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H01L2224/02381
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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/02381
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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor package
Patent number
12,368,119
Issue date
Jul 22, 2025
Samsung Electronics Co., Ltd.
Minki Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method
Patent number
12,368,120
Issue date
Jul 22, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Chen-Shien Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure and method of forming the same
Patent number
12,362,274
Issue date
Jul 15, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Chih-Hsuan Tai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Apparatus, semiconductor device, and redistribution layer structure...
Patent number
12,347,797
Issue date
Jul 1, 2025
Micron Technology, Inc.
Shigeru Sugioka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of manufacturing thereof
Patent number
12,341,107
Issue date
Jun 24, 2025
Amkor Technology Singapore Holding Pte Ltd.
Yi Seul Han
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure and method of forming the same
Patent number
12,334,434
Issue date
Jun 17, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Chih-Hsuan Tai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Lthc as charging barrier in info package formation
Patent number
12,334,489
Issue date
Jun 17, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Yi-Jen Lai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and manufacturing method thereof
Patent number
12,322,640
Issue date
Jun 3, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Sheng-Chieh Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with redistribution plugs
Patent number
12,315,793
Issue date
May 27, 2025
NANYA TECHNOLOGY CORPORATION
Chun-Cheng Liao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package with improved interposer structure
Patent number
12,308,313
Issue date
May 20, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Yi-Wen Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device package including stress buffering layer
Patent number
12,300,677
Issue date
May 13, 2025
Advanced Semiconductor Engineering, Inc.
Chien-Mei Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and manufacturing method thereof
Patent number
12,288,764
Issue date
Apr 29, 2025
Amkor Technology Singapore Holding Pte Ltd.
Gyu Wan Han
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device including re-distribution pads disposed at dif...
Patent number
12,288,761
Issue date
Apr 29, 2025
SK Hynix Inc.
Jun Yong Song
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure and method of manufacturing the same
Patent number
12,283,545
Issue date
Apr 22, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Yung-Chi Chu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit structure
Patent number
12,283,557
Issue date
Apr 22, 2025
United Microelectronics Corp.
Aaron Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor devices including recognition marks
Patent number
12,278,193
Issue date
Apr 15, 2025
SK hynix Inc.
Hyun Chul Seo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated transformer module
Patent number
12,272,638
Issue date
Apr 8, 2025
Murata Manufacturing Co., Ltd.
Takayuki Tange
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package with thermal relaxation block and manufacturi...
Patent number
12,255,196
Issue date
Mar 18, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Shih-Wei Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated structure with bifunctional routing and assembly compris...
Patent number
12,249,572
Issue date
Mar 11, 2025
Commissariat a l'Energie Atomique et Aux Energies Alternatives
Candice Thomas
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic package and implantable medical device including same
Patent number
12,237,281
Issue date
Feb 25, 2025
Medtronic, Inc.
Mark E. Henschel
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Dummy structure of stacked and bonded semiconductor device
Patent number
12,237,291
Issue date
Feb 25, 2025
Taiwan Semiconductor Manufacturing Company
Li-Hui Cheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Face-to-face through-silicon via multi-chip semiconductor apparatus...
Patent number
12,237,245
Issue date
Feb 25, 2025
Altera Corporation
Loke Yip Foo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package with improved interposer structure
Patent number
12,237,262
Issue date
Feb 25, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Yi-Wen Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer level package with polymer layer delamination prevention desi...
Patent number
12,230,593
Issue date
Feb 18, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Kai-Heng Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Cross-wafer RDLs in constructed wafers
Patent number
12,230,513
Issue date
Feb 18, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Three-dimensional stacking semiconductor assemblies and methods of...
Patent number
12,218,101
Issue date
Feb 4, 2025
Micron Technology, Inc.
Owen R. Fay
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Display device
Patent number
12,205,937
Issue date
Jan 21, 2025
LG Electronics Inc.
Taehoon Kim
G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information
Patent Grant
Multi-die package structures including redistribution layers
Patent number
12,199,065
Issue date
Jan 14, 2025
Parabellum Strategic Opportunities Fund LLC
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Display substrate and preparation method thereof, and display appar...
Patent number
12,199,081
Issue date
Jan 14, 2025
BOE Technology Group Co., Ltd.
Wenqu Liu
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Manufacturing method of circuit carrier with chip mounted thereon
Patent number
12,198,993
Issue date
Jan 14, 2025
Dyi-Chung Hu
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
Publication number
20250226317
Publication date
Jul 10, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Yung-Chi Chu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICES INCLUDING RECOGNITION MARKS
Publication number
20250210539
Publication date
Jun 26, 2025
SK HYNIX INC.
Hyun Chul SEO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING PAD STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20250210555
Publication date
Jun 26, 2025
NANYA TECHNOLOGY CORPORATION
Wu-Der Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE WITH THERMAL RELAXATION BLOCK AND MANUFACTURI...
Publication number
20250183245
Publication date
Jun 5, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Shih-Wei Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20250183194
Publication date
Jun 5, 2025
Samsung Electronics Co., Ltd.
Jingyu BAE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC PACKAGE AND IMPLANTABLE MEDICAL DEVICE INCLUDING SAME
Publication number
20250183203
Publication date
Jun 5, 2025
Medtronic, Inc.
Mark E. Henschel
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CROSS-WAFER RDLS IN CONSTRUCTED WAFERS
Publication number
20250183058
Publication date
Jun 5, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THREE-DIMENSIONAL STACKING SEMICONDUCTOR ASSEMBLIES AND METHODS OF...
Publication number
20250174604
Publication date
May 29, 2025
Micron Technology, Inc.
Owen R. Fay
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER LEVEL PACKAGE WITH POLYMER LAYER DELAMINATION PREVENTION DESI...
Publication number
20250157955
Publication date
May 15, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Kai-Heng CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAGE INTERMEDIATE, REDISTRI...
Publication number
20250149527
Publication date
May 8, 2025
DAI NIPPON PRINTING CO., LTD.
Satoru KURAMOCHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE
Publication number
20250132278
Publication date
Apr 24, 2025
Advanced Semiconductor Engineering, Inc.
Chih-Jing HSU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
Publication number
20250112180
Publication date
Apr 3, 2025
AOI ELECTRONICS CO., LTD.
Shinji WAKISAKA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LEADING POINT OF DISCHARGE STRUCTURES FOR ELECTROSTATIC DISCHARGE P...
Publication number
20250079354
Publication date
Mar 6, 2025
Taiwan Semiconductor Manufacturing Company Limited
Steven Sze Hang Poon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of Fabricating Redistribution Circuit Structure
Publication number
20250069951
Publication date
Feb 27, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Po-Han Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH REDISTRIBUTION PLUGS AND METHOD FOR FABRI...
Publication number
20250070017
Publication date
Feb 27, 2025
NANYA TECHNOLOGY CORPORATION
Chun-Cheng LIAO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE FABRICATION METHOD
Publication number
20250070071
Publication date
Feb 27, 2025
LAPIS Technology Co., Ltd.
Daisuke TAKAGI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT DEVICE AND SYSTEM
Publication number
20250054857
Publication date
Feb 13, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Yu-Jung CHANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR CHIP STRUCTURE
Publication number
20250046740
Publication date
Feb 6, 2025
Samsung Electronics Co., Ltd.
Jubin SEO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUITS WITH CAPACITORS
Publication number
20250038104
Publication date
Jan 30, 2025
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Rajesh Katkar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH REDISTRIBUTION LAYER AND METHOD THEREFOR
Publication number
20250038138
Publication date
Jan 30, 2025
NXP B.V.
Ting Hsun Tu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MANAGING CONDUCTIVE CONNECTIONS FOR SEMICONDUCTIVE DEVICES
Publication number
20250038044
Publication date
Jan 30, 2025
Yangtze Memory Technologies Co., Ltd.
Yingcheng Zhao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of Manufacturing a Package Having an Electronic Component an...
Publication number
20250029884
Publication date
Jan 23, 2025
INFINEON TECHNOLOGIES AG
Daniel Porwol
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LIGHT EMITTING DIODE MODULE AND DISPLAY DEVICE HAVING THE SAME
Publication number
20250029969
Publication date
Jan 23, 2025
Samsung Electronics Co., Ltd.
Youngki JUNG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FACE-TO-FACE THROUGH-SILICON VIA MULTI-CHIP SEMICONDUCTOR APPARATUS...
Publication number
20250022774
Publication date
Jan 16, 2025
Altera Corporation
Loke Yip FOO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FABRICATION METHOD FOR SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR ST...
Publication number
20250015022
Publication date
Jan 9, 2025
SiPLP Microelectronics (Chongqing) Limited
Yan HUO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH SOLDER ON PILLAR
Publication number
20250015032
Publication date
Jan 9, 2025
TEXAS INSTRUMENTS INCORPORATED
Rafael Jose Guevara
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MIM Capacitor in IC Heterogenous Integration
Publication number
20240421063
Publication date
Dec 19, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Tsung-Chieh Hsiao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Publication number
20240421095
Publication date
Dec 19, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chih-Hung Cheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE HAVING A WIRE BONDING PAD STRUCTURE CONNECTED...
Publication number
20240413107
Publication date
Dec 12, 2024
Fuji Electric Co., Ltd.
Morio IWAMIZU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Multi-Die Package Structures Including Redistribution Layers
Publication number
20240404992
Publication date
Dec 5, 2024
Parabellum Strategic Opportunities Fund LLC
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS