Silver [Ag] as principal constituent

Industry

CPC
H01L2224/29139

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/29139Silver [Ag] as principal constituent

Industries

Patents Grantslast 30 patents

Information Patent Grant
Submodule semiconductor package
- Patent number 12,205,918
- Issue date Jan 21, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- JooYang Eom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for fabricating a semiconductor pa...
- Patent number 12,205,870
- Issue date Jan 21, 2025
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon nitride circuit board and electronic component module
- Patent number 12,199,005
- Issue date Jan 14, 2025
- DENKA COMPANY LIMITED
- Seiji Yano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal conductive film
- Patent number 12,183,653
- Issue date Dec 31, 2024
- Samsung Electronics Co., Ltd.
- Joungphil Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder thermal interface material (STIM) with dopant
- Patent number 12,166,004
- Issue date Dec 10, 2024
- Intel Corporation
- Susmriti Das Mahapatra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with lead between a plurality of encapsulated...
- Patent number 12,159,816
- Issue date Dec 3, 2024
- Rohm Co., Ltd.
- Kentaro Nasu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding member, method for producing bonding member and method for...
- Patent number 12,134,146
- Issue date Nov 5, 2024
- Osaka University
- Katsuaki Suganuma
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor module with a first substrate, a second substrate and...
- Patent number 12,125,817
- Issue date Oct 22, 2024
- Danfoss Silicon Power GmbH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding member for semiconductor device
- Patent number 12,119,322
- Issue date Oct 15, 2024
- SUPERUFO291 TEC
- Akira Fukui
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Plurality of transistors attached to a heat sink with a periphery n...
- Patent number 12,113,002
- Issue date Oct 8, 2024
- Mitsubishi Electric Corporation
- Hiroki Katsube
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module with graphite plate
- Patent number 12,107,029
- Issue date Oct 1, 2024
- Rohm Co., Ltd.
- Masashi Hayashiguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thick-silver layer interface
- Patent number 12,094,801
- Issue date Sep 17, 2024
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with different types of semiconductor dies attached to a fl...
- Patent number 12,080,660
- Issue date Sep 3, 2024
- MACOM Technology Solutions Holdings, Inc.
- Xikun Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,080,680
- Issue date Sep 3, 2024
- Kabushiki Kaisba Toshiba
- Makoto Mizukami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding material and bonded structure
- Patent number 12,070,801
- Issue date Aug 27, 2024
- Mitsui Mining & Smelting Co., Ltd.
- Kei Anai
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Integrated fan-out packaging
- Patent number 12,062,622
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Han-Ping Pu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,051,633
- Issue date Jul 30, 2024
- Rohm Co., Ltd.
- Koshun Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact and die attach metallization for silicon carbide based devi...
- Patent number 12,051,669
- Issue date Jul 30, 2024
- Wolfspeed, Inc.
- Alexander Komposch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module and fabrication method of the same, graphite plate, an...
- Patent number 12,046,532
- Issue date Jul 23, 2024
- Rohm Co., Ltd.
- Maiko Hatano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Layer structure with an intermetallic phase layer and a chip packag...
- Patent number 12,023,762
- Issue date Jul 2, 2024
- Infineon Technologies AG
- Alexander Heinrich
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Systems and methods for fabricating silicon die stacks for electron...
- Patent number 12,027,489
- Issue date Jul 2, 2024
- Ukyo Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration and bonding of micro-devices into system substrate
- Patent number 12,014,999
- Issue date Jun 18, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper/ceramic assembly, insulated circuit board, method for produc...
- Patent number 12,002,732
- Issue date Jun 4, 2024
- Mitsubishi Materials Corporation
- Nobuyuki Terasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board, power semiconductor module arrangement compr...
- Patent number 12,002,740
- Issue date Jun 4, 2024
- Infineon Technologies AG
- Sebastian Michalski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages using package in package systems and related...
- Patent number 11,984,424
- Issue date May 14, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Inpil Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite substrate and method for manufacturing same, and circuit...
- Patent number 11,973,002
- Issue date Apr 30, 2024
- DENKA COMPANY LIMITED
- Atsushi Sakai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Display device having reflective layer coupled to light emitting el...
- Patent number 11,942,583
- Issue date Mar 26, 2024
- Japan Display Inc.
- Osamu Itou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package, method of manufacturing the same and metal b...
- Patent number 11,908,824
- Issue date Feb 20, 2024
- JMJ KOREA CO., LTD.
- Yun Hwa Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and production method thereof, and semiconduc...
- Patent number 11,901,341
- Issue date Feb 13, 2024
- Mitsubishi Electric Corporation
- Yosuke Nakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of power semiconductor device, power semicondu...
- Patent number 11,894,337
- Issue date Feb 6, 2024
- Mitsubishi Electric Corporation
- Keisuke Kawamoto
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CERAMIC COPPER CIRCUIT BOARD AND SEMICONDUCTOR DEVICE USING SAME
- Publication number 20250054848
- Publication date Feb 13, 2025
- Kabushiki Kaisha Toshiba
- Yasuhiro HONDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER MATERIAL
- Publication number 20250041977
- Publication date Feb 6, 2025
- Fuji Electric Co., Ltd.
- Kohei MITSUI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Submounts with Stud Protrusions for Semiconductor Packages
- Publication number 20250038055
- Publication date Jan 30, 2025
- Wolfspeed, Inc.
- Afshin Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE STRUCTURE
- Publication number 20250022770
- Publication date Jan 16, 2025
- Delta Electronics, Inc.
- Fu-Yuan SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250022873
- Publication date Jan 16, 2025
- Murata Manufacturing Co., Ltd.
- Masayuki AOIKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20240429116
- Publication date Dec 26, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Seoung Joon HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD OF MANUFA...
- Publication number 20240422914
- Publication date Dec 19, 2024
- Mitsubishi Electric Corporation
- Yosuke NAKATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINTER BONDING SHEET
- Publication number 20240413116
- Publication date Dec 12, 2024
- Nitto Denko Corporation
- Ryota MITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THICK-SILVER LAYER INTERFACE
- Publication number 20240404914
- Publication date Dec 5, 2024
- NXP USA, Inc.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20240404924
- Publication date Dec 5, 2024
- MEDIATEK INC.
- Tsung-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND PACKAGE STRUCTURE OF SEMICONDUCTOR DEVICE
- Publication number 20240404941
- Publication date Dec 5, 2024
- ROHM CO., LTD.
- Asuma IMAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240395681
- Publication date Nov 28, 2024
- ROHM CO., LTD.
- Bungo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL CLIP STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20240395761
- Publication date Nov 28, 2024
- JMJ Korea Co., Ltd.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAMELESS ELECTRICALLY ISOLATED POWER SEMICONDUCTOR PACKAGE
- Publication number 20240395692
- Publication date Nov 28, 2024
- LITTELFUSE, INC.
- Tiburcio Maldo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC SUBSTRATE FOR POWER MODULE, METHOD FOR MANUFACTURING SAME,...
- Publication number 20240387438
- Publication date Nov 21, 2024
- AMOSENSE CO., LTD.
- Jihyung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING SEMICONDUCTOR MODULE
- Publication number 20240379608
- Publication date Nov 14, 2024
- Fuji Electric Co., Ltd.
- Yuta TAKEUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR FABRICATING SILICON DIE STACKS FOR ELECTRON...
- Publication number 20240371819
- Publication date Nov 7, 2024
- NANO-X IMAGING LTD.
- Ukyo JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MANAGEMENT SYSTEMS AND METHODS FOR SEMICONDUCTOR DEVICES
- Publication number 20240363473
- Publication date Oct 31, 2024
- Avago Technologies International Sales Pte. Limited
- Hyunsuk Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240347405
- Publication date Oct 17, 2024
- ROHM CO., LTD.
- Koshun SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240347521
- Publication date Oct 17, 2024
- DENSO CORPORATION
- Yoshitaka KATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240339383
- Publication date Oct 10, 2024
- Advanced Semiconductor Engineering, Inc.
- Ko-Pu WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A LAYER STRUCTURE, CHIP PACKAGE AND CHIP ARRANGEMENT
- Publication number 20240335912
- Publication date Oct 10, 2024
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- B22 - CASTING POWDER METALLURGY
Information Patent Application
POWER MODULE AND FABRICATION METHOD OF THE SAME, GRAPHITE PLATE, AN...
- Publication number 20240332122
- Publication date Oct 3, 2024
- ROHM CO., LTD.
- Maiko HATANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICE
- Publication number 20240321665
- Publication date Sep 26, 2024
- Kabushiki Kaisha Toshiba
- Fumiyoshi KAWASHIRO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240312860
- Publication date Sep 19, 2024
- Kabushiki Kaisha Toshiba
- Daisuke KOIKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINTERING FILM FRAMES AND RELATED METHODS
- Publication number 20240304596
- Publication date Sep 12, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Dukyong LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF INTEGRATING POWER MODULE WITH IN...
- Publication number 20240304603
- Publication date Sep 12, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jinchang ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE
- Publication number 20240297133
- Publication date Sep 5, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING SUBSTRATE, SEMICONDUCTOR PACKAGE HAVING DOUBLE-SIDED SUBSTR...
- Publication number 20240290700
- Publication date Aug 29, 2024
- JMJ Korea Co., Ltd.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240290694
- Publication date Aug 29, 2024
- ROHM CO., LTD.
- Ryotaro KAKIZAKI
- H01 - BASIC ELECTRIC ELEMENTS

Silver [Ag] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Submodule semiconductor package

Semiconductor package and method for fabricating a semiconductor pa...

Silicon nitride circuit board and electronic component module

Thermal conductive film

Solder thermal interface material (STIM) with dopant

Semiconductor device with lead between a plurality of encapsulated...

Bonding member, method for producing bonding member and method for...

Semiconductor module with a first substrate, a second substrate and...

Bonding member for semiconductor device

Plurality of transistors attached to a heat sink with a periphery n...

Power module with graphite plate

Thick-silver layer interface

Package with different types of semiconductor dies attached to a fl...

Semiconductor device

Bonding material and bonded structure

Integrated fan-out packaging

Semiconductor device

Contact and die attach metallization for silicon carbide based devi...

Power module and fabrication method of the same, graphite plate, an...

Layer structure with an intermetallic phase layer and a chip packag...

Systems and methods for fabricating silicon die stacks for electron...

Integration and bonding of micro-devices into system substrate

Copper/ceramic assembly, insulated circuit board, method for produc...

Printed circuit board, power semiconductor module arrangement compr...

Semiconductor packages using package in package systems and related...

Composite substrate and method for manufacturing same, and circuit...

Display device having reflective layer coupled to light emitting el...

Semiconductor package, method of manufacturing the same and metal b...

Semiconductor package and production method thereof, and semiconduc...

Manufacturing method of power semiconductor device, power semicondu...

Patents Applicationslast 30 patents

CERAMIC COPPER CIRCUIT BOARD AND SEMICONDUCTOR DEVICE USING SAME

SOLDER MATERIAL

Submounts with Stud Protrusions for Semiconductor Packages

POWER MODULE STRUCTURE

SEMICONDUCTOR DEVICE

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD OF MANUFA...

SINTER BONDING SHEET

THICK-SILVER LAYER INTERFACE

SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR DEVICE AND PACKAGE STRUCTURE OF SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

METAL CLIP STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

LEADFRAMELESS ELECTRICALLY ISOLATED POWER SEMICONDUCTOR PACKAGE

CERAMIC SUBSTRATE FOR POWER MODULE, METHOD FOR MANUFACTURING SAME,...

SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING SEMICONDUCTOR MODULE

SYSTEMS AND METHODS FOR FABRICATING SILICON DIE STACKS FOR ELECTRON...

THERMAL MANAGEMENT SYSTEMS AND METHODS FOR SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

ELECTRONIC DEVICE

METHOD OF FORMING A LAYER STRUCTURE, CHIP PACKAGE AND CHIP ARRANGEMENT

POWER MODULE AND FABRICATION METHOD OF THE SAME, GRAPHITE PLATE, AN...

SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SINTERING FILM FRAMES AND RELATED METHODS

SEMICONDUCTOR DEVICE AND METHOD OF INTEGRATING POWER MODULE WITH IN...

INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE

BONDING SUBSTRATE, SEMICONDUCTOR PACKAGE HAVING DOUBLE-SIDED SUBSTR...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE