Patent Application
20110317386
The present invention relates to a connecting structure for electrically and mechanically coupling two members, a circuit device having the connecting structure and an electronic apparatus having the circuit device.
There has been known a circuit device in which a plurality of circuit boards are disposed in a stacked manner along the thickness direction of the board and the respective circuit boards are electrically connected via a connecting member disposed between the circuit boards (see Patent Literatures 1 and 2).
For example, a circuit device 100 of Patent Literature 1 as shown in
Further, a circuit device 200 of Patent Literature 2 as shown in
In recent years, the performance of electronic devices has been improved, and there has been increased a need for increasing the mounting density of components by further effectively utilizing the limited surface of a board. Thus, a circuit device such as a standoff card connector is proposed which is configured to laminate a plurality of boards three-dimensionally via a pillar-shaped member (hereinafter called “a connection member”). Further, in such circuit device, with respect to a structure, that is, the connection member, for electrically connecting a first member (a circuit board) to a second member (a connector board), it is also required to develop the connection structure for wiring two kinds of terminals (hereinafter called “different kinds of terminals”) separately.
However, in the case of forming the connection member for the different kinds of terminals, securing of electric insulation becomes a very important problem in order to avoid the contact between these different kinds of terminals. Thus, in the case of realizing the connection structure with a simple configuration, it is considered to form the connection member by insulative resin etc. and to form the different kinds of terminals by being subjected to the metal plating etc. in a disposing state where the different kinds of terminals are mutually separated so as to secure the electric insulation therebetween.
In the case of forming the different kinds of terminals in the mutually separated state, the resin material of the connection member is exposed between the different kinds of terminals. In such a state, problems such as a crack or an exfoliation of the terminal likely occur inevitably at the external edge portion (a boundary portion between the connection member anti the terminal) of the exposed coupling member.
In particular, in the structure of stacking a plurality of components such as semiconductor packages or module boards in plural stages to thereby increase the height thereof (so-called a three-dimensional mounting structure), due to the influence of the weight and height of the components, a larger impact is likely applied to the components disposed at the lower position or to a part of the connecting portion located at the lower position.
With respect to such an impact, the component or the connecting portion is broken according to the structure thereof. For example, in the case of a rectangular structure, a crack occurs firstly at the corner portion thereof where a largest stress is applied. In the case of the structure of stacking components along the height direction thereof, the exfoliation between the components starts to occur from the connecting portion.
The circuit device of Patent Literature 1 is configured as shown in
On the other hand, the circuit device described in Patent Literature 2 has the structure which is configured to surely connect between a plurality of circuit boards each having a mechanical deformation such as a warp with a thin structure and to have the electromagnetic shielding function. However, just as the circuit device described in Patent Literature 1, the circuit device described in Patent Literature 2 is also not configured in a manner that different kinds of terminals are formed to suppress a crack and an exfoliation of the terminal.
In view of the aforesaid circumstances, an object of the invention is to provide a connecting structure which can suppress the generation of problems such as a crack and an exfoliation of the terminal, and also to provide a circuit device having the connecting structure and an electronic apparatus having the circuit device.
A connecting structure according to the invention corresponds to a connecting structure for electrically and mechanically connecting between a first member and a second member, the connecting structure including a rectangular frame formed by insulative resin which at least includes a first connection surface to be connected to the first member, a second connection surface to be connected to the second member, and a first side surface and a second side surface each crossing with the first connection surface and the second connection surface; a connection terminal which includes a conductive first terminal portion formed at the first connection surface and a conductive second terminal portion formed at the second connection surface; a conductor which is formed at the first side surface to electrically connect the first terminal portion and the second terminal portion; and a concave portion which is formed on the first connection surface, wherein the first terminal portion is formed along the concave portion and has an end portion within the concave portion, and the insulative material of the frame is exposed between the end portion of the first terminal portion and the second side surface.
In this way, since the first terminal portion is formed along the concave portion, that is, formed so as to enter into the connection surface, the adhesion intensity between the first terminal portion and the frame can be enhanced and problems such as the generation of a crack and an exfoliation of the first terminal portion from the frame can be suppressed.
Further, since the insulative material of the frame exposes between the end portion of the first terminal portion provided at the concave portion and the second side surface, the first terminal portion does not reach the second side surface. That is, the end portion of the first terminal portion does not expose on the second side surface. Accordingly, since the first terminal portion thus enhanced in its adhesion density does not expose on the second side surface, the problems such as the generation of a crack and an exfoliation of the first terminal portion from the frame can be further suppressed.
Further, a connecting structure as one aspect of the invention corresponds to a connecting structure for electrically and mechanically connecting between a first member and a second member, the connecting structure including a rectangular frame formed by insulative resin that includes a first connection surface to be connected to the first member, a second connection surface to be connected to the second member, and a first side surface and a second side surface each crossing with the first connection surface and the second connection surface; a connection terminal which includes a conductive first terminal portion formed at the first connection surface and a conductive second terminal portion formed at the second connection surface; a conductor which is formed at the first side surface and the second side surface to electrically connect the first terminal portion and the second terminal portion in a loop manner; and a concave portion which is formed at the first connection surface, wherein the first terminal portion is formed along the concave portion and has a flat portion between the concave portion and the first side surface and also has a flat portion between the concave portion and the second side surface.
Further, as one aspect of the invention, the connecting structure is configured in a manner that one of the connection terminals is a signal terminal for electrically connecting the first member and the second member and the other of the connection terminals is a grounding terminal connected to the ground.
According to the aforesaid configuration, since the adhesion intensity between the frame and the signal terminal or the grounding terminal can be increased, the problems such as the generation of a crack and an exfoliation of the signal terminal ore the grounding terminal from the frame can be suppressed.
Further, as one aspect of the invention, the connecting structure is configured in a manner that the connection terminals are aligned in the longitudinal direction of the frame and disposed in a line symmetrical manner with respect to a center line of the external shape of the frame.
Accordingly, in the case of connecting the terminals by using the solder, the terminals are joined at the positions in the line symmetrical manner with respect to the component due to the self-alignment effects of the component caused by the surface tension at the time of melting the solder. Thus, since the mounting intensity of the component also becomes in the line symmetrical manner, the connection stability can be secured.
Further, as one aspect of the invention, the connecting structure is configured in a manner that a conductor of a loop shape is formed on the second side surface of the frame along the rectangular shape of the frame.
Accordingly, when the conductor of the loop shape along the rectangular shape of the frame is connected to the grounding terminal provided at the frame, since the conductor has the shield function, noise such as electromagnetic waves generated inside and outside of the connecting structure can be shielded.
Further, the circuit device according to the invention includes the aforesaid connecting structure, a first board having a land portion joined to the first terminal portion and a second board having a land portion joined to the second terminal portion.
Accordingly, the circuit device having a large joining intensity between the first board and the second board can be provided.
Further, as one aspect of the invention, the circuit device is configured in a manner that solder for connecting the first terminal portion or the second terminal portion with the land portion is completely filled within the concave portion.
Accordingly, an impact stress applied to the solder connection portion is dispersed into the frame via the concave portion, whereby the generation of a crack can be suppressed.
Further, as one aspect of the invention, the circuit device is configured in a manner that the first terminal portion or the second terminal portion has a flat portion between the first side surface and the concave portion, and the solder for connecting the first terminal portion or the second terminal portion with the land portion is filled between the first terminal portion or the second terminal portion and the land portion and also filled only at a part of the concave portion in the area between the flat portion to the bottom portion of the concave portion.
Accordingly, an impact stress applied to the solder connection portion is dispersed into the frame via the concave portion, whereby the generation of a crack can be suppressed. Further, since the end portion of the terminal portion is not soldered, the generation of an exfoliation of the end portion of the terminal portion at the connection surface can be suppressed.
Further, as one aspect of the invention, the circuit device is configured in a manner that the first terminal portion or the second terminal portion has a flat portion between the first side surface and the concave portion, and the solder for connecting the first terminal portion or the second terminal portion with the land portion is filled between the first terminal portion or the second terminal portion and the land portion but not filled in the concave portion.
Accordingly, since an impact stress applied to the solder connection portion is not applied to the concave portion, the generation of a crack can be suppressed. Further, since the end portion of the terminal portion is not soldered, the generation of an exfoliation of the end portion of the terminal portion at the connection surface can be suppressed.
