Shape

Industry

CPC
H01L2924/16315

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/16315Shape

Industries

Patents Grantslast 30 patents

Information Patent Grant
Bonding structure and method thereof
- Patent number 12,015,001
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Wen-Chuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked silicon package assembly having thermal management
- Patent number 11,355,412
- Issue date Jun 7, 2022
- Xilinx, Inc.
- Jaspreet Singh Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating an electronic device comprising forming an i...
- Patent number 11,244,910
- Issue date Feb 8, 2022
- STMicroelectronics (Grenoble 2) SAS
- Karine Saxod
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state image pickup device and electronic apparatus to increas...
- Patent number 10,986,292
- Issue date Apr 20, 2021
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Kenji Mishima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging structure and process
- Patent number 10,867,835
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Lin Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor element
- Patent number 10,868,209
- Issue date Dec 15, 2020
- OSRAM OLED GmbH
- Choon Kim Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,748,830
- Issue date Aug 18, 2020
- Mitsubishi Electric Corporation
- Yukimasa Hayashida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating an electronic device and a stacked electroni...
- Patent number 10,672,721
- Issue date Jun 2, 2020
- STMicroelectronics (Grenoble 2) SAS
- Karine Saxod
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cavity package with composite substrate
- Patent number 10,490,510
- Issue date Nov 26, 2019
- Analog Devices, Inc.
- Xiaojie Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component storage substrate and housing package
- Patent number 10,396,002
- Issue date Aug 27, 2019
- KYOCERA Corporation
- Sentaro Yamamoto
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Light emitting device
- Patent number 10,340,429
- Issue date Jul 2, 2019
- Koha Co., Ltd.
- Daisuke Inomata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging structure and process
- Patent number 10,157,772
- Issue date Dec 18, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Lin Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies with cavities, and methods of fabrication
- Patent number 9,812,406
- Issue date Nov 7, 2017
- Invensas Corporation
- Hong Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging structure and process
- Patent number 9,735,043
- Issue date Aug 15, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Lin Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cavity package with composite substrate
- Patent number 9,728,510
- Issue date Aug 8, 2017
- Analog Devices, Inc.
- Xiaojie Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of semiconductor device
- Patent number 9,716,049
- Issue date Jul 25, 2017
- SOCIONEXT INC.
- Kazuyuki Urago
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 9,391,029
- Issue date Jul 12, 2016
- Kabushiki Kaisha Toshiba
- Shinya Hayashiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module and method for manufacturing the same
- Patent number 8,995,142
- Issue date Mar 31, 2015
- Hitachi Automotive Systems, Ltd.
- Masato Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermoplastic material
- Patent number 8,728,606
- Issue date May 20, 2014
- IQLP, LLC
- Michael A. Zimmerman
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Wafer level package and a method of forming a wafer level package
- Patent number 8,729,695
- Issue date May 20, 2014
- Agency for Science, Technology and Research
- Chirayarikathu Veedu Sankarapillai Premachandran
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Multiple patterning wiring board, wiring board and electronic appar...
- Patent number 8,658,908
- Issue date Feb 25, 2014
- Kyocera Corporation
- Shuzou Nakashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mold design and semiconductor package
- Patent number 8,399,985
- Issue date Mar 19, 2013
- United Test & Assembly Center Ltd.
- Ravi Kanth Kolan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module, power semiconductor module assembly and...
- Patent number 8,319,335
- Issue date Nov 27, 2012
- Infineon Technologies AG
- Reinhold Bayerer
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Electronic component
- Patent number 8,314,485
- Issue date Nov 20, 2012
- Omron Corporation
- Kazuyuki Ono
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power semiconductor module system
- Patent number 8,238,108
- Issue date Aug 7, 2012
- Infineon Technologies AG
- Michael Hornkamp
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mold design and semiconductor package
- Patent number 8,030,761
- Issue date Oct 4, 2011
- United Test & Assembly Center Ltd.
- Ravi Kanth Kolan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder composition for electronic devices
- Patent number 8,022,551
- Issue date Sep 20, 2011
- Renesas Electronics Corporation
- Tasao Soga
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Semiconductor package having a heat spreader with an exposed exteri...
- Patent number 8,018,072
- Issue date Sep 13, 2011
- Amkor Technology, Inc.
- Jeffrey A. Miks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module
- Patent number 7,944,033
- Issue date May 17, 2011
- Infineon Technologies AG
- Benedikt Specht
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shield case and MEMS microphone having it
- Patent number 7,904,123
- Issue date Mar 8, 2011
- Panasonic Corporation
- Katsuhiro Makihata
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
BONDING STRUCTURE AND METHOD THEREOF
- Publication number 20240304580
- Publication date Sep 12, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- WEN-CHUAN TAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20240186213
- Publication date Jun 6, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Jae Jin REE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Packages and Methods of Forming the Same
- Publication number 20240128148
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chang-Jung Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES INCLUDING STIFFENERS AROUND INDIVIDUAL DIES
- Publication number 20230298953
- Publication date Sep 21, 2023
- Intel Corporation
- Pouya Talebbeydokhti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE AND METHOD THEREOF
- Publication number 20230299028
- Publication date Sep 21, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- WEN-CHUAN TAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230178451
- Publication date Jun 8, 2023
- Siliconware Precision Industries Co., Ltd.
- Hsin-Jou Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-FREQUENCEY PACKAGE, HIGH-FREQUENCY MODULE, AND RADIO WAVE ABSO...
- Publication number 20230103894
- Publication date Apr 6, 2023
- NEC Corporation
- Yuki YOSHIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING PACKAGE HOUSING IN ENGRAVED SURFACE FO...
- Publication number 20230011694
- Publication date Jan 12, 2023
- JMJ KOREA CO., LTD.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING AN ELECTRONIC DEVICE AND A STACKED ELECTRONI...
- Publication number 20190103368
- Publication date Apr 4, 2019
- STMicroelectronics (Grenoble 2) SAS
- Karine Saxod
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Level Package and a Method of Forming a Wafer Level Package
- Publication number 20130020713
- Publication date Jan 24, 2013
- Chirayarikathu Veedu Sankarapillai Premachandran
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Power Module and Method for Manufacturing the Same
- Publication number 20130010440
- Publication date Jan 10, 2013
- Hitachi Automotive Systems, Ltd.
- Masato Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLD DESIGN AND SEMICONDUCTOR PACKAGE
- Publication number 20120018869
- Publication date Jan 26, 2012
- United Test & Assembly Center Ltd.
- Ravi Kanth KOLAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTING STRUCTURE, CIRCUIT DEVICE AND ELECTRONIC APPARATUS
- Publication number 20110317386
- Publication date Dec 29, 2011
- PANASONIC CORPORATION
- Masahito Kawabata
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Multiple Patterning Wiring Board, Wiring Board Wiring Board and Ele...
- Publication number 20110315439
- Publication date Dec 29, 2011
- KYOCERA CORPORATION
- Shuzou Nakashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SHIELD CASE AND MEMS MICROPHONE HAVING IT
- Publication number 20110116661
- Publication date May 19, 2011
- PANASONIC CORPORATION
- Katsuhiro Makihata
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Power Semiconductor Module, Power Semiconductor Module Assembly and...
- Publication number 20100252922
- Publication date Oct 7, 2010
- INFINEON TECHNOLOGIES AG
- Reinhold Bayerer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOPLASTIC MATERIAL
- Publication number 20100203283
- Publication date Aug 12, 2010
- Michael Zimmerman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20100200983
- Publication date Aug 12, 2010
- Omron Corporation
- Kazuyuki Ono
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SHIELD CASE AND MEMS MICROPHONE HAVING IT
- Publication number 20100167799
- Publication date Jul 1, 2010
- Katsuhiro Makihata
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
POWER SEMICONDUCTOR MODULE SYSTEM
- Publication number 20100165582
- Publication date Jul 1, 2010
- INFINEON TECHNOLOGIES AG
- Michael Hornkamp
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic device and method of manufacturing the same
- Publication number 20090288852
- Publication date Nov 26, 2009
- NEC Electronics Corporation
- Tomoaki Hirokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMAGNETIC INTERFERENCE SHIELD FOR SEMICONDUCTORS USING A CONT...
- Publication number 20090283876
- Publication date Nov 19, 2009
- International Business Machines Corporation
- J. Richard Behun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package structure with heat sink
- Publication number 20090230543
- Publication date Sep 17, 2009
- Ping Hsun Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE METHOD
- Publication number 20090104734
- Publication date Apr 23, 2009
- INFINEON TECHNOLOGIES AG
- Benedikt Specht
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE
- Publication number 20090102040
- Publication date Apr 23, 2009
- INFINEON TECHNOLOGIES AG
- Benedikt Specht
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONCENTRATION PHOTOVOLTAIC MODULE
- Publication number 20080295888
- Publication date Dec 4, 2008
- DELTA ELECTRONICS, INC.
- Jong-Yen Lai
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
MOLD DESIGN AND SEMICONDUCTOR PACKAGE
- Publication number 20080290505
- Publication date Nov 27, 2008
- United Test & Assembly Center Ltd.
- Ravi Kanth KOLAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING DEVICE FOR HIGH FREQUENCY MICROWAVE DEVICES
- Publication number 20080144287
- Publication date Jun 19, 2008
- Fujitsu Limited
- Masafumi Shigaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Planar circuit housing
- Publication number 20070223202
- Publication date Sep 27, 2007
- NTT DoCoMo, Inc.
- Daisuke Koizumi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor package and method for fabricating the same
- Publication number 20070202633
- Publication date Aug 30, 2007
- Siliconware Precision Industries Co., Ltd.
- Wen-Tsung Tseng
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bonding structure and method thereof

Stacked silicon package assembly having thermal management

Method for fabricating an electronic device comprising forming an i...

Solid-state image pickup device and electronic apparatus to increas...

Semiconductor packaging structure and process

Sensor element

Semiconductor device

Method for fabricating an electronic device and a stacked electroni...

Cavity package with composite substrate

Electronic component storage substrate and housing package

Light emitting device

Semiconductor packaging structure and process

Microelectronic assemblies with cavities, and methods of fabrication

Semiconductor packaging structure and process

Cavity package with composite substrate

Semiconductor device and manufacturing method of semiconductor device

Electronic device

Power module and method for manufacturing the same

Thermoplastic material

Wafer level package and a method of forming a wafer level package

Multiple patterning wiring board, wiring board and electronic appar...

Mold design and semiconductor package

Power semiconductor module, power semiconductor module assembly and...

Electronic component

Power semiconductor module system

Mold design and semiconductor package

Solder composition for electronic devices

Semiconductor package having a heat spreader with an exposed exteri...

Power semiconductor module

Shield case and MEMS microphone having it

Patents Applicationslast 30 patents

BONDING STRUCTURE AND METHOD THEREOF

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

Integrated Circuit Packages and Methods of Forming the Same

MICROELECTRONIC ASSEMBLIES INCLUDING STIFFENERS AROUND INDIVIDUAL DIES

BONDING STRUCTURE AND METHOD THEREOF

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

HIGH-FREQUENCEY PACKAGE, HIGH-FREQUENCY MODULE, AND RADIO WAVE ABSO...

SEMICONDUCTOR PACKAGE HAVING PACKAGE HOUSING IN ENGRAVED SURFACE FO...

METHOD FOR FABRICATING AN ELECTRONIC DEVICE AND A STACKED ELECTRONI...

Wafer Level Package and a Method of Forming a Wafer Level Package

Power Module and Method for Manufacturing the Same

MOLD DESIGN AND SEMICONDUCTOR PACKAGE

CONNECTING STRUCTURE, CIRCUIT DEVICE AND ELECTRONIC APPARATUS

Multiple Patterning Wiring Board, Wiring Board Wiring Board and Ele...

SHIELD CASE AND MEMS MICROPHONE HAVING IT

Power Semiconductor Module, Power Semiconductor Module Assembly and...

THERMOPLASTIC MATERIAL

ELECTRONIC COMPONENT

SHIELD CASE AND MEMS MICROPHONE HAVING IT

POWER SEMICONDUCTOR MODULE SYSTEM

Electronic device and method of manufacturing the same

ELECTROMAGNETIC INTERFERENCE SHIELD FOR SEMICONDUCTORS USING A CONT...

Semiconductor package structure with heat sink

POWER SEMICONDUCTOR MODULE METHOD

POWER SEMICONDUCTOR MODULE

CONCENTRATION PHOTOVOLTAIC MODULE

MOLD DESIGN AND SEMICONDUCTOR PACKAGE

MOUNTING DEVICE FOR HIGH FREQUENCY MICROWAVE DEVICES

Planar circuit housing

Semiconductor package and method for fabricating the same