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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/2405Shape

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Display device
- Patent number 12,165,932
- Issue date Dec 10, 2024
- LG Display Co., Ltd.
- Seeun Kim
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Semiconductor device structure with composite bottle-shaped through...
- Patent number 12,159,852
- Issue date Dec 3, 2024
- NANYA TECHNOLOGY CORPORATION
- Sheng-Hui Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method for manufacturing display device
- Patent number 12,155,022
- Issue date Nov 26, 2024
- Samsung Display Co., Ltd.
- Young Rag Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dipole alignment apparatus for use in manufacturing of display devi...
- Patent number 12,068,279
- Issue date Aug 20, 2024
- Samsung Display Co., Ltd.
- Won Ho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and package-on-package structure having elliptical columns...
- Patent number 12,051,634
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Huan Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode display device
- Patent number 11,990,458
- Issue date May 21, 2024
- LG Display Co., Ltd.
- Jae Yong Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die and package structure
- Patent number 11,948,904
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked integrated circuits with redistribution lines
- Patent number 11,923,338
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Ying Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method of manufacturing the same
- Patent number 11,901,374
- Issue date Feb 13, 2024
- Samsung Display Co., Ltd.
- Hang Jae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-on-lead semiconductor device, and corresponding method of manu...
- Patent number 11,887,959
- Issue date Jan 30, 2024
- STMicroelectronics S.r.l.
- Michele Derai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 11,855,055
- Issue date Dec 26, 2023
- Samsung Display Co., Ltd.
- Seung Lyong Bok
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Display device
- Patent number 11,848,335
- Issue date Dec 19, 2023
- Samsung Display Co., Ltd.
- Won Sik Oh
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Electrical interconnect structure using metal bridges to interconne...
- Patent number 11,810,895
- Issue date Nov 7, 2023
- Honeywell Federal Manufacturing & Technologies, LLC
- Barbara Diane Young
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display panel, display device and control method
- Patent number 11,811,004
- Issue date Nov 7, 2023
- Hubei Yangtze Industrial Innovation Center Of Advanced Display Co., Ltd.
- Liang Xing
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Display device
- Patent number 11,791,447
- Issue date Oct 17, 2023
- Samsung Display Co., Ltd.
- Hyun Wook Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode display with redundancy scheme
- Patent number 11,778,842
- Issue date Oct 3, 2023
- Apple Inc.
- Andreas Bibl
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Package and package-on-package structure having elliptical columns...
- Patent number 11,756,849
- Issue date Sep 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Huan Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor structure
- Patent number 11,735,555
- Issue date Aug 22, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,710,715
- Issue date Jul 25, 2023
- Samsung Electronics Co., Ltd.
- Joo Hyung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly and method therefor
- Patent number 11,557,565
- Issue date Jan 17, 2023
- NXP USA, INC.
- Jinbang Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die package with bridge layer
- Patent number 11,476,125
- Issue date Oct 18, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Sen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems, methods, and apparatuses for implementing reduced height s...
- Patent number 11,469,213
- Issue date Oct 11, 2022
- Intel Corporation
- Georg Seidemann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and package-on-package structure having elliptical columns...
- Patent number 11,404,341
- Issue date Aug 2, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Huan Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode display with redundancy scheme
- Patent number 11,380,862
- Issue date Jul 5, 2022
- Apple Inc.
- Andreas Bibi
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Package structure and method of manufacturing the same
- Patent number 11,282,804
- Issue date Mar 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 11,183,475
- Issue date Nov 23, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bare die integration with printed components on flexible substrate...
- Patent number 11,122,683
- Issue date Sep 14, 2021
- Palo Alto Research Center Incorporated
- Tse Nga Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating semiconductor package
- Patent number 11,031,371
- Issue date Jun 8, 2021
- SanDisk Information Technology (Shanghai) Co., Ltd.
- Chin Tien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode display with redundancy scheme
- Patent number 10,964,900
- Issue date Mar 30, 2021
- Apple Inc.
- Andreas Bibl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming interposer frame over se...
- Patent number RE48408
- Issue date Jan 26, 2021
- JCET Semiconductor (Shaoxing) Co., Ltd.
- Reza A. Pagaila

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240413115
- Publication date Dec 12, 2024
- Advanced Semiconductor Engineering, Inc.
- Yu-Ling YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE
- Publication number 20240404977
- Publication date Dec 5, 2024
- ROHM CO., LTD.
- Kazunori FUJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240258465
- Publication date Aug 1, 2024
- LG Display Co., Ltd.
- Minjae KANG
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
DISPLAY DEVICE
- Publication number 20240222200
- Publication date Jul 4, 2024
- LG Display Co., Ltd.
- Seeun KIM
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
METHODS OF FORMING BONDING STRUCTURES
- Publication number 20240203923
- Publication date Jun 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsing-Yuan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE AND PACKAGE STRUCTURE
- Publication number 20240203924
- Publication date Jun 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL AND MANUFACTURING METHOD THEREOF
- Publication number 20240178357
- Publication date May 30, 2024
- AUO Corporation
- Shih-Hsiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED INTEGRATED CIRCUITS WITH REDISTRIBUTION LINES
- Publication number 20240170457
- Publication date May 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Ying Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL AND MANUFACTURING METHOD THEREOF
- Publication number 20240162406
- Publication date May 16, 2024
- AUO Corporation
- Chieh-Ming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT PACKAGE HAVING BALL GRID ARRAY SUBSTRATE WITH SIGNAL AND PO...
- Publication number 20240145363
- Publication date May 2, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Vivek SRIDHARAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240047288
- Publication date Feb 8, 2024
- InnoLux Corporation
- Sheng-Nan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DIODE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240021593
- Publication date Jan 18, 2024
- UNITED MICROELECTRONICS CORP.
- ZHIBIAO ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES INCLUDING STACKED DIES COUPLED BY A THRO...
- Publication number 20240006366
- Publication date Jan 4, 2024
- Intel Corporation
- Stephen Morein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME
- Publication number 20240008298
- Publication date Jan 4, 2024
- Apple Inc.
- Andreas Bibl
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH COMPOSITE BOTTLE-SHAPED THROUGH...
- Publication number 20230352433
- Publication date Nov 2, 2023
- NANYA TECHNOLOGY CORPORATION
- SHENG-HUI YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH COMPOSITE BOTTLE-SHAPED THROUGH...
- Publication number 20230352434
- Publication date Nov 2, 2023
- NANYA TECHNOLOGY CORPORATION
- SHENG-HUI YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE WITH INTEGRATED OFF-DIE INDUCTOR
- Publication number 20230268306
- Publication date Aug 24, 2023
- Xilinx, Inc.
- Jing Jing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20230260980
- Publication date Aug 17, 2023
- SAMSUNG DISPLAY CO., LTD.
- Myeong Su SO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT CHIP PACKAGE THAT DOES NOT UTILIZE A LEADFRAME
- Publication number 20230245992
- Publication date Aug 3, 2023
- STMicroelectronics Pte Ltd
- Jing-En LUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230230967
- Publication date Jul 20, 2023
- SAMSUNG DISPLAY CO., LTD.
- In Woo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH EXPOSED ELECTRICAL CONTACTS
- Publication number 20230230949
- Publication date Jul 20, 2023
- STMicroelectronics Pte Ltd
- Yong CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20230207543
- Publication date Jun 29, 2023
- SAMSUNG DISPLAY CO., LTD.
- Jae Hoon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED HEAT DISSIPATION POWER SEMICONDUCTOR MODULE AND METHOD...
- Publication number 20230197557
- Publication date Jun 22, 2023
- LX Semicon Co., Ltd.
- Tae Ryong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20230163138
- Publication date May 25, 2023
- SAMSUNG DISPLAY CO., LTD.
- Dong Hee SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230154906
- Publication date May 18, 2023
- SAMSUNG DISPLAY CO., LTD.
- Dong Hyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL MANUFACTURING APPARATUS AND DISPLAY PANEL MANUFACTURI...
- Publication number 20230125730
- Publication date Apr 27, 2023
- SAMSUNG DISPLAY CO., LTD.
- Byung Kyu SON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20230122457
- Publication date Apr 20, 2023
- SAMSUNG DISPLAY CO., LTD.
- Eui Kang HEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL INTERCONNECT STRUCTURE USING METAL BRIDGES TO INTERCONNE...
- Publication number 20230121991
- Publication date Apr 20, 2023
- HONEYWELL FEDERAL MANUFACTURING & TECHNOLOGIES, LLC
- Barbara Diane Young
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER INTERCONNECTS WITH SELF-ALIGNED HOURGLASS-SHAPED METAL CAP
- Publication number 20230110587
- Publication date Apr 13, 2023
- International Business Machines Corporation
- Koichi Motoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL
- Publication number 20230112531
- Publication date Apr 13, 2023
- AU OPTRONICS CORPORATION
- Yang-En Wu
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Display device

Semiconductor device structure with composite bottle-shaped through...

Display device and method for manufacturing display device

Dipole alignment apparatus for use in manufacturing of display devi...

Package and package-on-package structure having elliptical columns...

Light emitting diode display device

Die and package structure

Stacked integrated circuits with redistribution lines

Display device and method of manufacturing the same

Chip-on-lead semiconductor device, and corresponding method of manu...

Display device

Display device

Electrical interconnect structure using metal bridges to interconne...

Display panel, display device and control method

Display device

Light emitting diode display with redundancy scheme

Package and package-on-package structure having elliptical columns...

Manufacturing method of semiconductor structure

Semiconductor package

Semiconductor device assembly and method therefor

Multi-die package with bridge layer

Systems, methods, and apparatuses for implementing reduced height s...

Package and package-on-package structure having elliptical columns...

Light emitting diode display with redundancy scheme

Package structure and method of manufacturing the same

Semiconductor structure

Bare die integration with printed components on flexible substrate...

Semiconductor package and method of fabricating semiconductor package

Light emitting diode display with redundancy scheme

Semiconductor device and method of forming interposer frame over se...

Patents Applicationslast 30 patents

PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE

DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME

DISPLAY DEVICE

METHODS OF FORMING BONDING STRUCTURES

DIE AND PACKAGE STRUCTURE

DISPLAY PANEL AND MANUFACTURING METHOD THEREOF

STACKED INTEGRATED CIRCUITS WITH REDISTRIBUTION LINES

DISPLAY PANEL AND MANUFACTURING METHOD THEREOF

FAN-OUT PACKAGE HAVING BALL GRID ARRAY SUBSTRATE WITH SIGNAL AND PO...

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

LIGHT-EMITTING DIODE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

MICROELECTRONIC ASSEMBLIES INCLUDING STACKED DIES COUPLED BY A THRO...

LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME

SEMICONDUCTOR DEVICE STRUCTURE WITH COMPOSITE BOTTLE-SHAPED THROUGH...

SEMICONDUCTOR DEVICE STRUCTURE WITH COMPOSITE BOTTLE-SHAPED THROUGH...

CHIP PACKAGE WITH INTEGRATED OFF-DIE INDUCTOR

DISPLAY DEVICE

INTEGRATED CIRCUIT CHIP PACKAGE THAT DOES NOT UTILIZE A LEADFRAME

DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE WITH EXPOSED ELECTRICAL CONTACTS

DISPLAY DEVICE

DOUBLE-SIDED HEAT DISSIPATION POWER SEMICONDUCTOR MODULE AND METHOD...

DISPLAY DEVICE

DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME

DISPLAY PANEL MANUFACTURING APPARATUS AND DISPLAY PANEL MANUFACTURI...

DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME

ELECTRICAL INTERCONNECT STRUCTURE USING METAL BRIDGES TO INTERCONNE...

COPPER INTERCONNECTS WITH SELF-ALIGNED HOURGLASS-SHAPED METAL CAP

DISPLAY PANEL