Further, as one aspect of the invention, the circuit device is configured in a manner that an electronic component is mounted on the surface of at least one of the first board and the second board.
Accordingly, the circuit device having a large joining intensity between the first board and the second board can be provided.
Further, as one aspect of the invention, the circuit device is configured in a manner that the concave portion is formed at each of the first connection surface and the second connection surface and the first terminal portion and the second terminal portion are respectively formed along the concave portions.
Accordingly, since the circuit device having a large joining intensity between the first board and the second board is provided in the electronic apparatus such as a mobile terminal to which a large stress is applied instantaneously due to a shock caused by a falling thereof etc., the electronic apparatus can be provided which is excellent in the durability with respect to a shock caused by a falling thereof etc.
In the connecting structure according to the invention, the concave portion is formed at least one of the first connection surface and the second connection surface of the frame, and the first terminal portion or the second terminal portion of the connection terminal corresponding to the concave portion is formed along the concave portion and does not expose the end portion thereof on the side surface of the frame. Thus, the connecting structure according to the invention has a merit that the first terminal portion or the second terminal portion of the connection terminal enters into the concave portion of the frame to thereby enhance the adhesion intensity between the connection terminal and the frame, and further problems such as the generation of a crack and an exfoliation of the connection terminal portion from the frame can be suppressed.
In
In
In
Hereinafter, an embodiment of the invention will be explained in detail with reference to accompanying drawings.
In this embodiment, the circuit board 10 supports the card connector portion 10 on one surface thereof (an upper surface in
The connector board 20 includes a first surface (hereinafter called “an upper surface”) opposing to the card connector portion 40 and a second surface (hereinafter called “a lower surface”) opposing to the surface of the circuit board 10, and wiring patterns 26 are formed on the upper and lower surfaces thereof. In particular, an electrode land for connecting the relay connector portion 30 is called as a land portion 21.
As shown in
The relay connector portion 30 is formed by using suitable insulative resin (injection molding material such as LCP, PEEK, PEI, PES, PSF, SPS, PA, PPO or PPE or sintering material such as ceramics). As shown in
The frame 31 has a portion (hereinafter called “a single-line area α”) where only the first connection terminal 32 is disposed in a loop manner as shown in (A) of
In other words, in the single-line area of the frame 31 shown by a sectional view along a line IVA-IVA in
Further, as shown in
The first connection terminal (hereinafter called “the grounding terminal”) 32 is formed by the plating processing (electroless plating processing or electrolytic plating processing) on the outer surface of the frame 31 formed by the insulative material. As described above, in the single-line area α shown in (A) of
When the grounding terminal 32 is formed in the loop shape, the grounding terminal surrounds the frame (in the section thereof) integrally over the four side surfaces thereof (that is, the first connection surface 31A, the second connection surface 31B, the first side surface 31C and the second side surface 31D). Thus, since there is no portion forming a notch of the conductor causing the exfoliation of the grounding terminal 32, the generation of the exfoliation can be effectively suppressed.
Further, according to the invention, the first terminal portion 32A and the second terminal portion 32B are formed on the first connection surface 31A and the second connection surface 31B in the state of being entered into the concave portions G formed at the parts of the first connection surface 31A and the second connection surface 31B, respectively. In this manner, since the first terminal portion 32A and the second terminal portion 32B can be formed in the state of being entered into the concave portions G of the frame 31, the adhesion intensity between the frame 31 and the first connection terminal 32, the second terminal portion 32B can be enhanced. As a result, the exfoliation of the grounding terminal 32 and the second terminal portion 32B from the frame 31 can be suppressed effectively.
Further, according to the embodiment, not only the first terminal portion 32A and the second terminal portion 32B but also the solder H for connecting the first terminal portion 32A (or the second terminal portion 32B) with the land portion 21 (or the land portion 10B) formed by the plating processing is placed in a state of being completely filled into the concave portion G. In this manner, in particular, when the solder is completely filled into the concave portion G, the frame 31 can be firmly coupled to the connector board 20 and the circuit board 10.
Further, due to the presence of the concave portion G, since the contact area between the grounding terminal 32 and the frame 31 increases, a stress acting therebetween is likely dispersed within the frame 31, so that the generation of a crack and an exfoliation of the grounding terminal 32 occurs unlikely.
Further, with respect to the grounding terminal 32, in the plural-lines area β where the signal terminals (signal lines) 33 are required to be disposed simultaneously as shown in (B) of
In this manner, as to the grounding terminal 32 according to the invention, the grounding terminal 32 is provided on all the surfaces (four surfaces) of the frame 31 in the single-line area where the signal terminal (signal line) 33 is not disposed. That is, as shown in (B) of
Further, a plurality of the grounding terminals 32 are formed in the longitudinal direction of the frame 31. In particular, in this embodiment, many grounding terminals are formed along the outer side direction so as to occupy the frame 31 with a large ratio. At least two the grounding terminals 32 are electrically and physically connected so as to be made conductive therebetween via the conductor 32D on one of the first side surface 31C and the second side surface 31D of the frame 31. In this embodiment, the two grounding terminals 32 are integrated via the conductor 32D at the second side surface 31D (external side portion) as shown in
Further, as shown in
Further, as shown in
Further, when the frame 31 is seen as a whole, the grounding terminal 32 is formed over all the four outer sides 322A to 322D of the frame 31. That is, the grounding terminal 32 is configured in a manner that all the four outer side portions are continued integrally. Thus, the generation of an exfoliation is further suppressed mutually while mutually reinforcing, whereby the generation of a crack and an exfoliation of the terminal can be further effectively suppressed.
Further, as shown in
On the other hand, like the grounding terminal 32, the second connection terminal 33 (hereinafter called “a signal terminal”) is formed on the external surface of the frame 31 formed by the insulative material by the plating processing. In particular, as shown in
As shown in (B) of
As shown in
On the other hand, supposing that the outer size in the short side direction of the relay connector is L2, the separation distance (length) between the grounding terminal 32 and the signal terminal 33 is (L2−L3)/2. Since this separation distance is provided within the connection surface, the end portion of the signal terminal portion does not expose on the side surface of the frame, whereby the structure unlikely occurring the exfoliation between the layers of the terminal is realized.
Like the grounding terminal 32, the signal terminal 33 includes the first terminal portion 33A provided on the first connection surface (upper surface) 31A to be connected to the connector board 20, the second terminal portion 33B provided on the second connection surface (lower surface) 31B to be connected to the circuit board 10, and a coupling portion 33C provided on the first side surface 31C crossing with the first connection surface 31A and the second connection surface 31B.
Further, like the aforesaid grounding terminal 32, the signal terminal 33 is configured in a manner that the first terminal portion 33A and the second terminal portion 33B are formed on the first connection surface 31A and the second connection surface 31B in a state of entering into the concave portions G formed at parts of the first connection surface 31A and the second connection surface 31B of the frame 31, respectively. That is, also in the signal terminal 33, each of the first terminal portion 33A and the second terminal portion 33B enters into the concave portion G of the frame 31. Thus, the exfoliation of the first terminal portion 33A and the second terminal portion 33B of the signal terminal 33 from the frame 31 can be suppressed effectively.
Further, also in the signal terminal 33 according to the embodiment, the solder H for connecting the first terminal portion 33A and the second terminal portion 33B with the land portions 21, 10B formed by the plating processing of the connector board 20 and the circuit board 10 is completely filled into the concave portions G, respectively. Thus, like the signal terminal 33, in particular, when the concave portion G is completely filled by the solder, the frame 31 can be connected firmly with the connector board 20 and the circuit board 10.
With respect to the concave portion G according to the invention, although the explanation is made as to the configuration where single concave portion is provided for each connection terminal, a plurality of concave portions may be provided for each connection terminal.
Further, with respect to the concave portion G according to the invention, although the explanation is made as to the configuration where the concave portions of the same size and the same shape are disposed on the same vertical line (on a line in the same vertical direction) on each of the first connection surface and the second connection surface, the concave portions may not have the same size and the same shape and not be disposed on the same vertical line.
The beam portion 34 is formed by using suitable insulative material and provided so as to connect between the opposing two frames 31. The frame 31 and the beam portion 34 are connected via a branch portion 325. The aforesaid second chamfer portion 324 is formed at the brunch portion 325.
The electronic component 50 is mounted by using the mounting space S which is the space area between the card connector portion 40 and the connector board 20 on the surface of the circuit board 10. As the electronic components 50, surface mounting devices (SMD) such as a semiconductor package component 51 and an LCR circuit chip component 52 are used. The electronic components are mounted on the surface of the circuit board 10. The electronic components 50 may be attached on the connector board 20 side instead of the circuit board 10 side so long as they are disposed in the mounting space S formed between the circuit board 10 and the connector board 20.
Thus, according to this embodiment, the grounding terminals 32 and the signal terminals 33 can be formed on the same area (plural-lines area) of the frame 31 separately in an insulated state therebetween while suppressing the generation of a crack and an exfoliation of the terminal.
Further, according to the embodiment, as described above, the concave portions G are formed in the frame 31 and the terminals are formed in a state of entering into the concave portions G. Thus, the firm connection between the circuit board and the frame 31 is realized. Further, when the connecting structure according to the embodiment is applied, the circuit device having a large joining intensity can be realized with respect to the connector board 20 as the first board and the circuit board 10 as the second board.
Further, according to the embodiment, even in the case of joining the board having a large weight in which the electronic components 50 are mounted on the both surfaces of the connector board 20 and (or) the both surfaces of the circuit board 10, the circuit board can be realized which is large in the joining intensity and unlikely raises a crack and an exfoliation of the terminal.
Further, according to the embodiment, in the electronic apparatus such as a mobile terminal to which a large stress is applied instantaneously due to a shock caused by a falling thereof etc., since the circuit device having a large joining intensity between the connector board 20 and the circuit board 10 is provided, the electronic apparatus can be realized which is durable with respect to a shock caused by a falling thereof etc.
Although not shown in the drawings, when the insulative resin is provided at the outer periphery of the frame and the mounting area within the frame to thereby reinforce the frame, it will be clear that the electronic apparatus can be realized which has a further improved joining intensity and is further durable with respect to a shock caused by a falling thereof etc.
Next, the explanation will be made with reference to
The circuit device of this embodiment differs from the circuit device of the first embodiment in a point that the frame 31 is configured to form the concave portion G only at the second connection surface (lower surface) 31B as shown in
That is, in the structure of stacking a plurality of components such as semiconductor packages or module boards in plural stages to thereby increase the height thereof (so-called a three-dimensional mounting structure), due to the influence of the weight and height of the components, a larger impact is likely applied to the components disposed at the lower position or to a part of the coupling portion located at the lower position. In view of this matter, the concave portion G is formed only at the second connection surface (lower surface) 31B.
Thus, in the single-line area α of the frame 31 shown in (A) of
On the other hand, in the plural-lines area β of the frame 31 shown in (B) of
The configuration of the concave portion G according to the invention is not limited to that shown in this embodiment. The concave portion G may be disposed on the side applied with a larger impact stress in view of the magnitude of the impact stress applied to the connection portion within the circuit device or the electronic apparatus. That is, although the concave portion G is formed at the second connection surface 31B in this embodiment, the concave portion may be formed at the first connection surface 31A.
In this manner, when the connecting structure according to the embodiment, is applied, the circuit device having a large joining intensity can be realized with respect to the connector board 20 as the first board and the circuit board 10 as the second board.
Although not shown in the drawings, when the insulative resin is provided at the outer periphery of the frame and the mounting area within the frame to thereby reinforce the frame, it will be clear that the electronic apparatus can be realized which has a further improved joining intensity and is further durable with respect to a shock caused by a falling thereof etc.
Next, the explanation will be made with reference to
The circuit device of this embodiment is same as the circuit device of the second embodiment in a point that the concave portion G is formed only at the second connection surface (lower surface) 31B in the frame 31 and the second terminal portion 32B or 33B is formed at the entirety of the concave portion G but differs from the circuit device of the second embodiment only in a point that the solder H is filled only at a part of the concave portion G.
That is, in the single-line area α of the frame 31 shown in (A) of
On the other hand, also in the plural-lines area β of the frame 31 shown in (B) of
According to this embodiment, at the time of joining the land portion 10B with the second terminal portion 33B of the signal terminal 33 by the solder H, the solder H does not cover the other end portion E2 of the second terminal portion 33B facing on the exposed portion of the frame 31. Thus, by using the adhesion intensity between the second terminal portion 33B and the frame 31 which is improved by the fact that only the second terminal portion 33B (not accompanying with the solder H) enters into the concave portion G of the frame 31, the generation of a crack and an exfoliation of the terminal at the end portion of the second terminal portion 33B can be further effectively suppressed.
The configuration of the concave portion G according to the invention is not limited to that of this embodiment. The concave portion G may be disposed, within the circuit device or the electronic apparatus, on a side applied with a larger impact stress in view of the magnitude of the impact stress applied to the coupling portion. That is, although the concave portion G is formed at the second connection surface 31B in this embodiment, the concave portion may be formed at the first connection surface 31A.
Thus, according to the embodiment, in the plural-lines area 6, the solder H does not cover the end portion of the second terminal portion 33B where the frame 31 exposes. Thus, the generation of an exfoliation at the second terminal portion 33B can be suppressed.
Although not shown in the drawings, when the insulative resin is provided at the outer periphery of the frame and the mounting area within the frame to thereby reinforce the frame, it will be clear that the electronic apparatus can be realized which has a further improved joining intensity and is further durable with respect to a shock caused by a falling thereof etc. In this case, this embodiment is configured to reinforce the concave portion G by the solder and the resin.
Next, the explanation will be made with reference to
The circuit device of this embodiment differs from the circuit device of the third embodiment in a point that the solder H provided for connecting between the second terminal portions 32B, 33B and the first land portion 10B of the circuit board 10 is not filled in the concave portions G of the second terminal portions 32B, 33B.
As shown in (A) of
In
Further, the land portion 10B is formed so as to have a narrow shape in correspondence to the flat portion γ of the second terminal portion 33B of the signal terminal 33. Thus, at the time of joining the land portion 10B with the second terminal portion 33B of the signal terminal 33, the solder H does not cover the other end portion E2 of the second terminal portion 33B facing on the exposed portion of the frame 31. Therefore, by using the adhesion intensity between the second terminal portion 33B and the frame 31 which is improved by the fact that only the second terminal portion 33B (not accompanying with the solder H) enters into the concave portion G of the frame 31, the generation of a crack and an exfoliation of the terminal at the end portion of the second terminal portion 33B can be further effectively suppressed.
Although not shown in the drawings, when the insulative resin is provided at the outer periphery of the frame and the mounting area within the frame to thereby reinforce the frame, it will be clear that the electronic apparatus can be realized which has a further improved joining intensity and is further durable with respect to a shock caused by a falling thereof etc. In this case, this embodiment is configured to reinforce the concave portion G by the resin.
In the embodiments, the conductors are formed on the second side surfaces of all the four outer sides so that all the first connection terminals locate on the external sides of the four outer sides of the frame to thereby electrically connect the first connection terminals. According to this configuration, since all the first connection terminals are combined, it is possible to improve the intensity. However, all the first connection terminals are not necessarily connected via the conductors but a plurality of the first connection terminals may be connected via the conductors.
Further, the invention can be applied to a case where the frame, the connector board and the circuit board are joined by using isotropic conductive resin or anisotropic conductive resin other than the solder.
The invention is not limited to the aforesaid embodiment, and the changes and applications performed by persons skilled in the art based on the description of the specification and well-known techniques are estimated and contained within the range of the protection of the invention.
The present application is based on Japanese Patent Application No. 2009-068021 filed on Mar. 19, 2009, the contents of which is incorporated herein by reference.
The invention has an effect that generation of a crack and an exfoliation of the terminal can be suppressed effectively with respect to two kinds of terminals having different functions which are provided on the same frame in a separated and insulated state to each other. The invention is useful for the circuit device provided with the connecting structure and the electronic apparatus having the circuit device.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2009-068021 | Mar 2009 | JP | national |
| Filing Document | Filing Date | Country | Kind | 371c Date |
|---|---|---|---|---|
| PCT/JP2009/006697 | 12/8/2009 | WO | 00 | 9/2/2011 |
