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H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
Current Industry
H01L2224/4105
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Patents Grants
last 30 patents
Information
Patent Grant
Multi-clip structure for die bonding
Patent number
11,189,592
Issue date
Nov 30, 2021
Infineon Technologies Austria AG
Balehithlu Manjappaiah Upendra
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor module with temperature detecting element
Patent number
10,580,754
Issue date
Mar 3, 2020
Mitsubishi Electric Corporation
Shinya Yano
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for fabricating stack die package
Patent number
10,546,840
Issue date
Jan 28, 2020
Vishay SIliconix, LLC
Kyle Terrill
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package with conductive clips
Patent number
10,546,805
Issue date
Jan 28, 2020
Texas Instruments Incorporated
Oscar Paulo Razon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor module and conductive member for semiconductor module...
Patent number
10,475,667
Issue date
Nov 12, 2019
Mitsubishi Electric Corporation
Masakazu Tani
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Arrangement of multiple power semiconductor chips and method of man...
Patent number
10,049,962
Issue date
Aug 14, 2018
Infineon Technologies AG
Georg Meyer-Berg
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaging solutions for devices and systems comprising lateral GaN...
Patent number
9,824,949
Issue date
Nov 21, 2017
GaN Systems Inc.
Cameron McKnight-MacNeil
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package
Patent number
9,601,453
Issue date
Mar 21, 2017
MagnaChip Semiconductor, Ltd.
Francois Hebert
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for fabricating stack die package
Patent number
9,589,929
Issue date
Mar 7, 2017
Vishay Siliconix
Kyle Terrill
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic component and method
Patent number
9,443,787
Issue date
Sep 13, 2016
Infineon Technologies Austria AG
Ralf Otremba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked synchronous buck converter having chip embedded in outside...
Patent number
9,425,132
Issue date
Aug 23, 2016
Texas Instruments Incorporated
Osvaldo Jorge Lopez
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method for manufacturing semiconductor device
Patent number
9,287,192
Issue date
Mar 15, 2016
Kabushiki Kaisha Toyota Jidoshokki
Shinsuke Nishi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Module including a discrete device mounted on a DCB substrate
Patent number
9,147,637
Issue date
Sep 29, 2015
Infineon Technologies AG
Ralf Otremba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power semiconductor module
Patent number
9,129,949
Issue date
Sep 8, 2015
Mitsubishi Electric Corporation
Shinsuke Asada
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor component and method of manufacture
Patent number
8,451,621
Issue date
May 28, 2013
Semiconductor Components Industries, LLC
Shutesh Krishnan
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Connector assembly and method of manufacture
Patent number
8,449,339
Issue date
May 28, 2013
Semiconductor Components Industries, LLC
Shutesh Krishnan
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
STACKED CLIP DESIGN FOR GaN HALF BRIDGE IPM
Publication number
20240120308
Publication date
Apr 11, 2024
TEXAS INSTRUMENTS INCORPORATED
Kwang-Soo Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FINGERPRINT SENSOR PACKAGE AND SMART CARD HAVING THE SAME
Publication number
20240105703
Publication date
Mar 28, 2024
Samsung Electronics Co., Ltd.
Jaehyun Lim
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20240006368
Publication date
Jan 4, 2024
ROHM CO., LTD.
Takumi KANDA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONNECTING STRIP FOR DISCRETE AND POWER ELECTRONIC DEVICES
Publication number
20220320032
Publication date
Oct 6, 2022
STMicroelectronics S.r.l.
Agatino Minotti
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CLIP INTERCONNECT WITH MICRO CONTACT HEADS
Publication number
20220181290
Publication date
Jun 9, 2022
Semiconductor Components Industries, LLC
Emmanuel Silvestre RAMOS
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Multi-Clip Structure for Die Bonding
Publication number
20200105707
Publication date
Apr 2, 2020
Balehithlu Manjappaiah Upendra
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE WITH CONDUCTIVE CLIPS
Publication number
20190206773
Publication date
Jul 4, 2019
TEXAS INSTRUMENTS INCORPORATED
Oscar Paulo RAZON
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR FABRICATING STACK DIE PACKAGE
Publication number
20140273344
Publication date
Sep 18, 2014
VISHAY-SILICONIX
Kyle TERRILL
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20130228909
Publication date
Sep 5, 2013
Kabushiki Kaisha Toyota Jidoshokki
Shinsuke NISHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER SEMICONDUCTOR MODULE
Publication number
20130221516
Publication date
Aug 29, 2013
MITSUBISHI ELECTRIC CORPORATION
Shinsuke Asada
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Module Including a Discrete Device Mounted on a DCB Substrate
Publication number
20130161801
Publication date
Jun 27, 2013
INFINEON TECHNOLOGIES AG
Ralf Otremba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONNECTOR ASSEMBLY AND METHOD OF MANUFACTURE
Publication number
20120064781
Publication date
Mar 15, 2012
Shutesh Krishnan
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURE
Publication number
20120063107
Publication date
Mar 15, 2012
Shutesh Krishnan
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR