Silver [Ag] as principal constituent

Industry

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H01L2224/37639

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/37639Silver [Ag] as principal constituent

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method for producing semiconductor device
- Patent number 10,985,093
- Issue date Apr 20, 2021
- Rohm Co., Ltd.
- Koshun Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for producing semiconductor device
- Patent number 10,622,288
- Issue date Apr 14, 2020
- Rohm Co., Ltd.
- Koshun Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,490,491
- Issue date Nov 26, 2019
- Mitsubishi Electric Corporation
- Kazuhiro Tada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection member with bulk body and electrically and thermally con...
- Patent number 10,366,946
- Issue date Jul 30, 2019
- Infineon Technologies AG
- Wu Hu Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier and clip each having sinterable, solidified paste for conne...
- Patent number 10,347,566
- Issue date Jul 9, 2019
- Heraeus Deutschland GmbH & Co. KG
- Michael Benedikt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with conductive clip
- Patent number 9,799,623
- Issue date Oct 24, 2017
- Infineon Technologies Americas Corp.
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Glass/ceramic replacement of epoxy for high temperature hermeticall...
- Patent number 9,601,400
- Issue date Mar 21, 2017
- Semtech Corporation
- Victor Hugo Cruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and structure therefor
- Patent number 9,460,995
- Issue date Oct 4, 2016
- Semiconductor Components Industries, LLC
- Ali Salih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead for connection to a semiconductor device
- Patent number 9,418,918
- Issue date Aug 16, 2016
- NXP B.V.
- Roelf Anco Jacob Groenhuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a HEMT semiconductor device and structure therefor
- Patent number 9,214,423
- Issue date Dec 15, 2015
- Semiconductor Components Industries, LLC
- Ali Salih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module including a discrete device mounted on a DCB substrate
- Patent number 9,147,637
- Issue date Sep 29, 2015
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor package with conductive clip
- Patent number 9,118,126
- Issue date Aug 25, 2015
- International Rectifier Corporation
- Hsueh-Rong Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Glass/ceramics replacement of epoxy for high temperature hermetical...
- Patent number 9,111,869
- Issue date Aug 18, 2015
- Semtech Corporation
- Victor Hugo Cruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device using diffusion soldering
- Patent number 8,975,117
- Issue date Mar 10, 2015
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component and method of manufacture
- Patent number 8,451,621
- Issue date May 28, 2013
- Semiconductor Components Industries, LLC
- Shutesh Krishnan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connector assembly and method of manufacture
- Patent number 8,449,339
- Issue date May 28, 2013
- Semiconductor Components Industries, LLC
- Shutesh Krishnan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
IGBT power semiconductor package having a conductive clip
- Patent number 8,354,733
- Issue date Jan 15, 2013
- International Rectifier Corporation
- Hsueh-Rong Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure having enhanced thermal dissipation...
- Patent number 7,944,044
- Issue date May 17, 2011
- Semiconductor Components Industries, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRICAL CONNECTION ELEMENT WITH OUTGASSING GROOVES
- Publication number 20240355772
- Publication date Oct 24, 2024
- INFINEON TECHNOLOGIES AG
- Suhaimi Azizan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrical Circuit Body, Power Converter, and Electrical Circuit Bo...
- Publication number 20240038611
- Publication date Feb 1, 2024
- Hitachi Astemo, Ltd.
- Ning TANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTING STRIP FOR DISCRETE AND POWER ELECTRONIC DEVICES
- Publication number 20220320032
- Publication date Oct 6, 2022
- STMicroelectronics S.r.l.
- Agatino Minotti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CONNECTION MEMBER, ELECTRICAL CONNECTION STRUCTURE, AND...
- Publication number 20210257327
- Publication date Aug 19, 2021
- Hitachi Metals, Ltd.
- Junya NISHINA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
- Publication number 20200211937
- Publication date Jul 2, 2020
- ROHM CO., LTD.
- Koshun SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
- Publication number 20190139873
- Publication date May 9, 2019
- ROHM CO., LTD.
- Koshun SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Connection member with bulk body and electrically and thermally con...
- Publication number 20190131218
- Publication date May 2, 2019
- INFINEON TECHNOLOGIES AG
- Wu Hu LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH CONDUCTIVE CLIP
- Publication number 20180012859
- Publication date Jan 11, 2018
- Infineon Technologies Americas Corp.
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Conductive Clip
- Publication number 20160300811
- Publication date Oct 13, 2016
- Infineon Technologies Americas Corp.
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A HEMT SEMICONDUCTOR DEVICE AND STRUCTURE THEREFOR
- Publication number 20140264452
- Publication date Sep 18, 2014
- Semiconductor Components Industries, LLC
- Ali Salih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Using Diffusion Soldering
- Publication number 20130200532
- Publication date Aug 8, 2013
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Module Including a Discrete Device Mounted on a DCB Substrate
- Publication number 20130161801
- Publication date Jun 27, 2013
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Package with Conductive Clip
- Publication number 20130140602
- Publication date Jun 6, 2013
- International Rectifier Corporation
- Hsueh-Rong Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS/CERAMICS REPLACEMENT OF EPOXY FOR HIGH TEMPERATURE HERMETICAL...
- Publication number 20130026490
- Publication date Jan 31, 2013
- Victor H. Cruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IGBT Power Semiconductor Package Having a Conductive Clip
- Publication number 20120223415
- Publication date Sep 6, 2012
- INTERNATIONAL RECTIFIER CORPORATION
- Hsueh-Rong Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTOR ASSEMBLY AND METHOD OF MANUFACTURE
- Publication number 20120064781
- Publication date Mar 15, 2012
- Shutesh Krishnan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURE
- Publication number 20120063107
- Publication date Mar 15, 2012
- Shutesh Krishnan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE HAVING ENHANCED THERMAL DISSIPATION...
- Publication number 20070278664
- Publication date Dec 6, 2007
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS

Silver [Ag] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and method for producing semiconductor device

Semiconductor device and method for producing semiconductor device

Semiconductor device

Connection member with bulk body and electrically and thermally con...

Carrier and clip each having sinterable, solidified paste for conne...

Semiconductor package with conductive clip

Glass/ceramic replacement of epoxy for high temperature hermeticall...

Semiconductor device and structure therefor

Lead for connection to a semiconductor device

Method of forming a HEMT semiconductor device and structure therefor

Module including a discrete device mounted on a DCB substrate

Power semiconductor package with conductive clip

Glass/ceramics replacement of epoxy for high temperature hermetical...

Semiconductor device using diffusion soldering

Semiconductor component and method of manufacture

Connector assembly and method of manufacture

IGBT power semiconductor package having a conductive clip

Semiconductor package structure having enhanced thermal dissipation...

Patents Applicationslast 30 patents

ELECTRICAL CONNECTION ELEMENT WITH OUTGASSING GROOVES

Electrical Circuit Body, Power Converter, and Electrical Circuit Bo...

CONNECTING STRIP FOR DISCRETE AND POWER ELECTRONIC DEVICES

ELECTRICAL CONNECTION MEMBER, ELECTRICAL CONNECTION STRUCTURE, AND...

SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

Connection member with bulk body and electrically and thermally con...

SEMICONDUCTOR PACKAGE WITH CONDUCTIVE CLIP

Semiconductor Package with Conductive Clip

METHOD OF FORMING A HEMT SEMICONDUCTOR DEVICE AND STRUCTURE THEREFOR

Semiconductor Device Using Diffusion Soldering

Module Including a Discrete Device Mounted on a DCB Substrate

Power Semiconductor Package with Conductive Clip

GLASS/CERAMICS REPLACEMENT OF EPOXY FOR HIGH TEMPERATURE HERMETICAL...

IGBT Power Semiconductor Package Having a Conductive Clip

CONNECTOR ASSEMBLY AND METHOD OF MANUFACTURE

SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURE

SEMICONDUCTOR PACKAGE STRUCTURE HAVING ENHANCED THERMAL DISSIPATION...