Side rails of the lead frame

Industry

CPC
H01L23/49565

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/49565Side rails of the lead frame

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 12,176,269
- Issue date Dec 24, 2024
- Rohm Co., Ltd.
- Katsutoki Shirai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming substrate with 3-sided w...
- Patent number 12,176,273
- Issue date Dec 24, 2024
- Semtech Corporation
- Henry D. Bathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe, encapsulated package with punched lead and sawn side fla...
- Patent number 12,165,959
- Issue date Dec 10, 2024
- Infineon Technologies AG
- Frank Singer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,131,983
- Issue date Oct 29, 2024
- Rohm Co., Ltd.
- Katsutoki Shirai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame assembly having a plurality of dicing holes
- Patent number 12,113,001
- Issue date Oct 8, 2024
- CHANG WAH TECHNOLOGY CO., LTD.
- Chia-Neng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package comprising side walls connected with c...
- Patent number 11,978,693
- Issue date May 7, 2024
- Infineon Technologies AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having outer terminal portions with conductive...
- Patent number 11,887,915
- Issue date Jan 30, 2024
- Amkor Technology Japan, Inc.
- Masafumi Suzuhara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Side-solderable leadless package
- Patent number 11,810,842
- Issue date Nov 7, 2023
- Semtech Corporation
- Henry Descalzo Bathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and methods of forming the same
- Patent number 11,769,716
- Issue date Sep 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device and semiconductor device
- Patent number 11,626,353
- Issue date Apr 11, 2023
- Mitsubishi Electric Corporation
- Shuhei Yokoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having wettable lead flank and method of maki...
- Patent number 11,581,195
- Issue date Feb 14, 2023
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modified leadframe design with adhesive overflow recesses
- Patent number 11,552,007
- Issue date Jan 10, 2023
- STMicroelectronics, Inc.
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 11,387,173
- Issue date Jul 12, 2022
- Mitsubishi Electric Corporation
- Ken Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making leadframe strip
- Patent number 11,373,940
- Issue date Jun 28, 2022
- Texas Instruments Incorporated
- Lee Han Meng@Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package lead design with grooves for improved dambar separation
- Patent number 11,362,023
- Issue date Jun 14, 2022
- Infineon Technologies AG
- Jayaganasan Narayanasamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having outer terminal portions with conductive...
- Patent number 11,322,431
- Issue date May 3, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Masafumi Suzuhara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through hole side wettable flank
- Patent number 11,227,820
- Issue date Jan 18, 2022
- Nexperia B.V.
- Kan Wae Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 11,075,091
- Issue date Jul 27, 2021
- Shindengen Electric Manufacturing Co., Ltd.
- Soichiro Umeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 11,069,538
- Issue date Jul 20, 2021
- Shindengen Electric Manufacturing Co., Ltd.
- Soichiro Umeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame and method of manufacturing lead frame
- Patent number 10,985,094
- Issue date Apr 20, 2021
- Shinko Electric Industries Co., Ltd.
- Shintaro Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Siderail with mold compound relief
- Patent number 10,964,629
- Issue date Mar 30, 2021
- Texas Instruments Incorporated
- Dolores Babaran Milo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packaging assembly, lead frame strip and unit...
- Patent number 10,957,633
- Issue date Mar 23, 2021
- Infineon Technologies AG
- Boon Teik Tee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modified leadframe design with adhesive overflow recesses
- Patent number 10,957,634
- Issue date Mar 23, 2021
- STMicroelectronics, Inc.
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing lead frame including electrode and hanger...
- Patent number 10,937,666
- Issue date Mar 2, 2021
- Nichia Corporation
- Mayumi Fukuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with wettable flank
- Patent number 10,930,581
- Issue date Feb 23, 2021
- STMicroelectronics S.r.l.
- Federico Giovanni Ziglioli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Side-solderable leadless package
- Patent number 10,892,211
- Issue date Jan 12, 2021
- Semtech Corporation
- Henry Descalzo Bathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit mounting structure and lead frame for system in package (SI...
- Patent number 10,867,979
- Issue date Dec 15, 2020
- OCTAVO SYSTEMS LLC
- Masood Murtuza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Positional relationship among components of semiconductor device
- Patent number 10,796,983
- Issue date Oct 6, 2020
- Renesas Electronics Corporation
- Noriyuki Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making leadframe strip
- Patent number 10,784,190
- Issue date Sep 22, 2020
- Texas Instruments Incorporated
- Lee Han Meng@Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip packaging structure and manufacturing method for the same
- Patent number 10,651,146
- Issue date May 12, 2020
- Dawning Leading Technology Inc.
- Diann-Fang Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device and Method of Forming Substrate with 3-Sided W...
- Publication number 20250062197
- Publication date Feb 20, 2025
- SEMTECH CORPORATION
- Henry D. Bathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadframe, Encapsulated Package with Punched Lead and Sawn Side Fla...
- Publication number 20250054843
- Publication date Feb 13, 2025
- INFINEON TECHNOLOGIES AG
- Frank Singer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250029898
- Publication date Jan 23, 2025
- Rohm Co., Ltd.
- Katsutoki SHIRAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING WETTABLE FLANKS AND RELATED METHODS
- Publication number 20240332135
- Publication date Oct 3, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Soon Wei WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED ELECTRONIC DEVICES AND METHODS OF MAKING SAME
- Publication number 20240258214
- Publication date Aug 1, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Makoto SHIBUYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EDGE-STRUCTURED LEADFRAME FOR EMBEDDED DIE PACKAGING OF POWER SEMIC...
- Publication number 20240213125
- Publication date Jun 27, 2024
- GaN Systems Inc.
- Abhinandan DIXIT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH A CIRCULAR SEGMENTED PACKAGE EDGE
- Publication number 20240203842
- Publication date Jun 20, 2024
- Micron Technology, Inc.
- Seng Kim YE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE, POWER SEMICONDUCTOR DEVICE AND METHOD F...
- Publication number 20240120255
- Publication date Apr 11, 2024
- Hitachi Energy Switzerland AG
- Dominik TRUESSEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH RESIN BLEED CONTROL STRUCTURE AND METHOD...
- Publication number 20240112989
- Publication date Apr 4, 2024
- NXP USA, Inc.
- Trent Uehling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20240096766
- Publication date Mar 21, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Hyeong Il JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SMALL OUTLINE TRANSISTOR WITH THERMAL FLAT LEAD
- Publication number 20240055331
- Publication date Feb 15, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Hau Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IGBT MODULE, MOTOR CONTROLLER, AND VEHICLE
- Publication number 20240021714
- Publication date Jan 18, 2024
- BYD COMPANY LIMITED
- Guangming YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Side-Solderable Leadless Package
- Publication number 20240021504
- Publication date Jan 18, 2024
- SEMTECH CORPORATION
- Henry Descalzo Bathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20240014105
- Publication date Jan 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING WETTABLE LEAD FLANKS AND TIE BARS AND...
- Publication number 20230420340
- Publication date Dec 28, 2023
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME AND ELECTRONIC COMPONENT
- Publication number 20230402352
- Publication date Dec 14, 2023
- TDK Corporation
- Kazuma YAMAWAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRE-PRODUCT, METHOD AND ELECTRONIC DEVICE
- Publication number 20230352377
- Publication date Nov 2, 2023
- Hitachi Energy Switzerland AG
- Dominik TRUESSEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package, Lead Frame and Roughening Method Thereof
- Publication number 20230298978
- Publication date Sep 21, 2023
- DIODES INCORPORATED
- Xiaorui Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Substrate with 3-Sided W...
- Publication number 20230197583
- Publication date Jun 22, 2023
- SEMTECH CORPORATION
- Henry D. Bathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20230107764
- Publication date Apr 6, 2023
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Akira SAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages and Methods for Manufacturing Thereof
- Publication number 20230095545
- Publication date Mar 30, 2023
- Paul Armand Calo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME
- Publication number 20230102887
- Publication date Mar 30, 2023
- HAESUNG DS CO., LTD.
- Dong Jin YOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230092121
- Publication date Mar 23, 2023
- Kabushiki Kaisha Toshiba
- Kakeru YAMAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...
- Publication number 20230042407
- Publication date Feb 9, 2023
- STMicroelectronics S.r.l
- Paolo CASATI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHODS OF FORMING THE SAME
- Publication number 20220310492
- Publication date Sep 29, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220301985
- Publication date Sep 22, 2022
- Rohm Co., Ltd.
- Katsutoki SHIRAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND A METHOD FOR MANUFACTURING A SEMICONDUCTO...
- Publication number 20220254704
- Publication date Aug 11, 2022
- Amkor Technology Japan, Inc.
- Masafumi SUZUHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, COMPONENT FOR USE TH...
- Publication number 20220199500
- Publication date Jun 23, 2022
- STMicroelectronics S.r.l
- Mauro MAZZOLA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING WETTABLE LEAD FLANK AND METHOD OF MAKI...
- Publication number 20220199425
- Publication date Jun 23, 2022
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20220102250
- Publication date Mar 31, 2022
- Mitsubishi Electric Corporation
- Shuhei YOKOYAMA
- H01 - BASIC ELECTRIC ELEMENTS

Side rails of the lead frame

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device

Semiconductor device and method of forming substrate with 3-sided w...

Leadframe, encapsulated package with punched lead and sawn side fla...

Semiconductor device

Lead frame assembly having a plurality of dicing holes

Semiconductor device package comprising side walls connected with c...

Semiconductor device having outer terminal portions with conductive...

Side-solderable leadless package

Semiconductor device and methods of forming the same

Method of manufacturing semiconductor device and semiconductor device

Semiconductor package having wettable lead flank and method of maki...

Modified leadframe design with adhesive overflow recesses

Method for manufacturing semiconductor device

Method of making leadframe strip

Package lead design with grooves for improved dambar separation

Semiconductor device having outer terminal portions with conductive...

Through hole side wettable flank

Method for manufacturing semiconductor device

Semiconductor device and method of manufacturing semiconductor device

Lead frame and method of manufacturing lead frame

Siderail with mold compound relief

Semiconductor device packaging assembly, lead frame strip and unit...

Modified leadframe design with adhesive overflow recesses

Method for manufacturing lead frame including electrode and hanger...

Semiconductor package with wettable flank

Side-solderable leadless package

Circuit mounting structure and lead frame for system in package (SI...

Positional relationship among components of semiconductor device

Method of making leadframe strip

Chip packaging structure and manufacturing method for the same

Patents Applicationslast 30 patents

Semiconductor Device and Method of Forming Substrate with 3-Sided W...

Leadframe, Encapsulated Package with Punched Lead and Sawn Side Fla...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE HAVING WETTABLE FLANKS AND RELATED METHODS

PACKAGED ELECTRONIC DEVICES AND METHODS OF MAKING SAME

EDGE-STRUCTURED LEADFRAME FOR EMBEDDED DIE PACKAGING OF POWER SEMIC...

SEMICONDUCTOR DEVICE ASSEMBLY WITH A CIRCULAR SEGMENTED PACKAGE EDGE

POWER SEMICONDUCTOR MODULE, POWER SEMICONDUCTOR DEVICE AND METHOD F...

SEMICONDUCTOR DEVICE WITH RESIN BLEED CONTROL STRUCTURE AND METHOD...

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

SMALL OUTLINE TRANSISTOR WITH THERMAL FLAT LEAD

IGBT MODULE, MOTOR CONTROLLER, AND VEHICLE

Side-Solderable Leadless Package

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR PACKAGE HAVING WETTABLE LEAD FLANKS AND TIE BARS AND...

LEAD FRAME AND ELECTRONIC COMPONENT

PRE-PRODUCT, METHOD AND ELECTRONIC DEVICE

Package, Lead Frame and Roughening Method Thereof

Semiconductor Device and Method of Forming Substrate with 3-Sided W...

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

Semiconductor Packages and Methods for Manufacturing Thereof

LEAD FRAME

SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...

SEMICONDUCTOR DEVICE AND METHODS OF FORMING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND A METHOD FOR MANUFACTURING A SEMICONDUCTO...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, COMPONENT FOR USE TH...

SEMICONDUCTOR PACKAGE HAVING WETTABLE LEAD FLANK AND METHOD OF MAKI...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE