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Patent Grant
Semiconductor device having outer terminal portions with conductive...
Patent number
11,887,915
Issue date
Jan 30, 2024
Amkor Technology Japan, Inc.
Masafumi Suzuhara
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Side-solderable leadless package
Patent number
11,810,842
Issue date
Nov 7, 2023
Semtech Corporation
Henry Descalzo Bathan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and methods of forming the same
Patent number
11,769,716
Issue date
Sep 26, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Yung-Sheng Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing semiconductor device and semiconductor device
Patent number
11,626,353
Issue date
Apr 11, 2023
Mitsubishi Electric Corporation
Shuhei Yokoyama
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package having wettable lead flank and method of maki...
Patent number
11,581,195
Issue date
Feb 14, 2023
ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
Yan Xun Xue
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Modified leadframe design with adhesive overflow recesses
Patent number
11,552,007
Issue date
Jan 10, 2023
STMicroelectronics, Inc.
Rennier Rodriguez
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing semiconductor device
Patent number
11,387,173
Issue date
Jul 12, 2022
Mitsubishi Electric Corporation
Ken Sakamoto
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Method of making leadframe strip
Patent number
11,373,940
Issue date
Jun 28, 2022
Texas Instruments Incorporated
Lee Han Meng@Eugene Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package lead design with grooves for improved dambar separation
Patent number
11,362,023
Issue date
Jun 14, 2022
Infineon Technologies AG
Jayaganasan Narayanasamy
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having outer terminal portions with conductive...
Patent number
11,322,431
Issue date
May 3, 2022
Amkor Technology Singapore Holding Pte Ltd.
Masafumi Suzuhara
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Through hole side wettable flank
Patent number
11,227,820
Issue date
Jan 18, 2022
Nexperia B.V.
Kan Wae Lam
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing semiconductor device
Patent number
11,075,091
Issue date
Jul 27, 2021
Shindengen Electric Manufacturing Co., Ltd.
Soichiro Umeda
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of manufacturing semiconductor device
Patent number
11,069,538
Issue date
Jul 20, 2021
Shindengen Electric Manufacturing Co., Ltd.
Soichiro Umeda
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Lead frame and method of manufacturing lead frame
Patent number
10,985,094
Issue date
Apr 20, 2021
Shinko Electric Industries Co., Ltd.
Shintaro Hayashi
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Siderail with mold compound relief
Patent number
10,964,629
Issue date
Mar 30, 2021
Texas Instruments Incorporated
Dolores Babaran Milo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device packaging assembly, lead frame strip and unit...
Patent number
10,957,633
Issue date
Mar 23, 2021
Infineon Technologies AG
Boon Teik Tee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Modified leadframe design with adhesive overflow recesses
Patent number
10,957,634
Issue date
Mar 23, 2021
STMicroelectronics, Inc.
Rennier Rodriguez
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing lead frame including electrode and hanger...
Patent number
10,937,666
Issue date
Mar 2, 2021
Nichia Corporation
Mayumi Fukuda
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor package with wettable flank
Patent number
10,930,581
Issue date
Feb 23, 2021
STMicroelectronics S.r.l.
Federico Giovanni Ziglioli
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Side-solderable leadless package
Patent number
10,892,211
Issue date
Jan 12, 2021
Semtech Corporation
Henry Descalzo Bathan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Circuit mounting structure and lead frame for system in package (SI...
Patent number
10,867,979
Issue date
Dec 15, 2020
OCTAVO SYSTEMS LLC
Masood Murtuza
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Positional relationship among components of semiconductor device
Patent number
10,796,983
Issue date
Oct 6, 2020
Renesas Electronics Corporation
Noriyuki Takahashi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of making leadframe strip
Patent number
10,784,190
Issue date
Sep 22, 2020
Texas Instruments Incorporated
Lee Han Meng@Eugene Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip packaging structure and manufacturing method for the same
Patent number
10,651,146
Issue date
May 12, 2020
Dawning Leading Technology Inc.
Diann-Fang Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Modified leadframe design with adhesive overflow recesses
Patent number
10,615,104
Issue date
Apr 7, 2020
STMicroelectronics, Inc.
Rennier Rodriguez
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and a method for manufacturing a semiconducto...
Patent number
10,559,523
Issue date
Feb 11, 2020
J-Devices Corporation
Masafumi Suzuhara
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Molded air cavity packages and methods for the production thereof
Patent number
10,529,638
Issue date
Jan 7, 2020
NXP USA, INC.
Audel Sanchez
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Positional relationship among components of semiconductor device
Patent number
10,461,020
Issue date
Oct 29, 2019
Renesas Electronics Corporation
Noriyuki Takahashi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Selective planishing method for making a semiconductor device
Patent number
10,438,816
Issue date
Oct 8, 2019
Texas Instruments Incorporated
Donald C. Abbott
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
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Patent Grant
Semiconductor device packaging assembly, lead frame strip and unit...
Patent number
10,438,870
Issue date
Oct 8, 2019
Infineon Technologies AG
Boon Teik Tee
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Patents Applications
last 30 patents
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Patent Application
POWER SEMICONDUCTOR MODULE, POWER SEMICONDUCTOR DEVICE AND METHOD F...
Publication number
20240120255
Publication date
Apr 11, 2024
Hitachi Energy Switzerland AG
Dominik TRUESSEL
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH RESIN BLEED CONTROL STRUCTURE AND METHOD...
Publication number
20240112989
Publication date
Apr 4, 2024
NXP USA, Inc.
Trent Uehling
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
Publication number
20240096766
Publication date
Mar 21, 2024
Amkor Technology Singapore Holding Pte. Ltd.
Hyeong Il JEON
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SMALL OUTLINE TRANSISTOR WITH THERMAL FLAT LEAD
Publication number
20240055331
Publication date
Feb 15, 2024
TEXAS INSTRUMENTS INCORPORATED
Hau Nguyen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
IGBT MODULE, MOTOR CONTROLLER, AND VEHICLE
Publication number
20240021714
Publication date
Jan 18, 2024
BYD COMPANY LIMITED
Guangming YANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Side-Solderable Leadless Package
Publication number
20240021504
Publication date
Jan 18, 2024
SEMTECH CORPORATION
Henry Descalzo Bathan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
Publication number
20240014105
Publication date
Jan 11, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Yung-Sheng Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE HAVING WETTABLE LEAD FLANKS AND TIE BARS AND...
Publication number
20230420340
Publication date
Dec 28, 2023
ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
Yan Xun Xue
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LEAD FRAME AND ELECTRONIC COMPONENT
Publication number
20230402352
Publication date
Dec 14, 2023
TDK Corporation
Kazuma YAMAWAKI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PRE-PRODUCT, METHOD AND ELECTRONIC DEVICE
Publication number
20230352377
Publication date
Nov 2, 2023
Hitachi Energy Switzerland AG
Dominik TRUESSEL
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Package, Lead Frame and Roughening Method Thereof
Publication number
20230298978
Publication date
Sep 21, 2023
DIODES INCORPORATED
Xiaorui Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming Substrate with 3-Sided W...
Publication number
20230197583
Publication date
Jun 22, 2023
SEMTECH CORPORATION
Henry D. Bathan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
Publication number
20230107764
Publication date
Apr 6, 2023
SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
Akira SAHASHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LEAD FRAME
Publication number
20230102887
Publication date
Mar 30, 2023
HAESUNG DS CO., LTD.
Dong Jin YOON
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Packages and Methods for Manufacturing Thereof
Publication number
20230095545
Publication date
Mar 30, 2023
Paul Armand Calo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20230092121
Publication date
Mar 23, 2023
Kabushiki Kaisha Toshiba
Kakeru YAMAGUCHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...
Publication number
20230042407
Publication date
Feb 9, 2023
STMicroelectronics S.r.l
Paolo CASATI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHODS OF FORMING THE SAME
Publication number
20220310492
Publication date
Sep 29, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Yung-Sheng Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20220301985
Publication date
Sep 22, 2022
Rohm Co., Ltd.
Katsutoki SHIRAI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND A METHOD FOR MANUFACTURING A SEMICONDUCTO...
Publication number
20220254704
Publication date
Aug 11, 2022
Amkor Technology Japan, Inc.
Masafumi SUZUHARA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, COMPONENT FOR USE TH...
Publication number
20220199500
Publication date
Jun 23, 2022
STMicroelectronics S.r.l
Mauro MAZZOLA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE HAVING WETTABLE LEAD FLANK AND METHOD OF MAKI...
Publication number
20220199425
Publication date
Jun 23, 2022
ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
Yan Xun Xue
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
Publication number
20220102250
Publication date
Mar 31, 2022
Mitsubishi Electric Corporation
Shuhei YOKOYAMA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device Package Comprising Side Walls Connected with C...
Publication number
20220037240
Publication date
Feb 3, 2022
Petteri Palm
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Leadframe, Encapsulated Package with Punched Lead and Sawn Side Fla...
Publication number
20210225744
Publication date
Jul 22, 2021
INFINEON TECHNOLOGIES AG
Frank Singer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MODIFIED LEADFRAME DESIGN WITH ADHESIVE OVERFLOW RECESSES
Publication number
20210183750
Publication date
Jun 17, 2021
STMICROELECTRONICS, INC.
Rennier Rodriguez
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE WITH WETTABLE FLANK
Publication number
20210143089
Publication date
May 13, 2021
STMicroelectronics S.r.l.
Federico Giovanni Ziglioli
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Side-Solderable Leadless Package
Publication number
20210118776
Publication date
Apr 22, 2021
SEMTECH CORPORATION
Henry Descalzo Bathan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRICAL DEVICE WITH TERMINAL NOTCHES AND METHOD FOR MANUFACTURIN...
Publication number
20210082792
Publication date
Mar 18, 2021
TAIWAN SEMICONDUCTOR CO., LTD.
Chien-Chung CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Package Lead Design with Grooves for Improved Dambar Separation
Publication number
20210013135
Publication date
Jan 14, 2021
Jayaganasan Narayanasamy
H01 - BASIC ELECTRIC ELEMENTS