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H01L2224/05139
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Electric elements
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/05139
Silver [Ag] as principal constituent
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Patents Grants
last 30 patents
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Patent Grant
Semiconductor structure and manufacturing method thereof
Patent number
12,362,272
Issue date
Jul 15, 2025
Taiwan Semiconductor Manufacturing Company Ltd.
Tung-Jiun Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor components having conductive vias with aligned back s...
Patent number
12,347,731
Issue date
Jul 1, 2025
Micron Technology, Inc.
Jin Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Display device for improving internal quantum efficiency
Patent number
12,334,485
Issue date
Jun 17, 2025
Samsung Display Co., Ltd.
Jin Woo Choi
G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information
Patent Grant
Package with tilted interface between device die and encapsulating...
Patent number
12,334,406
Issue date
Jun 17, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Ming-Yen Chiu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Forming recesses in molding compound of wafer to reduce stress
Patent number
12,334,474
Issue date
Jun 17, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Chun-Hung Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming a bonded semiconductor structure
Patent number
12,300,660
Issue date
May 13, 2025
Taiwan Semiconductor Manufacturing Company Ltd.
Jen-Yuan Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor packages and methods of forming same
Patent number
12,293,991
Issue date
May 6, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Display device
Patent number
12,295,225
Issue date
May 6, 2025
Samsung Display Co., Ltd.
Chungi You
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and manufacturing method thereof
Patent number
12,288,764
Issue date
Apr 29, 2025
Amkor Technology Singapore Holding Pte Ltd.
Gyu Wan Han
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Conductive bump of a semiconductor device and fabricating method th...
Patent number
12,278,199
Issue date
Apr 15, 2025
Taiwan Semiconductor Manufacturing Company Ltd.
Chang-Pin Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method for manufacturing the same
Patent number
12,266,627
Issue date
Apr 1, 2025
Mitsubishi Electric Corporation
Shinji Sakai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Display panel and display device
Patent number
12,262,605
Issue date
Mar 25, 2025
Wuhan China Star Optoelectronics Technology Co., Ltd.
Shuya Dong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic device with multi-layer contact and system
Patent number
12,255,168
Issue date
Mar 18, 2025
Infineon Technologies AG
Alexander Heinrich
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Display device and method of manufacturing the same
Patent number
12,243,844
Issue date
Mar 4, 2025
Samsung Display Co., Ltd.
Byoungyong Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming micro interconnect struc...
Patent number
12,230,559
Issue date
Feb 18, 2025
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Francis J. Carney
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic device and method of manufacturing electronic device
Patent number
12,211,811
Issue date
Jan 28, 2025
Industrial Technology Research Institute
Yu-Ming Peng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Modeling method and apparatus, computer device and storage medium
Patent number
12,204,841
Issue date
Jan 21, 2025
CHANGXIN MEMORY TECHNOLOGIES, INC.
Kun Weng
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Light emitting diode and display apparatus having the same
Patent number
12,159,861
Issue date
Dec 3, 2024
SEOUL VIOSYS CO., LTD.
Seong Kyu Jang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Display device
Patent number
12,159,882
Issue date
Dec 3, 2024
KYOCERA Coporation
Hiroaki Ito
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Through-substrate via structure and method of manufacture
Patent number
12,119,294
Issue date
Oct 15, 2024
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Michael J. Seddon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with encapsulant deposited along sides and sur...
Patent number
12,094,729
Issue date
Sep 17, 2024
STATS ChipPAC Pte. Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor chip with redundant thru-silicon-vias
Patent number
12,094,853
Issue date
Sep 17, 2024
Advanced Micro Devices, Inc.
Bryan Black
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Display device and method of manufacturing the same
Patent number
12,080,662
Issue date
Sep 3, 2024
Samsung Display Co., Ltd.
Eui Jeong Kang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method to minimize stress on stack via
Patent number
12,080,600
Issue date
Sep 3, 2024
STATS ChipPAC Pte. Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having a junction portion contacting a Schottk...
Patent number
12,057,479
Issue date
Aug 6, 2024
Rohm Co., Ltd.
Yasuhiro Kawakami
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip package, method of forming a chip package and method of formin...
Patent number
12,033,972
Issue date
Jul 9, 2024
Infineon Technologies AG
Joachim Mahler
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor product with interlocking metal-to-metal bonds and me...
Patent number
12,015,000
Issue date
Jun 18, 2024
Amkor Technology Singapore Holding Pte Ltd.
Bora Baloglu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multiple plated via arrays of different wire heights on a same subs...
Patent number
RE49987
Issue date
May 28, 2024
Invensas LLC
Cyprian Emeka Uzoh
Information
Patent Grant
Fingerprint sensor and manufacturing method thereof
Patent number
11,990,435
Issue date
May 21, 2024
Amkor Technology Singapore Holding Pte Ltd.
Sung Sun Park
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Bonded body, circuit board, and semiconductor device
Patent number
11,948,900
Issue date
Apr 2, 2024
Kabushiki Kaisha Toshiba
Maki Yonetsu
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
LAMINATION STRUCTURE MANUFACTURED BY LASER PATTERNING
Publication number
20250239500
Publication date
Jul 24, 2025
PANJIT INTERNATIONAL INC.
Chung Hsiung HO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRICAL CONTACTS AND SYSTEMS AND TECHNIQUES FOR FORMING ELECTRIC...
Publication number
20250239545
Publication date
Jul 24, 2025
Honeywell International Inc.
Bryan Roger Seppala
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
Semiconductor Packages and Methods of Forming Same
Publication number
20250233115
Publication date
Jul 17, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DISPLAY PANEL AND DISPLAY DEVICE
Publication number
20250204185
Publication date
Jun 19, 2025
Wuhan China Star Optoelectronics Technology Co., Ltd.
Shuya DONG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SINTER READY MULTILAYER WIRE/RIBBON BOND PADS AND METHOD FOR DIE TO...
Publication number
20250201741
Publication date
Jun 19, 2025
Alpha Assembly Solutions Inc.
Matthew SIEBENHUHNER
B22 - CASTING POWDER METALLURGY
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...
Publication number
20250149424
Publication date
May 8, 2025
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Francis J. CARNEY
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...
Publication number
20250149425
Publication date
May 8, 2025
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Francis J. CARNEY
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIELECTRIC STRUCTURE FOR HIGH SPEED INTERCONNECT AND RELIABILITY EN...
Publication number
20250118690
Publication date
Apr 10, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Wen-Yi Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE WITH AN INSULATION LAYER
Publication number
20250112182
Publication date
Apr 3, 2025
TEXAS INSTRUMENTS INCORPORATED
Masamitsu Matsuura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LIGHT EMITTING DIODE AND DISPLAY APPARATUS HAVING THE SAME
Publication number
20250062295
Publication date
Feb 20, 2025
Seoul Viosys Co., Ltd.
Seong Kyu JANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES
Publication number
20250046659
Publication date
Feb 6, 2025
Samsung Electronics Co., Ltd.
Se Ra Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS AND STRUCTURES FOR LOW TEMPERATURE HYBRID BONDING
Publication number
20250006674
Publication date
Jan 2, 2025
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
Publication number
20240404969
Publication date
Dec 5, 2024
SAMSUNG DISPLAY CO., LTD.
EUI JEONG KANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Three-Dimensional Integrated Circuit with Hybrid Bond Metal Structure
Publication number
20240395750
Publication date
Nov 28, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Jui Shen CHANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
Publication number
20240395743
Publication date
Nov 28, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Ching-Hung Kao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE HAVING A JUNCTION PORTION CONTACTING A SCHOTTK...
Publication number
20240355886
Publication date
Oct 24, 2024
ROHM CO., LTD.
Yasuhiro Kawakami
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF
Publication number
20240304577
Publication date
Sep 12, 2024
Amkor Technology Singapore Holding Pte. Ltd.
Sung Sun Park
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
THROUGH-SUBSTRATE VIA STRUCTURE AND METHOD OF MANUFACTURE
Publication number
20240297106
Publication date
Sep 5, 2024
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Michael J. Seddon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND POWER CONVERTING DEVICE
Publication number
20240274557
Publication date
Aug 15, 2024
Mitsubishi Electric Corporation
Yo TANAKA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BUMP STRUCTURE AND METHOD OF MANUFACTURING BUMP STRUCTURE
Publication number
20240258252
Publication date
Aug 1, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Ching-Yu CHANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DISPLAY PANEL AND DISPLAY DEVICE
Publication number
20240251610
Publication date
Jul 25, 2024
Wuhan China Star Optoelectronics Technology Co., Ltd.
Shuya DONG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME
Publication number
20240243086
Publication date
Jul 18, 2024
Advanced Semiconductor Engineering, Inc.
Sheng-Hsiang HSU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20240234354
Publication date
Jul 11, 2024
nD-HI Technologies Lab, Inc.
Ho-Ming TONG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METALLIZED SEMICONDUCTOR DIE AND MANUFACTURING METHOD
Publication number
20240194623
Publication date
Jun 13, 2024
TDK Electronics AG
Mehrdad Shayganpoor
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE WITH ELECTROMAGNETIC INTERFERENCE SHIELDING LAYER AND...
Publication number
20240145404
Publication date
May 2, 2024
Walton Advanced Engineering, Inc
HONG-CHI YU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20240088075
Publication date
Mar 14, 2024
Samsung Electronics Co., Ltd.
Sunkyoung SEO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE WITH MULTI-LAYER CONTACT AND SYSTEM
Publication number
20240088087
Publication date
Mar 14, 2024
INFINEON TECHNOLOGIES AG
Alexander HEINRICH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNEC...
Publication number
20240071973
Publication date
Feb 29, 2024
Micron Technology, Inc.
Wei Zhou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POP STRUCTURE OF THREE-DIMENSIONAL FAN-OUT MEMORY AND PACKAGING MET...
Publication number
20230352450
Publication date
Nov 2, 2023
SJ Semiconductor(Jiangyin) Corporation
Yenheng Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FAN-OUT STACKED SEMICONDUCTOR PACKAGE STRUCTURE AND PACKAGING METHO...
Publication number
20230352449
Publication date
Nov 2, 2023
SJ Semiconductor(Jiangyin) Corporation
Yenheng Chen
H01 - BASIC ELECTRIC ELEMENTS