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H01L2224/02381
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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/02381
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Patents Grants
last 30 patents
Information
Patent Grant
Stacked via structure
Patent number
11,973,023
Issue date
Apr 30, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Po-Han Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Redistribution substrate, method of fabricating the same, and semic...
Patent number
11,973,028
Issue date
Apr 30, 2024
Samsung Electronics Co., Ltd.
Jongyoun Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Redistribution layers and methods of fabricating the same in semico...
Patent number
11,967,573
Issue date
Apr 23, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Hsiang-Ku Shen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and manufacturing method thereof
Patent number
11,961,789
Issue date
Apr 16, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Anisotropic carrier for high aspect ratio fanout
Patent number
11,955,349
Issue date
Apr 9, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package including high thermal conductivity layer
Patent number
11,948,851
Issue date
Apr 2, 2024
Samsung Electronics Co., Ltd.
Sunjae Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Die and package structure
Patent number
11,948,904
Issue date
Apr 2, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Wei-Chih Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with thermal release layer and method for fabr...
Patent number
11,948,857
Issue date
Apr 2, 2024
NANYA TECHNOLOGY CORPORATION
Jar-Ming Ho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package
Patent number
11,948,903
Issue date
Apr 2, 2024
Samsung Electronics Co., Ltd.
Sang-Sick Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure and method of forming the same
Patent number
11,929,318
Issue date
Mar 12, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chih-Hsuan Tai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Silicon photonic interposer with two metal redistribution layers
Patent number
11,923,327
Issue date
Mar 5, 2024
Rockley Photonics Limited
Michael Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked integrated circuits with redistribution lines
Patent number
11,923,338
Issue date
Mar 5, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Cheng-Ying Ho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming RF devices with enhanced performance including at...
Patent number
11,923,238
Issue date
Mar 5, 2024
Qorvo US, Inc.
Julio C. Costa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
LTHC as charging barrier in info package formation
Patent number
11,923,353
Issue date
Mar 5, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Yi-Jen Lai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Cross-wafer RDLs in constructed wafers
Patent number
11,908,706
Issue date
Feb 20, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit structure and fabrication method thereof
Patent number
11,901,318
Issue date
Feb 13, 2024
United Microelectronics Corp.
Aaron Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated fan-out package and manufacturing method thereof
Patent number
11,894,336
Issue date
Feb 6, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Jhih-Yu Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method for manufacturing the same
Patent number
11,887,840
Issue date
Jan 30, 2024
Samsung Electronics Co., Ltd.
Min Sung Kang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing semiconductor device including cutting a mo...
Patent number
11,887,907
Issue date
Jan 30, 2024
Samsung Electronics Co., Ltd.
Wonyoung Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Solid-state imaging device and electronic apparatus
Patent number
11,887,950
Issue date
Jan 30, 2024
SONY SEMICONDUCTOR SOLUTIONS CORPORATION
Takuya Nakamura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package
Patent number
11,881,472
Issue date
Jan 23, 2024
Samsung Electronics Co., Ltd.
Yongjin Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package panel processing with integrated ceramic isolation
Patent number
11,869,839
Issue date
Jan 9, 2024
Texas Instruments Incorporated
Woochan Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package structure and method of manufacturing the same
Patent number
11,862,587
Issue date
Jan 2, 2024
Advanced Semiconductor Engineering, Inc.
Mark Gerber
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure and method of manufacturing the same
Patent number
11,862,560
Issue date
Jan 2, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Yung-Chi Chu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method
Patent number
11,862,588
Issue date
Jan 2, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Chen-Shien Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Sidewall spacer to reduce bond pad necking and/or redistribution la...
Patent number
11,862,592
Issue date
Jan 2, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Alexander Kalnitsky
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device including sub-cell disposed at chip center
Patent number
11,855,166
Issue date
Dec 26, 2023
Hitachi Astemo, Ltd.
Shinichirou Wada
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip scale package structure and method of forming the same
Patent number
11,854,784
Issue date
Dec 26, 2023
Mediatek Inc.
Yen-Yao Chi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Redistribution layer structures for integrated circuit package
Patent number
11,848,271
Issue date
Dec 19, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Jie Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Antenna-in-package with frequency-selective surface structure
Patent number
11,848,481
Issue date
Dec 19, 2023
Mediatek Inc.
Shih-Chia Chiu
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Cross-Wafer RDLs in Constructed Wafers
Publication number
20240145257
Publication date
May 2, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP STRUCTURE
Publication number
20240120277
Publication date
Apr 11, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Hong-Seng SHUE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20240113061
Publication date
Apr 4, 2024
Advanced Semiconductor Engineering, Inc.
Mei-Ju LU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
APPARATUS, SEMICONDUCTOR DEVICE, AND REDISTRIBUTION LAYER STRUCTURE...
Publication number
20240105648
Publication date
Mar 28, 2024
Micron Technology, Inc.
Shigeru Sugioka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20240096760
Publication date
Mar 21, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD
Publication number
20240096827
Publication date
Mar 21, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Chen-Shien Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR ASSEMBLIES WITH HYBRID FANOUTS AND ASSOCIATED METHODS...
Publication number
20240088100
Publication date
Mar 14, 2024
Lodestar Licensing Group LLC
Bharat Bhushan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE WITH BONDING STRU...
Publication number
20240088020
Publication date
Mar 14, 2024
NANYA TECHNOLOGY CORPORATION
TZU-CHING TSAI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Redistribution Layer Structures for Integrated Circuit Package
Publication number
20240079324
Publication date
Mar 7, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Jie CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICES, ASSEMBLIES, AND ASSOCIATED METHODS
Publication number
20240072002
Publication date
Feb 29, 2024
Micron Technology, Inc.
Raj K. Bansal
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE WITH IMPROVED INTERPOSER STRUCTURE
Publication number
20240071909
Publication date
Feb 29, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Yi-Wen Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR DEVICE
Publication number
20240057352
Publication date
Feb 15, 2024
ChangXin Memory Technologies, Inc.
LING-YI CHUANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE
Publication number
20240047395
Publication date
Feb 8, 2024
NANYA TECHNOLOGY CORPORATION
Sheng-Fu HUANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
VIA FORMED IN A WAFER USING A FRONT-SIDE AND A BACK-SIDE PROCESS
Publication number
20240038695
Publication date
Feb 1, 2024
Celestial AI Inc.
Ankur AGGARWAL
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THROUGH-SUBSTRATE VIA FORMED USING A PARTIAL PLUG THAT STOPS BEFORE...
Publication number
20240038694
Publication date
Feb 1, 2024
Celestial AI Inc.
Ankur AGGARWAL
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKED SEMICONDUCTOR DEVICE INCLUDING HYBRID BONDING STRUCTURE
Publication number
20240030266
Publication date
Jan 25, 2024
SK HYNIX INC.
Pyong Su Kwag
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE UNIT, METHOD OF MANUFACTURING THE SAME, AND PACKAGE ST...
Publication number
20240021552
Publication date
Jan 18, 2024
Walton Advanced Engineering, Inc
HONG-CHI YU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING PAD STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20240021550
Publication date
Jan 18, 2024
NANYA TECHNOLOGY CORPORATION
Wu-Der Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THROUGH-SUBSTRATE-VIA IN PHOTOSENSITIVE MODULE
Publication number
20240021649
Publication date
Jan 18, 2024
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Ming-Yao CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING PAD STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20240021551
Publication date
Jan 18, 2024
NANYA TECHNOLOGY CORPORATION
Wu-Der Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH PAD STRUCTURE RESISTANT TO PLASMA DAMAGE...
Publication number
20240014154
Publication date
Jan 11, 2024
RICHTEK TECHNOLOGY CORPORATION
Wu-Te WENG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FACE-TO-FACE SEMICONDUCTOR DEVICE WITH FAN-OUT PORCH
Publication number
20230420440
Publication date
Dec 28, 2023
Micron Technology, Inc.
Jong Sik Paek
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURING THE SAME
Publication number
20230411349
Publication date
Dec 21, 2023
Advanced Semiconductor Engineering, Inc.
Tang-Yuan CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BILAYER RDL STRUCTURE FOR BUMP COUNT REDUCTION
Publication number
20230395486
Publication date
Dec 7, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Tsung-Chieh HSIAO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH REDISTRIBUTION PLUGS
Publication number
20230395489
Publication date
Dec 7, 2023
NANYA TECHNOLOGY CORPORATION
Chun-Cheng LIAO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE WITH HIGHER BEARING CAPACITY IN WIRE BONDING
Publication number
20230395538
Publication date
Dec 7, 2023
Walton Advanced Engineering, Inc
HONG-CHI YU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF, AND SEMICONDUCT...
Publication number
20230395543
Publication date
Dec 7, 2023
CHANGXIN MEMORY TECHNOLOGIES, INC
Kai TIAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
Publication number
20230395490
Publication date
Dec 7, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Chih-Hsuan Tai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE WITH BONDING STRU...
Publication number
20230386999
Publication date
Nov 30, 2023
NANYA TECHNOLOGY CORPORATION
TZU-CHING TSAI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
3D FAN-OUT PACKAGING STRUCTURE OF INTERCONNECTION SYSTEM WITH ULTRA...
Publication number
20230386950
Publication date
Nov 30, 2023
SJ Semiconductor(Jiangyin) Corporation
Yenheng Chen
H01 - BASIC ELECTRIC ELEMENTS