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Silver [Ag] as principal constituent
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H01L2224/05439
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H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
Current Industry
H01L2224/05439
Silver [Ag] as principal constituent
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last 30 patents
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Patent Grant
Semiconductor chip package with resilient conductive paste post and...
Patent number
10,685,943
Issue date
Jun 16, 2020
Mediatek Inc.
Shiann-Tsong Tsai
H01 - BASIC ELECTRIC ELEMENTS