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H01L2924/15156

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and a method of manufacturing thereof
- Patent number 12,119,321
- Issue date Oct 15, 2024
- Epistar Corporation
- Shih-An Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated light emitting diodes for selective fluidic assembly
- Patent number 12,119,432
- Issue date Oct 15, 2024
- eLux, Inc.
- Kenji Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and a method of manufacturing the same
- Patent number 11,837,557
- Issue date Dec 5, 2023
- Advanced Semiconductor Engineering, Inc.
- Peng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,676,904
- Issue date Jun 13, 2023
- Samsung Electronics Co., Ltd.
- Jiwon Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip assembly
- Patent number 11,508,694
- Issue date Nov 22, 2022
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing thereof
- Patent number 11,450,639
- Issue date Sep 20, 2022
- Epistar Corporation
- Shih-An Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and electronic equipment
- Patent number 11,211,322
- Issue date Dec 28, 2021
- Canon Kabushiki Kaisha
- Kunihiko Minegishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and a method of manufacturing the same
- Patent number 11,189,576
- Issue date Nov 30, 2021
- Advanced Semiconductor Engineering, Inc.
- Peng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate processing method and protective tape
- Patent number 11,183,464
- Issue date Nov 23, 2021
- Disco Corporation
- Byeongdeck Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing thereof
- Patent number 10,910,335
- Issue date Feb 2, 2021
- Epistar Corporation
- Shih-An Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated emissive element for fluidic assembly
- Patent number 10,777,714
- Issue date Sep 15, 2020
- eLux Inc.
- Kenji Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with plated lead frame
- Patent number 10,748,787
- Issue date Aug 18, 2020
- Infineon Technologies AG
- Carsten von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrates, assembles, and techniques to enable multi-chip flip chi...
- Patent number 10,748,873
- Issue date Aug 18, 2020
- Intel Corporation
- Mao Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for encapsulating emissive elements for fluidic assembly
- Patent number 10,749,083
- Issue date Aug 18, 2020
- eLux Inc.
- Kenji Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component housing package and electronic apparatus
- Patent number 10,645,824
- Issue date May 5, 2020
- Kyocera Corporation
- Noritaka Niino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit module and method of forming same
- Patent number 10,636,768
- Issue date Apr 28, 2020
- Starkey Laboratories, Inc.
- Sayed Kaysarbin Rahim
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Chip assembly
- Patent number 10,636,766
- Issue date Apr 28, 2020
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing thereof
- Patent number 10,622,325
- Issue date Apr 14, 2020
- Epistar Corporation
- Shih-An Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic elements with post-assembly planarization
- Patent number 10,559,494
- Issue date Feb 11, 2020
- Tessera, Inc.
- Vage Oganesian
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Encapsulated fluid assembly emissive elements
- Patent number 10,516,084
- Issue date Dec 24, 2019
- eLux, Inc.
- Kenji Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor die assemblies with improved thermal performa...
- Patent number 10,461,059
- Issue date Oct 29, 2019
- Micron Technology, Inc.
- Michel Koopmans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 10,460,989
- Issue date Oct 29, 2019
- Rohm Co., Ltd.
- Hirofumi Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for using universal cavity wafer in wafer leve...
- Patent number 10,418,249
- Issue date Sep 17, 2019
- The Charles Stark Draper Laboratory, Inc.
- Maurice Karpman
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Printed circuit board and electronic equipment
- Patent number 10,403,571
- Issue date Sep 3, 2019
- Canon Kabushiki Kaisha
- Kunihiko Minegishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned three dimensional chip stack and method for making the...
- Patent number 10,388,639
- Issue date Aug 20, 2019
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned three dimensional chip stack and method for making the...
- Patent number 10,347,617
- Issue date Jul 9, 2019
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned three dimensional chip stack and method for making the...
- Patent number 10,304,815
- Issue date May 28, 2019
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with recess and method of making
- Patent number 10,297,468
- Issue date May 21, 2019
- Rohm Co., Ltd.
- Yuichi Nakao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing thereof
- Patent number 10,170,440
- Issue date Jan 1, 2019
- Epistar Corporation
- Shih-An Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 10,163,775
- Issue date Dec 25, 2018
- Rohm Co., Ltd.
- Hideaki Yanagida
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED-CIRCUIT MODULE COLLECTION AND DEPOSITION
- Publication number 20240347367
- Publication date Oct 17, 2024
- X-CELEPRINT LIMITED
- Ronald S. Cok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20240128206
- Publication date Apr 18, 2024
- Advanced Semiconductor Engineering, Inc.
- Peng YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230387029
- Publication date Nov 30, 2023
- Samsung Electronics Co., Ltd.
- JIWON SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR LIGHT-EMITTING ELEMENT TRANSFERRING AND DISPLAY PANEL
- Publication number 20230061742
- Publication date Mar 2, 2023
- CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO., LTD.
- Fei PAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THEREOF
- Publication number 20230017939
- Publication date Jan 19, 2023
- EPISTAR CORPORATION
- Shih-An LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20220084958
- Publication date Mar 17, 2022
- Advanced Semiconductor Engineering, Inc.
- Peng YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220045010
- Publication date Feb 10, 2022
- Samsung Electronics Co., Ltd.
- JIWON SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THEREOF
- Publication number 20210151405
- Publication date May 20, 2021
- Epistar Corporation
- Shih-An LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THEREOF
- Publication number 20200227371
- Publication date Jul 16, 2020
- Epistar Corporation
- Shih-An LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A CHIP ASSEMBLY AND CHIP ASSEMBLY
- Publication number 20200219848
- Publication date Jul 9, 2020
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND ELECTRONIC EQUIPMENT
- Publication number 20190348359
- Publication date Nov 14, 2019
- Canon Kabushiki Kaisha
- Kunihiko Minegishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THEREOF
- Publication number 20190109111
- Publication date Apr 11, 2019
- EPISTAR CORPORATION
- Shih-An LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ELEMENTS WITH POST-ASSEMBLY PLANARIZATION
- Publication number 20180254213
- Publication date Sep 6, 2018
- Tessera, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATES, ASSEMBLES, AND TECHNIQUES TO ENABLE MULTI-CHIP FLIP CHI...
- Publication number 20180204821
- Publication date Jul 19, 2018
- Intel Corporation
- Mao Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND ELECTRONIC EQUIPMENT
- Publication number 20180204793
- Publication date Jul 19, 2018
- Canon Kabushiki Kaisha
- Kunihiko Minegishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC PACKAGE
- Publication number 20180130729
- Publication date May 10, 2018
- TDK - Micronas GmbH
- Klaus HEBERLE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR USING UNIVERSAL CAVITY WAFER IN WAFER LEVE...
- Publication number 20180108533
- Publication date Apr 19, 2018
- The Charles Stark Draper Laboratory, Inc.
- Maurice Karpman
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor Device with Plated Lead Frame
- Publication number 20180061671
- Publication date Mar 1, 2018
- INFINEON TECHNOLOGIES AG
- Carsten von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE PACKAGE, BACKLIGHT UNIT, ILLUMINATION APPARAT...
- Publication number 20180047884
- Publication date Feb 15, 2018
- LUMENS CO., LTD
- Seung-Hyun OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20170098625
- Publication date Apr 6, 2017
- Rohm Co., Ltd.
- Hirofumi TAKEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Mounting a Chip and Chip Package
- Publication number 20150102486
- Publication date Apr 16, 2015
- Point Engineering Co., Ltd.
- Bum Mo Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT ASSEMBLY USING A TEMPORARY ATTACH MATERIAL
- Publication number 20140374925
- Publication date Dec 25, 2014
- Elizabeth A. LOGAN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELECTRONIC COMPONENT MOUNTING STRUCTURE
- Publication number 20140367156
- Publication date Dec 18, 2014
- OLYMPUS CORPORATION
- Takanori Sekido
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20140332976
- Publication date Nov 13, 2014
- Siliconware Precision Industries Co., Ltd.
- Yan-Heng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC MODULE ALLOWING FINE TUNING AFTER ASSEMBLY
- Publication number 20140334120
- Publication date Nov 13, 2014
- Michael Dakhiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP AND CHIP ARRANGEMENT
- Publication number 20140306331
- Publication date Oct 16, 2014
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140284731
- Publication date Sep 25, 2014
- ROHM CO., LTD.
- Yuichi NAKAO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WIRING SUBSTRATE
- Publication number 20140284081
- Publication date Sep 25, 2014
- Tomohiro Nishida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Formulation for Packaging an Electronic Device and Assemblies Made...
- Publication number 20140268625
- Publication date Sep 18, 2014
- David William Sherrer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT AND HETEROGENEOUS PACKAGING OF ELECTRONIC COMPONENTS
- Publication number 20140252655
- Publication date Sep 11, 2014
- Khanh Tran
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and a method of manufacturing thereof

Encapsulated light emitting diodes for selective fluidic assembly

Semiconductor device package and a method of manufacturing the same

Semiconductor package

Chip assembly

Semiconductor device and a method of manufacturing thereof

Printed circuit board and electronic equipment

Semiconductor device package and a method of manufacturing the same

Package substrate processing method and protective tape

Semiconductor device and a method of manufacturing thereof

Encapsulated emissive element for fluidic assembly

Semiconductor device with plated lead frame

Substrates, assembles, and techniques to enable multi-chip flip chi...

Method for encapsulating emissive elements for fluidic assembly

Electronic component housing package and electronic apparatus

Integrated circuit module and method of forming same

Chip assembly

Semiconductor device and a method of manufacturing thereof

Microelectronic elements with post-assembly planarization

Encapsulated fluid assembly emissive elements

Stacked semiconductor die assemblies with improved thermal performa...

Semiconductor device and manufacturing method thereof

Method and apparatus for using universal cavity wafer in wafer leve...

Printed circuit board and electronic equipment

Self-aligned three dimensional chip stack and method for making the...

Self-aligned three dimensional chip stack and method for making the...

Self-aligned three dimensional chip stack and method for making the...

Semiconductor device with recess and method of making

Semiconductor device and a method of manufacturing thereof

Electronic device

Patents Applicationslast 30 patents

INTEGRATED-CIRCUIT MODULE COLLECTION AND DEPOSITION

SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE

METHOD FOR LIGHT-EMITTING ELEMENT TRANSFERRING AND DISPLAY PANEL

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THEREOF

SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THEREOF

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THEREOF

METHOD OF FORMING A CHIP ASSEMBLY AND CHIP ASSEMBLY

PRINTED CIRCUIT BOARD AND ELECTRONIC EQUIPMENT

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THEREOF

MICROELECTRONIC ELEMENTS WITH POST-ASSEMBLY PLANARIZATION

SUBSTRATES, ASSEMBLES, AND TECHNIQUES TO ENABLE MULTI-CHIP FLIP CHI...

PRINTED CIRCUIT BOARD AND ELECTRONIC EQUIPMENT

IC PACKAGE

METHOD AND APPARATUS FOR USING UNIVERSAL CAVITY WAFER IN WAFER LEVE...

Semiconductor Device with Plated Lead Frame

LIGHT EMITTING DEVICE PACKAGE, BACKLIGHT UNIT, ILLUMINATION APPARAT...

SEMICONDUCTOR DEVICE

Method for Mounting a Chip and Chip Package

COMPONENT ASSEMBLY USING A TEMPORARY ATTACH MATERIAL

ELECTRONIC COMPONENT MOUNTING STRUCTURE

SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF

ELECTRONIC MODULE ALLOWING FINE TUNING AFTER ASSEMBLY

CHIP AND CHIP ARRANGEMENT

SEMICONDUCTOR DEVICE

WIRING SUBSTRATE

Formulation for Packaging an Electronic Device and Assemblies Made...

FAN-OUT AND HETEROGENEOUS PACKAGING OF ELECTRONIC COMPONENTS