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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/81365Shape

Industries

Patents Grantslast 30 patents

Information Patent Grant
Display device
- Patent number 11,917,875
- Issue date Feb 27, 2024
- Samsung Display Co., Ltd.
- Ki Kyung Youk
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
3D packaging with low-force thermocompression bonding of oxidizable...
- Patent number 11,134,598
- Issue date Sep 28, 2021
- SET North America, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-LED module and method for fabricating the same
- Patent number 10,847,504
- Issue date Nov 24, 2020
- LUMENS CO., LTD.
- Taekyung Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-LED module and method for fabricating the same
- Patent number 10,319,706
- Issue date Jun 11, 2019
- LUMENS CO., LTD.
- Taekyung Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-strike process for bonding packages and the packages thereof
- Patent number 10,068,868
- Issue date Sep 4, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tung-Liang Shao
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bump structure for yield improvement
- Patent number 10,056,347
- Issue date Aug 21, 2018
- Taiwan Semiconductor Manufacturing Company
- Tzu-Wei Chiu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ball height control in bonding process
- Patent number 10,037,962
- Issue date Jul 31, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Yuan Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Jointed body, method for manufacturing same and jointed member
- Patent number 9,821,406
- Issue date Nov 21, 2017
- Kabushiki Kaisha Toyota Chuo Kenkyusho
- Tadashi Oshima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacturing same
- Patent number 9,691,739
- Issue date Jun 27, 2017
- Tessera Advanced Technologies, Inc.
- Michihiro Kawashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for package on package through mold interconnects
- Patent number 9,659,908
- Issue date May 23, 2017
- Intel Corporation
- Shubhada H. Sahasrabudhe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder fatigue arrest for wafer level package
- Patent number 9,583,425
- Issue date Feb 28, 2017
- Maxim Integrated Products, Inc.
- Yong Li Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-strike process for bonding
- Patent number 9,576,929
- Issue date Feb 21, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tung-Liang Shao
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device with at least one voltage-guided conductive fi...
- Patent number 9,356,001
- Issue date May 31, 2016
- HGST Netherlands B.V.
- Luiz M. Franca-Neto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing same
- Patent number 9,318,418
- Issue date Apr 19, 2016
- Tessera Advanced Technologies, Inc.
- Michihiro Kawashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures for stacked dies, including penetrating str...
- Patent number 9,165,888
- Issue date Oct 20, 2015
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing same
- Patent number 9,076,700
- Issue date Jul 7, 2015
- Tessera Advanced Technologies, Inc.
- Michihiro Kawashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 8,816,506
- Issue date Aug 26, 2014
- Tessera Advanced Technologies, Inc.
- Michihiro Kawashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system with mounting structure
- Patent number 8,803,330
- Issue date Aug 12, 2014
- Stats Chippac Ltd.
- Rui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with coupling features and meth...
- Patent number 8,710,670
- Issue date Apr 29, 2014
- Stats Chippac Ltd.
- MinJung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures for stacked dies, including penetrating str...
- Patent number 8,680,654
- Issue date Mar 25, 2014
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures for stacked dies, including penetrating str...
- Patent number 8,435,836
- Issue date May 7, 2013
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 8,106,518
- Issue date Jan 31, 2012
- Renesas Electronics Corporation
- Michihiro Kawashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures for stacked dies, including penetrating str...
- Patent number 7,872,332
- Issue date Jan 18, 2011
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing chip-on-chip semiconductor device
- Patent number 7,851,256
- Issue date Dec 14, 2010
- Samsung Electronics Co., Ltd.
- Hyun-soo Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for dispensing chip underfill through an openi...
- Patent number 7,838,336
- Issue date Nov 23, 2010
- International Business Machines Corporation
- Gerald K. Bartley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip interconnection structure using stub terminals
- Patent number 6,271,059
- Issue date Aug 7, 2001
- International Business Machines Corporation
- Claude L. Bertin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct die contact (DDC) semiconductor package
- Patent number 6,150,717
- Issue date Nov 21, 2000
- Micron Technology, Inc.
- Alan G. Wood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for interconnecting multiple circuit chips
- Patent number 6,114,221
- Issue date Sep 5, 2000
- International Business Machines Corporation
- William R. Tonti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct die contact (DDC) semiconductor package
- Patent number 6,107,122
- Issue date Aug 22, 2000
- Micron Technology, Inc.
- Alan G. Wood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density electrical connectors
- Patent number 6,042,391
- Issue date Mar 28, 2000
- Telefonaktiebolaget LM Ericsson
- Peter Bodo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THERMOCOMPRESSION BONDING WITH PASSIVATED SILVER-BASED CONTACTING M...
- Publication number 20210227735
- Publication date Jul 22, 2021
- SET NORTH AMERICA, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermocompression Bonding with Passivated Gold Contacting Metal
- Publication number 20210227734
- Publication date Jul 22, 2021
- SET NORTH AMERICA, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermocompression Bonding with Passivated Tin-Based Contacting Metal
- Publication number 20210227732
- Publication date Jul 22, 2021
- SET NORTH AMERICA, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermocompression Bonding with Passivated Copper-Based Contacting M...
- Publication number 20210227733
- Publication date Jul 22, 2021
- SET NORTH AMERICA, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermocompression Bonding Using Metastable Gas Atoms
- Publication number 20210219474
- Publication date Jul 15, 2021
- SET NORTH AMERICA, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermocompression Bonding with Passivated Nickel-Based Contacting M...
- Publication number 20210219475
- Publication date Jul 15, 2021
- SET NORTH AMERICA, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO-LED MODULE AND METHOD FOR FABRICATING THE SAME
- Publication number 20190252360
- Publication date Aug 15, 2019
- LUMENS CO., LTD
- Taekyung Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermocompression Bonding with Passivated Gold Contacting Metal
- Publication number 20180132397
- Publication date May 10, 2018
- SET NORTH AMERICA, LLC
- Eric Frank Schulte
- B32 - LAYERED PRODUCTS
Information Patent Application
Thermocompression Bonding with Passivated Silver-Based Contacting M...
- Publication number 20180132398
- Publication date May 10, 2018
- SET NORTH AMERICA, LLC
- Eric Frank Schulte
- B32 - LAYERED PRODUCTS
Information Patent Application
Thermocompression Bonding with Passivated Indium-Based Contacting M...
- Publication number 20180132395
- Publication date May 10, 2018
- SET NORTH AMERICA, LLC
- Eric Frank Schulte
- B32 - LAYERED PRODUCTS
Information Patent Application
Thermocompression Bonding with Passivated Copper-Based Contacting M...
- Publication number 20180132396
- Publication date May 10, 2018
- SET NORTH AMERICA, LLC
- Eric Frank Schulte
- B32 - LAYERED PRODUCTS
Information Patent Application
Thermocompression Bonding Using Metastable Gas Atoms
- Publication number 20180132394
- Publication date May 10, 2018
- SET NORTH AMERICA, LLC
- Eric Frank Schulte
- B32 - LAYERED PRODUCTS
Information Patent Application
System for Low-Force Thermocompression Bonding
- Publication number 20180132393
- Publication date May 10, 2018
- SET NORTH AMERICA, LLC
- Eric Frank Schulte
- B32 - LAYERED PRODUCTS
Information Patent Application
Thermocompression Bonding with Passivated Nickel-Based Contacting M...
- Publication number 20180132399
- Publication date May 10, 2018
- SET NORTH AMERICA, LLC
- Eric Frank Schulte
- B32 - LAYERED PRODUCTS
Information Patent Application
Ball Height Control in Bonding Process
- Publication number 20170236797
- Publication date Aug 17, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Yuan Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOWIRES FOR PILLAR INTERCONNECTS
- Publication number 20170162536
- Publication date Jun 8, 2017
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR PACKAGE ON PACKAGE THROUGH MOLD INTERCONNECTS
- Publication number 20170133350
- Publication date May 11, 2017
- Intel Corporation
- Shubhada H. Sahasrabudhe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bump Structure for Yield Improvement
- Publication number 20170133346
- Publication date May 11, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Wei Chiu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD AND APPARATUS FOR DIE-TO-DIE PAD CONTACT
- Publication number 20160099228
- Publication date Apr 7, 2016
- HGST NETHERLANDS B.V.
- Luiz M. FRANCA-NETO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH MOUNTING STRUCTURE
- Publication number 20140335655
- Publication date Nov 13, 2014
- Rui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES FOR STACKED DIES, INCLUDING PENETRATING STR...
- Publication number 20140206145
- Publication date Jul 24, 2014
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER FATIGUE ARREST FOR WAFER LEVEL PACKAGE
- Publication number 20140131859
- Publication date May 15, 2014
- Yong Li Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D Packaging With Low-Force Thermocompression Bonding Of Oxidizable...
- Publication number 20130270329
- Publication date Oct 17, 2013
- Eric Frank Schulte
- B32 - LAYERED PRODUCTS
Information Patent Application
INTERCONNECT STRUCTURES FOR STACKED DIES, INCLUDING PENETRATING STR...
- Publication number 20130234296
- Publication date Sep 12, 2013
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH COUPLING FEATURES AND METH...
- Publication number 20130154107
- Publication date Jun 20, 2013
- MinJung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20120091583
- Publication date Apr 19, 2012
- Michihiro KAWASHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES FOR STACKED DIES, INCLUDING PENETRATING STR...
- Publication number 20110111561
- Publication date May 12, 2011
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20100155940
- Publication date Jun 24, 2010
- Renesas Technology Corp.
- Michihiro KAWASHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH MOUNTING STRUCTURE
- Publication number 20100078828
- Publication date Apr 1, 2010
- Rui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES FOR STACKED DIES, INCLUDING PENETRATING STR...
- Publication number 20100059897
- Publication date Mar 11, 2010
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Display device

3D packaging with low-force thermocompression bonding of oxidizable...

Micro-LED module and method for fabricating the same

Micro-LED module and method for fabricating the same

Multi-strike process for bonding packages and the packages thereof

Bump structure for yield improvement

Ball height control in bonding process

Jointed body, method for manufacturing same and jointed member

Semiconductor device and method of manufacturing same

Systems and methods for package on package through mold interconnects

Solder fatigue arrest for wafer level package

Multi-strike process for bonding

Semiconductor device with at least one voltage-guided conductive fi...

Semiconductor device and method of manufacturing same

Interconnect structures for stacked dies, including penetrating str...

Semiconductor device and method of manufacturing same

Semiconductor device and method of manufacturing the same

Integrated circuit package system with mounting structure

Integrated circuit packaging system with coupling features and meth...

Interconnect structures for stacked dies, including penetrating str...

Interconnect structures for stacked dies, including penetrating str...

Semiconductor device and method of manufacturing the same

Interconnect structures for stacked dies, including penetrating str...

Method of manufacturing chip-on-chip semiconductor device

Method and structure for dispensing chip underfill through an openi...

Chip interconnection structure using stub terminals

Direct die contact (DDC) semiconductor package

Method and apparatus for interconnecting multiple circuit chips

Direct die contact (DDC) semiconductor package

High density electrical connectors

Patents Applicationslast 30 patents

THERMOCOMPRESSION BONDING WITH PASSIVATED SILVER-BASED CONTACTING M...

Thermocompression Bonding with Passivated Gold Contacting Metal

Thermocompression Bonding with Passivated Tin-Based Contacting Metal

Thermocompression Bonding with Passivated Copper-Based Contacting M...

Thermocompression Bonding Using Metastable Gas Atoms

Thermocompression Bonding with Passivated Nickel-Based Contacting M...

MICRO-LED MODULE AND METHOD FOR FABRICATING THE SAME

Thermocompression Bonding with Passivated Gold Contacting Metal

Thermocompression Bonding with Passivated Silver-Based Contacting M...

Thermocompression Bonding with Passivated Indium-Based Contacting M...

Thermocompression Bonding with Passivated Copper-Based Contacting M...

Thermocompression Bonding Using Metastable Gas Atoms

System for Low-Force Thermocompression Bonding

Thermocompression Bonding with Passivated Nickel-Based Contacting M...

Ball Height Control in Bonding Process

NANOWIRES FOR PILLAR INTERCONNECTS

SYSTEMS AND METHODS FOR PACKAGE ON PACKAGE THROUGH MOLD INTERCONNECTS

Bump Structure for Yield Improvement

METHOD AND APPARATUS FOR DIE-TO-DIE PAD CONTACT

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH MOUNTING STRUCTURE

INTERCONNECT STRUCTURES FOR STACKED DIES, INCLUDING PENETRATING STR...

SOLDER FATIGUE ARREST FOR WAFER LEVEL PACKAGE

3D Packaging With Low-Force Thermocompression Bonding Of Oxidizable...

INTERCONNECT STRUCTURES FOR STACKED DIES, INCLUDING PENETRATING STR...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH COUPLING FEATURES AND METH...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

INTERCONNECT STRUCTURES FOR STACKED DIES, INCLUDING PENETRATING STR...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH MOUNTING STRUCTURE

INTERCONNECT STRUCTURES FOR STACKED DIES, INCLUDING PENETRATING STR...