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H01L2224/02381

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method of fabricating redistribution circuit structure
- Patent number 12,170,223
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device and method
- Patent number 12,165,969
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Jung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packages and methods of manufacturing the same
- Patent number 12,166,009
- Issue date Dec 10, 2024
- Advanced Semiconductor Engineering, Inc.
- Tang-Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing integrated circuit device with bonding stru...
- Patent number 12,159,831
- Issue date Dec 3, 2024
- NANYA TECHNOLOGY CORPORATION
- Tzu-Ching Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,154,874
- Issue date Nov 26, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Naoto Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of fabrcating the same
- Patent number 12,148,732
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode module and display device having the same
- Patent number 12,136,616
- Issue date Nov 5, 2024
- Samsung Electronics Co., Ltd.
- Youngki Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic apparatus including antennas and directors
- Patent number 12,136,593
- Issue date Nov 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tzu-Chun Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Face-to-face through-silicon via multi-chip semiconductor apparatus...
- Patent number 12,125,768
- Issue date Oct 22, 2024
- Altera Corporation
- Loke Yip Foo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passivation layer for integrated circuit structure and forming the...
- Patent number 12,125,746
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Chiang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with reinforcement structures in a redistribution...
- Patent number 12,119,303
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package having an electronic component and an encapsulant encapsula...
- Patent number 12,112,992
- Issue date Oct 8, 2024
- Infineon Technologies AG
- Daniel Porwol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device with redistribution plugs
- Patent number 12,112,978
- Issue date Oct 8, 2024
- NANYA TECHNOLOGY CORPORATION
- Chun-Cheng Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with solder on pillar
- Patent number 12,107,062
- Issue date Oct 1, 2024
- Texas Instruments Incorporated
- Rafael Jose Guevara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming package structure
- Patent number 12,094,819
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for manufacturing the same
- Patent number 12,087,668
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and methods of manufacturing a semiconductor...
- Patent number 12,087,717
- Issue date Sep 10, 2024
- Infineon Technologies Austria AG
- Thomas Feil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor structure
- Patent number 12,080,629
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip packaging method and package structure
- Patent number 12,080,565
- Issue date Sep 3, 2024
- Pep Innovation PTE Ltd.
- Jimmy Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages having mechanical brace standoffs
- Patent number 12,080,623
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yuan Sheng Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die stacks and methods forming same
- Patent number 12,080,684
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a wire bonding pad structure connected...
- Patent number 12,068,268
- Issue date Aug 20, 2024
- Fuji Electric Co., Ltd.
- Morio Iwamizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 12,057,362
- Issue date Aug 6, 2024
- Rohm Co., Ltd.
- Osamu Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Face-to-face semiconductor device with fan-out porch
- Patent number 12,051,684
- Issue date Jul 30, 2024
- Micron Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact and die attach metallization for silicon carbide based devi...
- Patent number 12,051,669
- Issue date Jul 30, 2024
- Wolfspeed, Inc.
- Alexander Komposch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including through via structure
- Patent number 12,046,538
- Issue date Jul 23, 2024
- Samsung Electronics Co., Ltd.
- Sonkwan Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device and method of manufacturing the same
- Patent number 12,040,349
- Issue date Jul 16, 2024
- Samsung Electronics Co., Ltd.
- Kiwon Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layer metallic structure and method
- Patent number 12,040,293
- Issue date Jul 16, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih Wei Bih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of fabricating the same
- Patent number 12,021,026
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device with alternating fan-out lines
- Patent number 12,022,699
- Issue date Jun 25, 2024
- Samsung Display Co., Ltd.
- Tae Jong Eom
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MIM Capacitor in IC Heterogenous Integration
- Publication number 20240421063
- Publication date Dec 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Chieh Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240421095
- Publication date Dec 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hung Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A WIRE BONDING PAD STRUCTURE CONNECTED...
- Publication number 20240413107
- Publication date Dec 12, 2024
- Fuji Electric Co., Ltd.
- Morio IWAMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Die Package Structures Including Redistribution Layers
- Publication number 20240404992
- Publication date Dec 5, 2024
- Parabellum Strategic Opportunities Fund LLC
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING WIRED UNDER BUMP STRUCTURE AND METHOD T...
- Publication number 20240395674
- Publication date Nov 28, 2024
- NXP B.V.
- Kuan-Hsiang Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240387450
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FACE-TO-FACE SEMICONDUCTOR DEVICE WITH FAN-OUT PORCH
- Publication number 20240387499
- Publication date Nov 21, 2024
- Micron Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING ELECTRONIC APPARATUS
- Publication number 20240387367
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Chun Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package with Organic Integrated Circuit Substrate Embedded in Inorg...
- Publication number 20240387456
- Publication date Nov 21, 2024
- AT&S Austria Technologie & Systemtechnik AG
- Minwoo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE WITH THERMAL RELAXATI...
- Publication number 20240387498
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Manufacture
- Publication number 20240379538
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES HAVING MECHANICAL BRACE STANDOFFS
- Publication number 20240363486
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yuan Sheng Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240363496
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE STACKS AND METHODS FORMING SAME
- Publication number 20240363590
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240363533
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20240355728
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Chun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20240332268
- Publication date Oct 3, 2024
- Samsung Electronics Co., Ltd.
- Kyoung Lim SUK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE COMPRISING STACKED INDUCTORS WITH LOW OR NO MUTUA...
- Publication number 20240321730
- Publication date Sep 26, 2024
- QUALCOMM Incorporated
- Hsiao-Tsung YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING PACKAGE STRUCTURE
- Publication number 20240304542
- Publication date Sep 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DE...
- Publication number 20240304550
- Publication date Sep 12, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Tae Ki Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING SEMICONDUCTOR PACKAGES HAVING A DIE WITH AN ENCA...
- Publication number 20240297131
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REMOVING RESIST LAYER, METHOD OF FORMING A PATTERN AND M...
- Publication number 20240288776
- Publication date Aug 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Christine Y. Ouyang
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240290734
- Publication date Aug 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Hsuan TAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20240290737
- Publication date Aug 29, 2024
- MEDIATEK INC.
- Hung-Pin Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE DIES INCLUDING VERTICAL INTERCONNECTS FOR SIGNAL AND POWER...
- Publication number 20240282729
- Publication date Aug 22, 2024
- QUALCOMM Incorporated
- Mustafa Badaroglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240274559
- Publication date Aug 15, 2024
- Innolux Corporation
- Chia-Ping Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION LAYERS AND METHODS OF FABRICATING THE SAME IN SEMICO...
- Publication number 20240274558
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Hsiang-Ku Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTOELECTRONIC PACKAGE
- Publication number 20240264369
- Publication date Aug 8, 2024
- Advanced Semiconductor Engineering, Inc.
- Jr-Wei LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLYIMIDE LAYER DEPRESSIONS BETWEEN METAL PILLARS
- Publication number 20240258251
- Publication date Aug 1, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Katleen Fajardo TIMBOL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DIE PACKAGE STRUCTURES INCLUDING REDISTRIBUTION LAYERS
- Publication number 20240250067
- Publication date Jul 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of fabricating redistribution circuit structure

Integrated circuit device and method

Semiconductor device packages and methods of manufacturing the same

Method of manufacturing integrated circuit device with bonding stru...

Semiconductor device

Package structure and method of fabrcating the same

Light emitting diode module and display device having the same

Electronic apparatus including antennas and directors

Face-to-face through-silicon via multi-chip semiconductor apparatus...

Passivation layer for integrated circuit structure and forming the...

Package structure with reinforcement structures in a redistribution...

Package having an electronic component and an encapsulant encapsula...

Method for fabricating semiconductor device with redistribution plugs

Semiconductor device with solder on pillar

Method for forming package structure

Semiconductor package and method for manufacturing the same

Semiconductor package and methods of manufacturing a semiconductor...

Manufacturing method of semiconductor structure

Chip packaging method and package structure

Integrated circuit packages having mechanical brace standoffs

Die stacks and methods forming same

Semiconductor device having a wire bonding pad structure connected...

Semiconductor device and method for manufacturing semiconductor device

Face-to-face semiconductor device with fan-out porch

Contact and die attach metallization for silicon carbide based devi...

Semiconductor device including through via structure

Light emitting device and method of manufacturing the same

Redistribution layer metallic structure and method

Package structure and method of fabricating the same

Display device with alternating fan-out lines

Patents Applicationslast 30 patents

MIM Capacitor in IC Heterogenous Integration

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE HAVING A WIRE BONDING PAD STRUCTURE CONNECTED...

Multi-Die Package Structures Including Redistribution Layers

SEMICONDUCTOR DEVICE HAVING WIRED UNDER BUMP STRUCTURE AND METHOD T...

REDISTRIBUTION STRUCTURE AND METHOD OF FORMING THE SAME

FACE-TO-FACE SEMICONDUCTOR DEVICE WITH FAN-OUT PORCH

METHOD OF MANUFACTURING ELECTRONIC APPARATUS

Package with Organic Integrated Circuit Substrate Embedded in Inorg...

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE WITH THERMAL RELAXATI...

Semiconductor Device and Method of Manufacture

INTEGRATED CIRCUIT PACKAGES HAVING MECHANICAL BRACE STANDOFFS

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

DIE STACKS AND METHODS FORMING SAME

PACKAGE STRUCTURE

SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

INTEGRATED DEVICE COMPRISING STACKED INDUCTORS WITH LOW OR NO MUTUA...

METHOD OF FABRICATING PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DE...

METHODS OF FORMING SEMICONDUCTOR PACKAGES HAVING A DIE WITH AN ENCA...

METHOD FOR REMOVING RESIST LAYER, METHOD OF FORMING A PATTERN AND M...

PACKAGE STRUCTURE

BUMP STRUCTURE AND FABRICATION METHOD THEREOF

PACKAGE DIES INCLUDING VERTICAL INTERCONNECTS FOR SIGNAL AND POWER...

ELECTRONIC DEVICE

REDISTRIBUTION LAYERS AND METHODS OF FABRICATING THE SAME IN SEMICO...

OPTOELECTRONIC PACKAGE

POLYIMIDE LAYER DEPRESSIONS BETWEEN METAL PILLARS

MULTI-DIE PACKAGE STRUCTURES INCLUDING REDISTRIBUTION LAYERS