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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/80345Shape

Industries

Patents Grantslast 30 patents

Information Patent Grant
Low temperature hybrid bonding
- Patent number 11,911,839
- Issue date Feb 27, 2024
- Advanced Micro Devices, Inc.
- Priyal Shah
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heterogeneous bonding structure and method forming same
- Patent number 11,894,241
- Issue date Feb 6, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Mirng-Ji Lii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous bonding structure and method forming same
- Patent number 11,854,835
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Mirng-Ji Lii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding structure and hybrid bonding method
- Patent number 11,756,922
- Issue date Sep 12, 2023
- Huawei Technologies Co., Ltd.
- Ran He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device and semiconductor device
- Patent number 11,721,664
- Issue date Aug 8, 2023
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Eiichiro Kanda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, fabrication method for a semiconductor device...
- Patent number 11,569,123
- Issue date Jan 31, 2023
- Sony Corporation
- Yoshihisa Kagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device and semiconductor device
- Patent number 11,257,782
- Issue date Feb 22, 2022
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Eiichiro Kanda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, manufacturing method, and solid-state imaging...
- Patent number 11,018,110
- Issue date May 25, 2021
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Akiko Hirata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, fabrication method for a semiconductor device...
- Patent number 10,985,102
- Issue date Apr 20, 2021
- Sony Corporation
- Yoshihisa Kagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanowire enabled substrate bonding and electrical contact formation
- Patent number 10,833,048
- Issue date Nov 10, 2020
- International Business Machines Corporation
- Li-Wen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, fabrication method for a semiconductor device...
- Patent number 10,431,621
- Issue date Oct 1, 2019
- Sony Corporation
- Yoshihisa Kagawa
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Three-dimensional memory device containing self-aligned interlockin...
- Patent number 10,381,322
- Issue date Aug 13, 2019
- SanDisk Technologies LLC
- Yasunobu Azuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, fabrication method for a semiconductor device...
- Patent number 10,038,024
- Issue date Jul 31, 2018
- Sony Corporation
- Yoshihisa Kagawa
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor device, fabrication method for a semiconductor device...
- Patent number 9,911,778
- Issue date Mar 6, 2018
- Sony Corporation
- Yoshihisa Kagawa
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor package with electromagnetic shielding member
- Patent number 9,837,361
- Issue date Dec 5, 2017
- Samsung Electronics Co., Ltd.
- Byoung-rim Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor package device having locking mechanism, and pr...
- Patent number 9,786,583
- Issue date Oct 10, 2017
- Alpha and Omega Semiconductor Incorporated
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, fabrication method for a semiconductor device...
- Patent number 9,443,802
- Issue date Sep 13, 2016
- Sony Corporation
- Yoshihisa Kagawa
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor device, fabrication method for a semiconductor device...
- Patent number 9,111,763
- Issue date Aug 18, 2015
- Sony Corporation
- Yoshihisa Kagawa
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Three dimensional integrated circuit structures and hybrid bonding...
- Patent number 8,809,123
- Issue date Aug 19, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding of substrates including metal-dielectric patterns with meta...
- Patent number 8,617,689
- Issue date Dec 31, 2013
- International Business Machines Corporation
- Kuan-Neng Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pad bonding employing a self-aligned plated liner for adhesion enha...
- Patent number 8,492,265
- Issue date Jul 23, 2013
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pad bonding employing a self-aligned plated liner for adhesion enha...
- Patent number 8,482,132
- Issue date Jul 9, 2013
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding of substrates including metal-dielectric patterns with meta...
- Patent number 8,241,995
- Issue date Aug 14, 2012
- International Business Machines Corporation
- Kuan-Neng Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
3D integration structure and method using bonded metal planes
- Patent number 7,939,369
- Issue date May 10, 2011
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HETEROGENEOUS BONDING STRUCTURE AND METHOD FORMING SAME
- Publication number 20240096647
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Mirng-Ji Lii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240030074
- Publication date Jan 25, 2024
- Samsung Electronics Co., Ltd.
- MINKI KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLAMPED SEMICONDUCTOR WAFERS AND SEMICONDUCTOR DEVICES
- Publication number 20230326887
- Publication date Oct 12, 2023
- Western Digital Technologies, Inc.
- Kirubakaran Periyannan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heterogeneous Bonding Structure and Method Forming Same
- Publication number 20220384210
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufactuning Co., Ltd.
- Mirng-Ji Lii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20210151406
- Publication date May 20, 2021
- EIICHIRO KANDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD, AND SOLID-STATE IMAGING...
- Publication number 20200035643
- Publication date Jan 30, 2020
- Sony Semiconductor Solutions Corporation
- AKIKO HIRATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOWIRE ENABLED SUBSTRATE BONDING AND ELECTRICAL CONTACT FORMATION
- Publication number 20190319006
- Publication date Oct 17, 2019
- International Business Machines Corporation
- Li-Wen HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, FABRICATION METHOD FOR A SEMICONDUCTOR DEVICE...
- Publication number 20180277585
- Publication date Sep 27, 2018
- SONY CORPORATION
- Yoshihisa Kagawa
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
METHODS OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20160155862
- Publication date Jun 2, 2016
- Samsung Electronics Co., Ltd.
- Yi-Koan HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, FABRICATION METHOD FOR A SEMICONDUCTOR DEVICE...
- Publication number 20140362267
- Publication date Dec 11, 2014
- Yoshihisa Kagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP BONDING STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20140175655
- Publication date Jun 26, 2014
- Jui-Chin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING OF SUBSTRATES INCLUDING METAL-DIELECTRIC PATTERNS WITH META...
- Publication number 20140097543
- Publication date Apr 10, 2014
- International Business Machines Corporation
- Kuan-Neng Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Three Dimensional Integrated Circuit Structures and Hybrid Bonding...
- Publication number 20130320556
- Publication date Dec 5, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING OF SUBSTRATES INCLUDING METAL-DIELECTRIC PATTERNS WITH META...
- Publication number 20130307139
- Publication date Nov 21, 2013
- International Business Machines Corporation
- Kuan-Neng Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE, FABRICATION METHOD FOR A SEMICONDUCTOR DEVICE...
- Publication number 20130009321
- Publication date Jan 10, 2013
- SONY CORPORATION
- Yoshihisa Kagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PAD BONDING EMPLOYING A SELF-ALIGNED PLATED LINER FOR ADHESION ENHA...
- Publication number 20120190187
- Publication date Jul 26, 2012
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PAD BONDING EMPLOYING A SELF-ALIGNED PLATED LINER FOR ADHESION ENHA...
- Publication number 20110084403
- Publication date Apr 14, 2011
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D INTEGRATION STRUCTURE AND METHOD USING BONDED METAL PLANES
- Publication number 20100289144
- Publication date Nov 18, 2010
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING OF SUBSTRATES INCLUDING METAL-DIELECTRIC PATTERNS WITH META...
- Publication number 20100255262
- Publication date Oct 7, 2010
- Kuan-Neng Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Low temperature hybrid bonding

Heterogeneous bonding structure and method forming same

Heterogeneous bonding structure and method forming same

Hybrid bonding structure and hybrid bonding method

Method of manufacturing semiconductor device and semiconductor device

Semiconductor device, fabrication method for a semiconductor device...

Method of manufacturing semiconductor device and semiconductor device

Semiconductor device, manufacturing method, and solid-state imaging...

Semiconductor device, fabrication method for a semiconductor device...

Nanowire enabled substrate bonding and electrical contact formation

Semiconductor device, fabrication method for a semiconductor device...

Three-dimensional memory device containing self-aligned interlockin...

Semiconductor device, fabrication method for a semiconductor device...

Semiconductor device, fabrication method for a semiconductor device...

Semiconductor package with electromagnetic shielding member

Power semiconductor package device having locking mechanism, and pr...

Semiconductor device, fabrication method for a semiconductor device...

Semiconductor device, fabrication method for a semiconductor device...

Three dimensional integrated circuit structures and hybrid bonding...

Bonding of substrates including metal-dielectric patterns with meta...

Pad bonding employing a self-aligned plated liner for adhesion enha...

Pad bonding employing a self-aligned plated liner for adhesion enha...

Bonding of substrates including metal-dielectric patterns with meta...

3D integration structure and method using bonded metal planes

Patents Applicationslast 30 patents

HETEROGENEOUS BONDING STRUCTURE AND METHOD FORMING SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

CLAMPED SEMICONDUCTOR WAFERS AND SEMICONDUCTOR DEVICES

Heterogeneous Bonding Structure and Method Forming Same

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE, MANUFACTURING METHOD, AND SOLID-STATE IMAGING...

NANOWIRE ENABLED SUBSTRATE BONDING AND ELECTRICAL CONTACT FORMATION

SEMICONDUCTOR DEVICE, FABRICATION METHOD FOR A SEMICONDUCTOR DEVICE...

METHODS OF MANUFACTURING A SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE, FABRICATION METHOD FOR A SEMICONDUCTOR DEVICE...

CHIP BONDING STRUCTURE AND MANUFACTURING METHOD THEREOF

BONDING OF SUBSTRATES INCLUDING METAL-DIELECTRIC PATTERNS WITH META...

Three Dimensional Integrated Circuit Structures and Hybrid Bonding...

BONDING OF SUBSTRATES INCLUDING METAL-DIELECTRIC PATTERNS WITH META...

SEMICONDUCTOR DEVICE, FABRICATION METHOD FOR A SEMICONDUCTOR DEVICE...

PAD BONDING EMPLOYING A SELF-ALIGNED PLATED LINER FOR ADHESION ENHA...

PAD BONDING EMPLOYING A SELF-ALIGNED PLATED LINER FOR ADHESION ENHA...

3D INTEGRATION STRUCTURE AND METHOD USING BONDED METAL PLANES

BONDING OF SUBSTRATES INCLUDING METAL-DIELECTRIC PATTERNS WITH META...