12,119,314
- Issue date Oct 15, 2024
- Mitsubishi Electric Corporation
- Nobuyoshi Kimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device with redistribution plugs
- Patent number 12,112,978
- Issue date Oct 8, 2024
- NANYA TECHNOLOGY CORPORATION
- Chun-Cheng Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and manufacturing method thereof
- Patent number 12,087,748
- Issue date Sep 10, 2024
- Samsung Display Co., Ltd.
- Jong Hwan Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method to minimize stress on stack via
- Patent number 12,080,600
- Issue date Sep 3, 2024
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip, circuit board and electronic device comprising polygonal pads
- Patent number 12,057,420
- Issue date Aug 6, 2024
- BEIJING XIAOMI MOBILE SOFTWARE CO., LTD.
- Jinfu Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures with integrated passive component
- Patent number 12,057,383
- Issue date Aug 6, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and semiconductor packages including the same
- Patent number 12,040,294
- Issue date Jul 16, 2024
- Samsung Electronics Co., Ltd.
- Ju-Il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure
- Patent number 12,033,969
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming the same
- Patent number 12,021,051
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250038141
- Publication date Jan 30, 2025
- Samsung Electronics Co., Ltd.
- Joohee Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Grain Structure Engineering for Metal Gapfill Materials
- Publication number 20250038137
- Publication date Jan 30, 2025
- Applied Materials, Inc.
- Prayudi LIANTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EFFICIENT REDISTRIBUTION LAYER TOPOLOGY
- Publication number 20250029943
- Publication date Jan 23, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Vivek Swaminathan SRIDHARAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20250029941
- Publication date Jan 23, 2025
- Samsung Electronics Co., Ltd.
- HYUNSU HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE
- Publication number 20250022822
- Publication date Jan 16, 2025
- ROHM CO., LTD.
- Hirofumi TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE
- Publication number 20250022821
- Publication date Jan 16, 2025
- ROHM CO., LTD.
- Hirofumi TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250006718
- Publication date Jan 2, 2025
- SAMSUNG DISPLAY CO., LTD.
- Jong Hwan CHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250006618
- Publication date Jan 2, 2025
- Samsung Electronics Co., Ltd.
- Jing Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250006644
- Publication date Jan 2, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzuan-Horng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240413125
- Publication date Dec 12, 2024
- Samsung Electronics Co., Ltd.
- Seho You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240395743
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Hung Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD DESIGN FOR SEMICONDUCTOR DEVICE PACKAGES
- Publication number 20240387423
- Publication date Nov 21, 2024
- NEXPERIA B.V.
- Vasantha Kumar Vaddagere Nagaraju
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCED-SIZE DIE, RELATED DEVICES AND METHODS
- Publication number 20240371807
- Publication date Nov 7, 2024
- Skyworks Solutions, Inc.
- Junhyung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240363572
- Publication date Oct 31, 2024
- ROHM CO., LTD.
- Akinori NII
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20240363566
- Publication date Oct 31, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Wang Gu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON CARBIDE SEMICONDUCTOR DEVICE
- Publication number 20240339419
- Publication date Oct 10, 2024
- Sumitomo Electric Industries, Ltd.
- Shota SAMBONSUGE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING UPPER CONDUCTIVE PATTERNS AND SEMICOND...
- Publication number 20240332228
- Publication date Oct 3, 2024
- Samsung Electronics Co., Ltd.
- Joongwon SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240321831
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Insup SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING-TYPE INTERCONNECTION MEMBER
- Publication number 20240321789
- Publication date Sep 26, 2024
- Kabushiki Kaisha Toshiba
- Kazuyuki HIGASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING-TYPE INTERCONNECTION MEMBER
- Publication number 20240321790
- Publication date Sep 26, 2024
- Kabushiki Kaisha Toshiba
- Kei OBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240304576
- Publication date Sep 12, 2024
- KIOXIA Corporation
- Yuya KIYOMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method of Forming a Joint Assembly
- Publication number 20240282743
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ying-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD...
- Publication number 20240274554
- Publication date Aug 15, 2024
- NANYA TECHNOLOGY CORPORATION
- Teng-Yen HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20240274556
- Publication date Aug 15, 2024
- Samsung Electronics Co., Ltd.
- Won CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER, METHOD FOR FABRICATING THE SAME, AND SEMICONDUCTOR PACK...
- Publication number 20240274553
- Publication date Aug 15, 2024
- Samsung Electronics Co., Ltd.
- Yukyung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL STRUCTURE
- Publication number 20240274653
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yuan-Yang Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND POWER CONVERTING DEVICE
- Publication number 20240274557
- Publication date Aug 15, 2024
- Mitsubishi Electric Corporation
- Yo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLY INCLUDING TERMINAL PADS ASSOCIATED WITH CONDUCTIVE TRACES...
- Publication number 20240258256
- Publication date Aug 1, 2024
- Micron Technology, Inc.
- Travis M. Jensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20240250048
- Publication date Jul 25, 2024
- TDK Corporation
- Kosuke TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD...
- Publication number 20240250047
- Publication date Jul 25, 2024
- NANYA TECHNOLOGY CORPORATION
- Teng-Yen HUANG
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device with composite conductive features and method...

Passivation structure with planar top surfaces

Chip parts

Barrier structures between external electrical connectors

Semiconductor device and manufacturing method of semiconductor device

Manufacturing method of an electronic apparatus

Method of manufacturing package structure

Semiconductor device

Package substrate and semiconductor package including the same

Semiconductor chip structure

Semiconductor device

Semiconductor device

Semiconductor device and method of manufacturing the same

Transistor with integrated passive components

Display device

Semiconductor device with barrier layer

Efficient redistribution layer topology

Semiconductor device and method of manufacturing the same

Semiconductor device and method of fabricating the same

Chip bonding method and semiconductor chip structure

Patterned and planarized under-bump metallization

Semiconductor device and method for manufacturing semiconductor device

Method for fabricating semiconductor device with redistribution plugs

Display device and manufacturing method thereof

Semiconductor device and method to minimize stress on stack via

Chip, circuit board and electronic device comprising polygonal pads

Bonded structures with integrated passive component

Semiconductor devices and semiconductor packages including the same

Chip package structure

Semiconductor package and method of forming the same

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Grain Structure Engineering for Metal Gapfill Materials

EFFICIENT REDISTRIBUTION LAYER TOPOLOGY

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE

DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

BOND PAD DESIGN FOR SEMICONDUCTOR DEVICE PACKAGES

REDUCED-SIZE DIE, RELATED DEVICES AND METHODS

SEMICONDUCTOR DEVICE

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

SILICON CARBIDE SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICES HAVING UPPER CONDUCTIVE PATTERNS AND SEMICOND...

SEMICONDUCTOR PACKAGE

BONDING-TYPE INTERCONNECTION MEMBER

BONDING-TYPE INTERCONNECTION MEMBER

SEMICONDUCTOR DEVICE

Structure and Method of Forming a Joint Assembly

SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD...

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

INTERPOSER, METHOD FOR FABRICATING THE SAME, AND SEMICONDUCTOR PACK...

METAL-INSULATOR-METAL STRUCTURE

SEMICONDUCTOR DEVICE AND POWER CONVERTING DEVICE

ASSEMBLY INCLUDING TERMINAL PADS ASSOCIATED WITH CONDUCTIVE TRACES...

ELECTRONIC COMPONENT

SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD...