Silicon-germanium [SiGe]

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CPC
H01L2924/10271

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/10271Silicon-germanium [SiGe]

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor packages
- Patent number 12,159,839
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tzu-Sung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package and method of providing die-to-die interconnects...
- Patent number 12,113,026
- Issue date Oct 8, 2024
- Intel Corporation
- Henning Braunisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid device assemblies and method of fabrication
- Patent number 12,015,004
- Issue date Jun 18, 2024
- NXP USA, INC.
- Li Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,996,354
- Issue date May 28, 2024
- Rohm Co., Ltd.
- Koshun Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package and method of providing die-to-die interconnects...
- Patent number 11,876,053
- Issue date Jan 16, 2024
- Intel Corporation
- Henning Braunisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding process with inhibited oxide formation
- Patent number 11,869,870
- Issue date Jan 9, 2024
- SiTime Corporation
- Paul M. Hagelin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid device assemblies and method of fabrication
- Patent number 11,830,842
- Issue date Nov 28, 2023
- NXP USA., Inc.
- Li Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package and method of providing die-to-die interconnects...
- Patent number 11,824,008
- Issue date Nov 21, 2023
- Intel Corporation
- Henning Braunisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Front-to-back bonding with through-substrate via (TSV)
- Patent number 11,791,241
- Issue date Oct 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages and methods of forming packages
- Patent number 11,715,727
- Issue date Aug 1, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System on integrated chips and methods of forming same
- Patent number 11,658,150
- Issue date May 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sung-Feng Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming recesses in molding compound of wafer to reduce stress
- Patent number 11,658,153
- Issue date May 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,652,033
- Issue date May 16, 2023
- Rohm Co., Ltd.
- Koshun Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sawing underfill in packaging processes
- Patent number 11,637,086
- Issue date Apr 25, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sawing underfill in packaging processes
- Patent number 11,631,654
- Issue date Apr 18, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device, electronic module and methods for fabricating th...
- Patent number 11,615,963
- Issue date Mar 28, 2023
- Infineon Technologies AG
- Paul Frank
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structures and methods of forming the same
- Patent number 11,527,454
- Issue date Dec 13, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for scribe seal structures
- Patent number 11,515,209
- Issue date Nov 29, 2022
- Texas Instruments Incorporated
- Subhashish Mukherjee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct substrate to solder bump connection for thermal management i...
- Patent number 11,515,845
- Issue date Nov 29, 2022
- Skyworks Solutions, Inc.
- Michael Joseph McPartlin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method
- Patent number 11,502,039
- Issue date Nov 15, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tzu-Sung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding process with inhibited oxide formation
- Patent number 11,488,930
- Issue date Nov 1, 2022
- SiTime Corporation
- Paul M. Hagelin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spot-solderable leads for semiconductor device packages
- Patent number 11,430,719
- Issue date Aug 30, 2022
- Texas Instruments Incorporated
- Manu A. Prakuzhy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional integrated circuit (3DIC) with support structures
- Patent number 11,424,194
- Issue date Aug 23, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structures and methods of forming the same
- Patent number 11,417,580
- Issue date Aug 16, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages and methods of forming same
- Patent number 11,387,118
- Issue date Jul 12, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with tilted interface between device die and encapsulating...
- Patent number 11,322,419
- Issue date May 3, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Yen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-substrate vias with improved connections
- Patent number 11,296,011
- Issue date Apr 5, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip
- Patent number 11,145,607
- Issue date Oct 12, 2021
- Murata Manufacturing Co., Ltd.
- Yusuke Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Superconducting bump bonds
- Patent number 11,133,450
- Issue date Sep 28, 2021
- Google LLC
- Joshua Yousouf Mutus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Superconducting bump bonds
- Patent number 11,133,451
- Issue date Sep 28, 2021
- Google LLC
- Joshua Yousouf Mutus
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS...
- Publication number 20240429173
- Publication date Dec 26, 2024
- Intel Corporation
- Henning BRAUNISCH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20240395721
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Sung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240274513
- Publication date Aug 15, 2024
- ROHM CO., LTD.
- Koshun SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240213106
- Publication date Jun 27, 2024
- DYNEX SEMICONDUCTOR LIMITED
- Robin Adam Simpson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID DEVICE ASSEMBLIES AND METHOD OF FABRICATION
- Publication number 20230369272
- Publication date Nov 16, 2023
- NXP USA, Inc.
- Li Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT AND RADIO-FREQUENCY MODULE
- Publication number 20230307458
- Publication date Sep 28, 2023
- MURATA MANUFACTURING CO., LTD.
- Motoji TSUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Forming Recesses in Molding Compound of Wafer to Reduce Stress
- Publication number 20230253370
- Publication date Aug 10, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230245962
- Publication date Aug 3, 2023
- ROHM CO., LTD.
- Koshun SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages
- Publication number 20230075602
- Publication date Mar 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Sung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID DEVICE ASSEMBLIES AND METHOD OF FABRICATION
- Publication number 20220130785
- Publication date Apr 28, 2022
- NXP USA, Inc.
- Li Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System on Integrated Chips and Methods of Forming Same
- Publication number 20210343680
- Publication date Nov 4, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sung-Feng Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210343629
- Publication date Nov 4, 2021
- ROHM CO., LTD.
- Koshun SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device and Method for UBM/RDL Routing
- Publication number 20210143131
- Publication date May 13, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Meng-Tsan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sawing Underfill in Packaging Processes
- Publication number 20210125964
- Publication date Apr 29, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Szu-Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sawing Underfill in Packaging Processes
- Publication number 20210057383
- Publication date Feb 25, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Szu-Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FRONT-TO-BACK BONDING WITH THROUGH-SUBSTRATE VIA (TSV)
- Publication number 20210043547
- Publication date Feb 11, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method
- Publication number 20210005554
- Publication date Jan 7, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Sung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20200365497
- Publication date Nov 19, 2020
- ROHM CO., LTD.
- Koshun SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE, ELECTRONIC MODULE AND METHODS FOR FABRICATING TH...
- Publication number 20200343094
- Publication date Oct 29, 2020
- INFINEON TECHNOLOGIES AG
- Paul Frank
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING METAL BUMP AND METHOD OF MANUFACTURING...
- Publication number 20200343204
- Publication date Oct 29, 2020
- Samsung Electronics Co., Ltd.
- JINCHAN AHN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP
- Publication number 20200321289
- Publication date Oct 8, 2020
- Murata Manufacturing Co., Ltd.
- Yusuke TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Forming Recesses in Molding Compound of Wafer to Reduce Stress
- Publication number 20200286863
- Publication date Sep 10, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR SCRIBE SEAL STRUCTURES
- Publication number 20200161184
- Publication date May 21, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Subhashish Mukherjee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packages and Methods of Forming Packages
- Publication number 20200118987
- Publication date Apr 16, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS...
- Publication number 20200075493
- Publication date Mar 5, 2020
- Intel Corporation
- Henning BRAUNISCH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device and Method for UBM/RDL Routing
- Publication number 20190393195
- Publication date Dec 26, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tsan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE ASSEMBLY
- Publication number 20190341343
- Publication date Nov 7, 2019
- Qorvo US, Inc.
- Deep C. Dumka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Spot-Solderable Leads for Semiconductor Device Packages
- Publication number 20190318983
- Publication date Oct 17, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Manu A. Prakuzhy
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Semiconductor Systems Having Premolded Dual Leadframes
- Publication number 20190237395
- Publication date Aug 1, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Rajeev D. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LARGE CHANNEL INTERCONNECTS WITH THROUGH SILICON VIAS (TSVS) AND ME...
- Publication number 20190139938
- Publication date May 9, 2019
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS

Silicon-germanium [SiGe]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor packages

Multi-chip package and method of providing die-to-die interconnects...

Hybrid device assemblies and method of fabrication

Semiconductor device

Multi-chip package and method of providing die-to-die interconnects...

Bonding process with inhibited oxide formation

Hybrid device assemblies and method of fabrication

Multi-chip package and method of providing die-to-die interconnects...

Front-to-back bonding with through-substrate via (TSV)

Packages and methods of forming packages

System on integrated chips and methods of forming same

Forming recesses in molding compound of wafer to reduce stress

Semiconductor device

Sawing underfill in packaging processes

Sawing underfill in packaging processes

Electronic device, electronic module and methods for fabricating th...

Package structures and methods of forming the same

Methods and apparatus for scribe seal structures

Direct substrate to solder bump connection for thermal management i...

Semiconductor package and method

Bonding process with inhibited oxide formation

Spot-solderable leads for semiconductor device packages

Three dimensional integrated circuit (3DIC) with support structures

Package structures and methods of forming the same

Integrated circuit packages and methods of forming same

Package with tilted interface between device die and encapsulating...

Through-substrate vias with improved connections

Semiconductor chip

Superconducting bump bonds

Superconducting bump bonds

Patents Applicationslast 30 patents

MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS...

SEMICONDUCTOR PACKAGES

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

HYBRID DEVICE ASSEMBLIES AND METHOD OF FABRICATION

INTEGRATED CIRCUIT AND RADIO-FREQUENCY MODULE

Forming Recesses in Molding Compound of Wafer to Reduce Stress

SEMICONDUCTOR DEVICE

Semiconductor Packages

HYBRID DEVICE ASSEMBLIES AND METHOD OF FABRICATION

System on Integrated Chips and Methods of Forming Same

SEMICONDUCTOR DEVICE

Device and Method for UBM/RDL Routing

Sawing Underfill in Packaging Processes

Sawing Underfill in Packaging Processes

FRONT-TO-BACK BONDING WITH THROUGH-SUBSTRATE VIA (TSV)

Semiconductor Package and Method

SEMICONDUCTOR DEVICE

ELECTRONIC DEVICE, ELECTRONIC MODULE AND METHODS FOR FABRICATING TH...

SEMICONDUCTOR DEVICE HAVING METAL BUMP AND METHOD OF MANUFACTURING...

SEMICONDUCTOR CHIP

Forming Recesses in Molding Compound of Wafer to Reduce Stress

METHODS AND APPARATUS FOR SCRIBE SEAL STRUCTURES

Packages and Methods of Forming Packages

MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS...

Device and Method for UBM/RDL Routing

MODULE ASSEMBLY

Spot-Solderable Leads for Semiconductor Device Packages

Semiconductor Systems Having Premolded Dual Leadframes

LARGE CHANNEL INTERCONNECTS WITH THROUGH SILICON VIAS (TSVS) AND ME...