Side view

Industry

CPC
H01L2924/15159

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/15159Side view

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 12,322,729
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Weiming Chris Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and devices for fabricating and assembling printable semico...
- Patent number 12,074,213
- Issue date Aug 27, 2024
- The Board of Trustees of the University of Illinois
- Ralph G. Nuzzo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Multi-die fine grain integrated voltage regulation
- Patent number 12,068,324
- Issue date Aug 20, 2024
- Apple Inc.
- Jared L. Zerbe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,057,434
- Issue date Aug 6, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Jin Seong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,009,289
- Issue date Jun 11, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Jae Ung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly including plural through wafer vias, method of cooling the...
- Patent number 11,967,548
- Issue date Apr 23, 2024
- International Business Machines Corporation
- Kerry Bernstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assembly that includes a bridge
- Patent number 11,676,900
- Issue date Jun 13, 2023
- Intel Corporation
- Eric J. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,574,878
- Issue date Feb 7, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Tzuan-Horng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display panel and head mounted device
- Patent number 11,532,603
- Issue date Dec 20, 2022
- PlayNitride Display Co., Ltd.
- Yi-Ching Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating substrate structure
- Patent number 11,527,491
- Issue date Dec 13, 2022
- Siliconware Precision Industries Co., Ltd.
- Po-Hao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,508,696
- Issue date Nov 22, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Weiming Chris Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,488,934
- Issue date Nov 1, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Jin Seong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensors with organic photodiodes and methods for forming the...
- Patent number 11,404,484
- Issue date Aug 2, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Wei Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices designed with compound semiconductor device...
- Patent number 11,335,651
- Issue date May 17, 2022
- Intel Corporation
- Telesphor Kamgaing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic circuit connection method and electronic circuit
- Patent number 11,270,968
- Issue date Mar 8, 2022
- National Institute of Advanced Industrial Science and Technology
- Masaru Hashino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rod-based substrate with ringed interconnect layers
- Patent number 11,239,126
- Issue date Feb 1, 2022
- Intel Corporation
- Florence Su Sin Phun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and substrate structure having chamfers
- Patent number 11,227,842
- Issue date Jan 18, 2022
- Siliconware Precision Industries Co., Ltd.
- Po-Hao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device and method of manufacturing the light emittin...
- Patent number 11,227,983
- Issue date Jan 18, 2022
- Nichia Corporation
- Tsuzuki Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Switched closed loop read-out methods and systems for resonant sens...
- Patent number 11,221,354
- Issue date Jan 11, 2022
- Intel Corporation
- Georgios C. Dogiamis
- G01 - MEASURING TESTING
Information Patent Grant
Chip on film package and display apparatus having ihe same
- Patent number 11,215,883
- Issue date Jan 4, 2022
- Samsung Display Co., Ltd.
- Chong-Guk Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and electronic equipment
- Patent number 11,211,322
- Issue date Dec 28, 2021
- Canon Kabushiki Kaisha
- Kunihiko Minegishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming modular 3D semiconductor...
- Patent number 11,211,359
- Issue date Dec 28, 2021
- Semiconductor Components Industries, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor package with flexible printed circuits
- Patent number 11,171,170
- Issue date Nov 9, 2021
- Sony Corporation
- Yuta Momiuchi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor device package having continously formed tapered prot...
- Patent number 11,164,756
- Issue date Nov 2, 2021
- Advanced Semiconductor Engineering, Inc.
- Ying-Xu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically testable integrated circuit packaging
- Patent number 11,164,801
- Issue date Nov 2, 2021
- pSemi Corporation
- Mark Moffat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal performance structure for semiconductor packages and method...
- Patent number 11,158,614
- Issue date Oct 26, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jung Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,152,296
- Issue date Oct 19, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Jae Ung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and devices for fabricating and assembling printable semico...
- Patent number 11,088,268
- Issue date Aug 10, 2021
- The Board of Trustees of the University of Illinois
- Ralph G. Nuzzo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Antenna-integrated type communication module and manufacturing meth...
- Patent number 11,081,804
- Issue date Aug 3, 2021
- Murata Manufacturing Co., Ltd.
- Ryuken Mizunuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die fine grain integrated voltage regulation
- Patent number 11,063,046
- Issue date Jul 13, 2021
- Apple Inc.
- Jared L. Zerbe
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS FOR CUSTOMIZED SESMICONDIUCTOR PACKAGING, SERVER, SYSTEM...
- Publication number 20250183150
- Publication date Jun 5, 2025
- UNIST (ULSAN NATIONAL INSTITUTE OF SCIENCE AND TECHNOLOGY)
- Jimin Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Die Fine Grain Integrated Voltage Regulation
- Publication number 20250149489
- Publication date May 8, 2025
- Apple Inc.
- Jared L. Zerbe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Submounts with Stud Protrusions for Semiconductor Packages
- Publication number 20250038056
- Publication date Jan 30, 2025
- Wolfspeed, Inc.
- Afshin Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Die Fine Grain Integrated Voltage Regulation
- Publication number 20250015033
- Publication date Jan 9, 2025
- Apple Inc.
- Jared L. Zerbe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240395771
- Publication date Nov 28, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Jin Seong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING
- Publication number 20240387184
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yan-Yu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240332159
- Publication date Oct 3, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Jae Ung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, METHOD OF FORMING THE PACKAGE AND ELECTRONIC...
- Publication number 20230135498
- Publication date May 4, 2023
- STMicroelectronics S.r.l.
- Yi Ming LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES DESIGNED WITH COMPOUND SEMICONDUCTOR DEVICE...
- Publication number 20220246554
- Publication date Aug 4, 2022
- Intel Corporation
- Telesphor KAMGAING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL AND HEAD MOUNTED DEVICE
- Publication number 20210398953
- Publication date Dec 23, 2021
- Yi-Ching CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND DEVICES FOR FABRICATING AND ASSEMBLING PRINTABLE SEMICO...
- Publication number 20210343862
- Publication date Nov 4, 2021
- THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS
- Ralph G. NUZZO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR FABRICATING SUBSTRATE STRUCTURE
- Publication number 20210296261
- Publication date Sep 23, 2021
- Siliconware Precision Industries Co., Ltd.
- Po-Hao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC CIRCUIT CONNECTION METHOD AND ELECTRONIC CIRCUIT
- Publication number 20210249374
- Publication date Aug 12, 2021
- NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
- Masaru HASHINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROD-BASED SUBSTRATE WITH RINGED INTERCONNECT LAYERS
- Publication number 20210074598
- Publication date Mar 11, 2021
- Intel Corporation
- Florence Su Sin Phun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image Sensors with Organic Photodiodes and Methods for Forming the...
- Publication number 20200373357
- Publication date Nov 26, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chin-Wei Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND SUBSTRATE STRUCTURE HAVING CHAMFERS
- Publication number 20200350261
- Publication date Nov 5, 2020
- Siliconware Precision Industries Co., Ltd.
- Po-Hao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Manufacture
- Publication number 20200279833
- Publication date Sep 3, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20200211863
- Publication date Jul 2, 2020
- Advanced Semiconductor Engineering, Inc.
- Ying-Xu LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200144168
- Publication date May 7, 2020
- Advanced Semiconductor Engineering, Inc.
- Wen-Long LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLY INCLUDING PLURAL THROUGH WAFER VIAS, METHOD OF COOLING THE...
- Publication number 20200144169
- Publication date May 7, 2020
- International Business Machines Corporation
- Kerry Bernstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAND SIDE AND DIE SIDE CAVITIES TO REDUCE PACKAGE Z-HEIGHT
- Publication number 20200051901
- Publication date Feb 13, 2020
- Intel Corporation
- MD Altaf Hossain
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS AND DEVICES FOR FABRICATING AND ASSEMBLING PRINTABLE SEMICO...
- Publication number 20200006540
- Publication date Jan 2, 2020
- THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS
- Ralph G. NUZZO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PRINTED CIRCUIT BOARD AND ELECTRONIC EQUIPMENT
- Publication number 20190348359
- Publication date Nov 14, 2019
- Canon Kabushiki Kaisha
- Kunihiko Minegishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES DESIGNED WITH FOLDABLE FLEXIBLE SUBSTRATES...
- Publication number 20190288371
- Publication date Sep 19, 2019
- Intel Corporation
- Telesphor Kamgaing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULE
- Publication number 20190273036
- Publication date Sep 5, 2019
- Kyocera Corporation
- Michio IMAYOSHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC SYSTEM HAVING INCREASED COUPLING BY USING HORIZONTAL AND...
- Publication number 20190244948
- Publication date Aug 8, 2019
- STMicroelectronics S.r.l
- Alberto Pagani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Manufacture
- Publication number 20190131279
- Publication date May 2, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC CIRCUIT PACKAGE USING COMPOSITE MAGNETIC SEALING MATERIAL
- Publication number 20190035744
- Publication date Jan 31, 2019
- TDK Corporation
- KENICHI KAWABATA
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
EMBEDDED VIALESS BRIDGES
- Publication number 20190019754
- Publication date Jan 17, 2019
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Die Fine Grain Integrated Voltage Regulation
- Publication number 20180366466
- Publication date Dec 20, 2018
- Apple Inc.
- Jared L. Zerbe
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device

Methods and devices for fabricating and assembling printable semico...

Multi-die fine grain integrated voltage regulation

Semiconductor package and manufacturing method thereof

Semiconductor package and manufacturing method thereof

Assembly including plural through wafer vias, method of cooling the...

Electronic assembly that includes a bridge

Semiconductor structure and manufacturing method thereof

Display panel and head mounted device

Method for fabricating substrate structure

Semiconductor device

Semiconductor package and manufacturing method thereof

Image sensors with organic photodiodes and methods for forming the...

Microelectronic devices designed with compound semiconductor device...

Electronic circuit connection method and electronic circuit

Rod-based substrate with ringed interconnect layers

Electronic package and substrate structure having chamfers

Light emitting device and method of manufacturing the light emittin...

Switched closed loop read-out methods and systems for resonant sens...

Chip on film package and display apparatus having ihe same

Printed circuit board and electronic equipment

Semiconductor device and method of forming modular 3D semiconductor...

Image sensor package with flexible printed circuits

Semiconductor device package having continously formed tapered prot...

Electrically testable integrated circuit packaging

Thermal performance structure for semiconductor packages and method...

Semiconductor package and manufacturing method thereof

Methods and devices for fabricating and assembling printable semico...

Antenna-integrated type communication module and manufacturing meth...

Multi-die fine grain integrated voltage regulation

Patents Applicationslast 30 patents

APPARATUS FOR CUSTOMIZED SESMICONDIUCTOR PACKAGING, SERVER, SYSTEM...

Multi-Die Fine Grain Integrated Voltage Regulation

Submounts with Stud Protrusions for Semiconductor Packages

Multi-Die Fine Grain Integrated Voltage Regulation

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE, METHOD OF FORMING THE PACKAGE AND ELECTRONIC...

MICROELECTRONIC DEVICES DESIGNED WITH COMPOUND SEMICONDUCTOR DEVICE...

DISPLAY PANEL AND HEAD MOUNTED DEVICE

METHODS AND DEVICES FOR FABRICATING AND ASSEMBLING PRINTABLE SEMICO...

METHOD FOR FABRICATING SUBSTRATE STRUCTURE

ELECTRONIC CIRCUIT CONNECTION METHOD AND ELECTRONIC CIRCUIT

ROD-BASED SUBSTRATE WITH RINGED INTERCONNECT LAYERS

Image Sensors with Organic Photodiodes and Methods for Forming the...

ELECTRONIC PACKAGE AND SUBSTRATE STRUCTURE HAVING CHAMFERS

Semiconductor Device and Method of Manufacture

SEMICONDUCTOR DEVICE PACKAGE

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

ASSEMBLY INCLUDING PLURAL THROUGH WAFER VIAS, METHOD OF COOLING THE...

LAND SIDE AND DIE SIDE CAVITIES TO REDUCE PACKAGE Z-HEIGHT

METHODS AND DEVICES FOR FABRICATING AND ASSEMBLING PRINTABLE SEMICO...

PRINTED CIRCUIT BOARD AND ELECTRONIC EQUIPMENT

MICROELECTRONIC DEVICES DESIGNED WITH FOLDABLE FLEXIBLE SUBSTRATES...

WIRING BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULE

ELECTRONIC SYSTEM HAVING INCREASED COUPLING BY USING HORIZONTAL AND...

Semiconductor Device and Method of Manufacture

ELECTRONIC CIRCUIT PACKAGE USING COMPOSITE MAGNETIC SEALING MATERIAL

EMBEDDED VIALESS BRIDGES

Multi-Die Fine Grain Integrated Voltage Regulation