Silver [Ag] as principal constituent

Industry

CPC
H01L2224/84439

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/84439Silver [Ag] as principal constituent

Industries

Patents Grantslast 30 patents

Information Patent Grant
Solid top terminal for discrete power devices
- Patent number 10,872,846
- Issue date Dec 22, 2020
- RENESAS ELECTRONICS AMERICA INC.
- Jean Claude Harel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Using MEMS fabrication incorporating into LED device mounting and a...
- Patent number 10,403,804
- Issue date Sep 3, 2019
- Epistar Corporation
- Guan Ru He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Using MEMS fabrication incorporating into LED device mounting and a...
- Patent number 10,026,882
- Issue date Jul 17, 2018
- Epistar Corporation
- Guan Ru He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked synchronous buck converter having chip embedded in outside...
- Patent number 9,425,132
- Issue date Aug 23, 2016
- Texas Instruments Incorporated
- Osvaldo Jorge Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device using diffusion soldering
- Patent number 8,975,117
- Issue date Mar 10, 2015
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reversible leadless package and methods of making and using same
- Patent number 8,058,104
- Issue date Nov 15, 2011
- Unisem (Mauritius) Holdings Limited
- Shafidul Islam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reversible leadless package and methods of making and using same
- Patent number 7,709,935
- Issue date May 4, 2010
- Unisem (Mauritius) Holdings Limited
- Shafidul Islam
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
USING MEMS FABRICATION INCORPORATING INTO LED DEVICE MOUNTING AND A...
- Publication number 20180301609
- Publication date Oct 18, 2018
- EPISTAR CORPORATION
- Guan Ru He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Using Diffusion Soldering
- Publication number 20130200532
- Publication date Aug 8, 2013
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE HAVING FEATURES FORMED BY STAMPING
- Publication number 20130009296
- Publication date Jan 10, 2013
- GEM Services, Inc.
- Anthony C. Tsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE HAVING CONFIGURABLE LEAD FRAME FINGERS
- Publication number 20130009297
- Publication date Jan 10, 2013
- GEM Services, Inc.
- Anthony C. Tsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING A POWER SEMI...
- Publication number 20120211799
- Publication date Aug 23, 2012
- ABB Research Ltd.
- Chunlei LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REVERSIBLE LEADLESS PACKAGE AND METHODS OF MAKING AND USING SAME
- Publication number 20100221872
- Publication date Sep 2, 2010
- Shafidul Islam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reversible leadless package and methods of making and using same
- Publication number 20070111374
- Publication date May 17, 2007
- ADVANCED INTERCONNECT TECHNOLOGIES LIMITED
- Shafidul Islam
- H01 - BASIC ELECTRIC ELEMENTS

Silver [Ag] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Solid top terminal for discrete power devices

Using MEMS fabrication incorporating into LED device mounting and a...

Using MEMS fabrication incorporating into LED device mounting and a...

Stacked synchronous buck converter having chip embedded in outside...

Semiconductor device using diffusion soldering

Reversible leadless package and methods of making and using same

Reversible leadless package and methods of making and using same

Patents Applicationslast 30 patents

USING MEMS FABRICATION INCORPORATING INTO LED DEVICE MOUNTING AND A...

Semiconductor Device Using Diffusion Soldering

SEMICONDUCTOR DEVICE PACKAGE HAVING FEATURES FORMED BY STAMPING

SEMICONDUCTOR DEVICE PACKAGE HAVING CONFIGURABLE LEAD FRAME FINGERS

POWER SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING A POWER SEMI...

REVERSIBLE LEADLESS PACKAGE AND METHODS OF MAKING AND USING SAME

Reversible leadless package and methods of making and using same