Silicides composed of metals from groups of the periodic table

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H01L2924/047

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/047Silicides composed of metals from groups of the periodic table

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of forming the same
- Patent number 11,569,185
- Issue date Jan 31, 2023
- Micron Technology, Inc.
- Mitsunari Sukekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded assembly employing metal-semiconductor bonding and metal-met...
- Patent number 11,562,975
- Issue date Jan 24, 2023
- SanDisk Technologies LLC
- Lin Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including a metal silicide layer and methods...
- Patent number 11,063,014
- Issue date Jul 13, 2021
- Infineon Technologies AG
- Michael Roesner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and semiconductor devices including a redistr...
- Patent number 10,777,523
- Issue date Sep 15, 2020
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including conductive pillars
- Patent number 10,276,529
- Issue date Apr 30, 2019
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Durable bond pad structure for electrical connection to extreme env...
- Patent number 10,256,202
- Issue date Apr 9, 2019
- The United States of America as Represented by the Administrator of National...
- David J. Spry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertically integrated wafers with thermal dissipation
- Patent number 9,812,428
- Issue date Nov 7, 2017
- EMPIRE TECHNOLOGY DEVELOPMENT LLC
- Zhijiong Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package systems including passive electrical components
- Patent number 9,660,532
- Issue date May 23, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Alan Roth
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Reduced expansion thermal compression bonding process bond head
- Patent number 9,548,284
- Issue date Jan 17, 2017
- Intel Corporation
- Pramod Malatkar
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor device and method for forming the same
- Patent number 9,397,044
- Issue date Jul 19, 2016
- SK Hynix Inc.
- Sang Min Won
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for forming the same
- Patent number 9,230,931
- Issue date Jan 5, 2016
- SK Hynix Inc.
- Sang Min Won
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BONDED ASSEMBLY EMPLOYING METAL-SEMICONDUCTOR BONDING AND METAL-MET...
- Publication number 20220352104
- Publication date Nov 3, 2022
- SANDISK TECHNOLOGIES LLC
- Lin HOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20220122930
- Publication date Apr 21, 2022
- Micron Technology, Inc.
- Mitsunari Sukekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices Including a Metal Silicide Layer and Methods...
- Publication number 20190355691
- Publication date Nov 21, 2019
- Michael Roesner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEVICES INCLUDING A REDISTR...
- Publication number 20190252338
- Publication date Aug 15, 2019
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING CONDUCTIVE PILLARS
- Publication number 20170358547
- Publication date Dec 14, 2017
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SYSTEMS INCLUDING PASSIVE ELECTRICAL COMPONENTS
- Publication number 20170063236
- Publication date Mar 2, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Alan ROTH
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
VERTICALLY INTEGRATED WAFERS WITH THERMAL DISSIPATION
- Publication number 20170040295
- Publication date Feb 9, 2017
- EMPIRE TECHNOLOGY DEVELOPMENT LLC
- Zhijiong Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Schottky Diode and Method of Manufacturing the Same
- Publication number 20160020272
- Publication date Jan 21, 2016
- DONGBU HITEK CO., LTD.
- Yong Seong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCED EXPANSION THERMAL COMPRESSION BONDING PROCESS BOND HEAD
- Publication number 20150171047
- Publication date Jun 18, 2015
- Intel Corporation
- Pramod Malatkar
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20150145013
- Publication date May 28, 2015
- SK HYNIX INC.
- Sang Min WON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES HAVING INHOMOGENEOUS SILICIDE SCHOTTKY BARRIER CONTACTS
- Publication number 20150061034
- Publication date Mar 5, 2015
- TEXAS INSTRUMENTS INCORPORATED
- DEBORAH JEAN RILEY
- H01 - BASIC ELECTRIC ELEMENTS

Silicides composed of metals from groups of the periodic table

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and method of forming the same

Bonded assembly employing metal-semiconductor bonding and metal-met...

Semiconductor devices including a metal silicide layer and methods...

Semiconductor devices and semiconductor devices including a redistr...

Semiconductor devices including conductive pillars

Durable bond pad structure for electrical connection to extreme env...

Vertically integrated wafers with thermal dissipation

Package systems including passive electrical components

Reduced expansion thermal compression bonding process bond head

Semiconductor device and method for forming the same

Semiconductor device and method for forming the same

Patents Applicationslast 30 patents

BONDED ASSEMBLY EMPLOYING METAL-SEMICONDUCTOR BONDING AND METAL-MET...

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

Semiconductor Devices Including a Metal Silicide Layer and Methods...

SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEVICES INCLUDING A REDISTR...

SEMICONDUCTOR DEVICES INCLUDING CONDUCTIVE PILLARS

PACKAGE SYSTEMS INCLUDING PASSIVE ELECTRICAL COMPONENTS

VERTICALLY INTEGRATED WAFERS WITH THERMAL DISSIPATION

Schottky Diode and Method of Manufacturing the Same

REDUCED EXPANSION THERMAL COMPRESSION BONDING PROCESS BOND HEAD

SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME

DEVICES HAVING INHOMOGENEOUS SILICIDE SCHOTTKY BARRIER CONTACTS