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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/48451Shape

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package
- Patent number 12,159,857
- Issue date Dec 3, 2024
- Samsung Electronics Co., Ltd.
- Jungseok Ryu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding for semiconductor devices
- Patent number 11,901,327
- Issue date Feb 13, 2024
- Western Digital Technologies, Inc.
- Yang Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal block and bond pad structure
- Patent number 11,088,192
- Issue date Aug 10, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Ying Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 10,903,129
- Issue date Jan 26, 2021
- Rohm Co., Ltd.
- Motoharu Haga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,840,208
- Issue date Nov 17, 2020
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tetsuya Oyamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and ball bonder
- Patent number 10,497,662
- Issue date Dec 3, 2019
- ABLIC Inc.
- Tomomitsu Risaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 10,332,815
- Issue date Jun 25, 2019
- Rohm Co., Ltd.
- Motoharu Haga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal block and bond pad structure
- Patent number 10,297,631
- Issue date May 21, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Ying Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,163,850
- Issue date Dec 25, 2018
- Rohm Co., Ltd.
- Motoharu Haga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 9,780,069
- Issue date Oct 3, 2017
- Rohm Co., Ltd.
- Motoharu Haga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip package and method for forming the same
- Patent number 9,761,510
- Issue date Sep 12, 2017
- Xintec Inc.
- Chien-Hung Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 9,698,068
- Issue date Jul 4, 2017
- Rohm Co., Ltd.
- Motoharu Haga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Current sensor device
- Patent number 9,658,296
- Issue date May 23, 2017
- Infineon Technologies AG
- Udo Ausserlechner
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Copper ball bond features and structure
- Patent number 9,461,012
- Issue date Oct 4, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Leo M. Higgins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 9,412,711
- Issue date Aug 9, 2016
- Rohm Co., Ltd.
- Kenji Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing an imaging apparatus having a frame member...
- Patent number 9,325,921
- Issue date Apr 26, 2016
- Sony Corporation
- Yasuhiro Kamada
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor device and a manufacturing method thereof
- Patent number 9,230,937
- Issue date Jan 5, 2016
- Renesas Electronics Corporation
- Kaori Sumitomo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 9,230,892
- Issue date Jan 5, 2016
- Sumitomo Bakelite Co., Ltd.
- Shingo Itoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper ball bond features and structure
- Patent number 8,907,485
- Issue date Dec 9, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Leo M. Higgins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging device, method of fabricating solid-state imagi...
- Patent number 8,363,136
- Issue date Jan 29, 2013
- Sony Corporation
- Kentaro Akiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging device, method of fabricating solid-state imagi...
- Patent number 8,300,127
- Issue date Oct 30, 2012
- Sony Corporation
- Kentaro Akiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package including wire bonds
- Patent number 7,888,257
- Issue date Feb 15, 2011
- Agere Systems Inc.
- Joze Eura Antol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 7,605,478
- Issue date Oct 20, 2009
- Samsung Electronics Co., Ltd.
- Kyung-Man Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding capillary tool having multiple outer steps
- Patent number 7,597,231
- Issue date Oct 6, 2009
- Small Precision Tools Inc.
- Jaime Castaneda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bond capillary tip
- Patent number 7,407,080
- Issue date Aug 5, 2008
- ChipPAC, Inc.
- Kenny Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for bonding a wire
- Patent number 7,371,675
- Issue date May 13, 2008
- Samsung Electronics Co., Ltd.
- In-Ku Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond with improved shear strength
- Patent number 7,314,157
- Issue date Jan 1, 2008
- ASM Technology Singapore Pte. Ltd.
- Yam Mo Wong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for forming conductive bumps and wire loops
- Patent number 7,188,759
- Issue date Mar 13, 2007
- Kulicke and Soffa Industries, Inc.
- Dodgie Reigh Manzano Calpito
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding simulation
- Patent number 7,085,699
- Issue date Aug 1, 2006
- Texas Instruments Incorporated
- Manjula N. Variyam
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Capillary with contained inner chamfer
- Patent number 7,004,369
- Issue date Feb 28, 2006
- Kulicke & Soffa Investments, Inc.
- Gil Perlberg
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230378018
- Publication date Nov 23, 2023
- Rohm Co., Ltd.
- Hajime OKUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL BLOCK AND BOND PAD STRUCTURE
- Publication number 20180342552
- Publication date Nov 29, 2018
- Taiwan Semiconductor Manufacturing Co., LTD
- Cheng-Ying Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND BALL BONDER
- Publication number 20180294243
- Publication date Oct 11, 2018
- SII Semiconductor Corporation
- Tomomitsu RISAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180005981
- Publication date Jan 4, 2018
- Rohm Co., Ltd.
- Motoharu HAGA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20170271225
- Publication date Sep 21, 2017
- ROHM CO., LTD.
- Motoharu HAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A RESIN LAYER AND METHOD OF MANUFACTURING...
- Publication number 20170133344
- Publication date May 11, 2017
- Kabushiki Kaisha Toshiba
- Satoru TAKAKU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20150325552
- Publication date Nov 12, 2015
- XINTEC INC.
- Chien-Hung LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20150325551
- Publication date Nov 12, 2015
- XINTEC INC.
- Ying-Nan WEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPILLARY BONDING TOOL AND METHOD OF FORMING WIRE BONDS
- Publication number 20140374467
- Publication date Dec 25, 2014
- Jia Lin Yap
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper Ball Bond Features and Structure
- Publication number 20140054781
- Publication date Feb 27, 2014
- Leo M. Higgins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD THEREOF
- Publication number 20120286427
- Publication date Nov 15, 2012
- Renesas Electronics Corporation
- Kaori Sumitomo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING APPARATUS, METHOD FOR MANUFACTURING THE SAME, A...
- Publication number 20120257075
- Publication date Oct 11, 2012
- SONY CORPORATION
- Yasuhiro Kamada
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SOLID-STATE IMAGING DEVICE, METHOD OF FABRICATING SOLID-STATE IMAGI...
- Publication number 20110261223
- Publication date Oct 27, 2011
- SONY CORPORATION
- Kentaro Akiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20100013083
- Publication date Jan 21, 2010
- Samsung Electronics Co., Ltd.
- Kyung-Man KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING CAPILLARY TOOL HAVING MULTIPLE OUTER STEPS
- Publication number 20090308911
- Publication date Dec 17, 2009
- SMALL PRECISION TOOLS INC.
- Jaime Castaneda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLID-STATE IMAGING DEVICE, METHOD OF FABRICATING SOLID-STATE IMAGI...
- Publication number 20090185060
- Publication date Jul 23, 2009
- SONY CORPORATION
- Kentaro Akiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit package including wire bonds
- Publication number 20090098687
- Publication date Apr 16, 2009
- Joze Eura Antol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOUND WIREBONDING AND METHOD FOR MINIMIZING INTEGRATED CIRCUIT D...
- Publication number 20080293235
- Publication date Nov 27, 2008
- Harris Corporation
- Hector Deju
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT SYSTEM WITH PRE-CONFIGURED BOND WIRE BALL
- Publication number 20080185737
- Publication date Aug 7, 2008
- Pandi Chelvam Marimuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20080150167
- Publication date Jun 26, 2008
- Samsung Electronics Co., Ltd.
- Kyung-Man KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire bonding capillary tool having multiple outer steps
- Publication number 20070235495
- Publication date Oct 11, 2007
- Jaime Castaneda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods for forming conductive bumps and wire loops
- Publication number 20060054665
- Publication date Mar 16, 2006
- Kulicke and Soffa Industries Inc.
- Dodgie Reigh Manzano Calpito
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wire bond with improved shear strength
- Publication number 20060032894
- Publication date Feb 16, 2006
- ASM Technology Singapore Pte Ltd
- Yam Mo Wong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and system for improved wire bonding
- Publication number 20050275073
- Publication date Dec 15, 2005
- TEXAS INSTRUMENTS INCORPORATED
- Norihiro Kawakami
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wire bond capillary Tip
- Publication number 20050218188
- Publication date Oct 6, 2005
- ChipPAC, Inc.
- Kenny Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and apparatus for bonding a wire
- Publication number 20050200009
- Publication date Sep 15, 2005
- In-Ku Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire bonding simulation
- Publication number 20050133566
- Publication date Jun 23, 2005
- Manjula N. Variyam
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Capillary with contained inner chamfer
- Publication number 20050121494
- Publication date Jun 9, 2005
- Gil Perlberg
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Capillary with contained inner chamfer
- Publication number 20040094606
- Publication date May 20, 2004
- Gil Perlberg
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor fabrication method and apparatus, and semiconductor d...
- Publication number 20030230794
- Publication date Dec 18, 2003
- FUJITSU LIMITED
- Yoshiaki Narita
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package

Wire bonding for semiconductor devices

Metal block and bond pad structure

Electronic device

Bonding wire for semiconductor device

Semiconductor device and ball bonder

Electronic device

Metal block and bond pad structure

Semiconductor device

Semiconductor device

Chip package and method for forming the same

Electronic device

Current sensor device

Copper ball bond features and structure

Electronic device

Method for manufacturing an imaging apparatus having a frame member...

Semiconductor device and a manufacturing method thereof

Semiconductor device and method of manufacturing the same

Copper ball bond features and structure

Solid-state imaging device, method of fabricating solid-state imagi...

Solid-state imaging device, method of fabricating solid-state imagi...

Integrated circuit package including wire bonds

Semiconductor package and method of manufacturing the same

Wire bonding capillary tool having multiple outer steps

Wire bond capillary tip

Method and apparatus for bonding a wire

Wire bond with improved shear strength

Methods for forming conductive bumps and wire loops

Wire bonding simulation

Capillary with contained inner chamfer

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

METAL BLOCK AND BOND PAD STRUCTURE

SEMICONDUCTOR DEVICE AND BALL BONDER

SEMICONDUCTOR DEVICE

ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE WITH A RESIN LAYER AND METHOD OF MANUFACTURING...

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

CAPILLARY BONDING TOOL AND METHOD OF FORMING WIRE BONDS

Copper Ball Bond Features and Structure

SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD THEREOF

SOLID-STATE IMAGING APPARATUS, METHOD FOR MANUFACTURING THE SAME, A...

SOLID-STATE IMAGING DEVICE, METHOD OF FABRICATING SOLID-STATE IMAGI...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

WIRE BONDING CAPILLARY TOOL HAVING MULTIPLE OUTER STEPS

SOLID-STATE IMAGING DEVICE, METHOD OF FABRICATING SOLID-STATE IMAGI...

Integrated circuit package including wire bonds

COMPOUND WIREBONDING AND METHOD FOR MINIMIZING INTEGRATED CIRCUIT D...

INTEGRATED CIRCUIT SYSTEM WITH PRE-CONFIGURED BOND WIRE BALL

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Wire bonding capillary tool having multiple outer steps

Methods for forming conductive bumps and wire loops

Wire bond with improved shear strength

Method and system for improved wire bonding

Wire bond capillary Tip

Method and apparatus for bonding a wire

Wire bonding simulation

Capillary with contained inner chamfer

Capillary with contained inner chamfer

Semiconductor fabrication method and apparatus, and semiconductor d...