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H01L2924/01047

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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H01L2924/01047Silver [Ag]

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package with intermetallic-compound solder-joint comp...
- Patent number 12,206,056
- Issue date Jan 21, 2025
- Electronics and Telecommunications Research Institute
- Kwang-Seong Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display substrate and preparation method thereof, and display appar...
- Patent number 12,199,081
- Issue date Jan 14, 2025
- BOE Technology Group Co., Ltd.
- Wenqu Liu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Pre-molded leadframes in semiconductor devices
- Patent number 12,191,273
- Issue date Jan 7, 2025
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframes in semiconductor devices
- Patent number 12,183,703
- Issue date Dec 31, 2024
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor devices
- Patent number 12,166,006
- Issue date Dec 10, 2024
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tomohiro Uno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a soldered joint with one or more inter...
- Patent number 12,166,005
- Issue date Dec 10, 2024
- Infineon Technologies Austria AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 12,154,823
- Issue date Nov 26, 2024
- Renesas Electronics Corporation
- Katsuhiko Hotta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with nickel-silver pre-plated leadframe
- Patent number 12,154,845
- Issue date Nov 26, 2024
- Texas Instruments Incorporated
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding member, method for producing bonding member and method for...
- Patent number 12,134,146
- Issue date Nov 5, 2024
- Osaka University
- Katsuaki Suganuma
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bridge interconnection with layered interconnect structures
- Patent number 12,132,002
- Issue date Oct 29, 2024
- Intel Corporation
- Yueli Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor devices
- Patent number 12,132,026
- Issue date Oct 29, 2024
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tomohiro Uno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for permanent connection of two metal surfaces
- Patent number 12,107,057
- Issue date Oct 1, 2024
- EV Group E. Thallner GmbH
- Viorel Dragoi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two-step decapsulation technique for semiconductor package having s...
- Patent number 12,106,973
- Issue date Oct 1, 2024
- Silicon Laboratories Inc.
- Erwin Hendarto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connection structure and manufacturing method therefor
- Patent number 12,100,923
- Issue date Sep 24, 2024
- Resonac Corporation
- Kunihiko Akai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High reliability lead-free solder alloys for harsh environment elec...
- Patent number 12,090,579
- Issue date Sep 17, 2024
- Indium Corporation
- Weiping Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor chip with redundant thru-silicon-vias
- Patent number 12,094,853
- Issue date Sep 17, 2024
- Advanced Micro Devices, Inc.
- Bryan Black
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged integrated circuit devices with through-body conductive vi...
- Patent number 12,087,738
- Issue date Sep 10, 2024
- Tongbi Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with different types of semiconductor dies attached to a fl...
- Patent number 12,080,660
- Issue date Sep 3, 2024
- MACOM Technology Solutions Holdings, Inc.
- Xikun Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method to minimize stress on stack via
- Patent number 12,080,600
- Issue date Sep 3, 2024
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die contact structure and method
- Patent number 12,074,127
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having routable encapsulated conductive subst...
- Patent number 12,062,588
- Issue date Aug 13, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Won Bae Bang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical, mechanical, computing, and/or other devices formed of e...
- Patent number 12,063,874
- Issue date Aug 13, 2024
- Ambature, Inc.
- Douglas J. Gilbert
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Semiconductor structure and method for manufacturing semiconductor...
- Patent number 12,040,296
- Issue date Jul 16, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Luguang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and electronic device
- Patent number 12,033,922
- Issue date Jul 9, 2024
- Denso Corporation
- Akihiro Fukatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures for low temperature bonding using nanoparticles
- Patent number 12,027,487
- Issue date Jul 2, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing semiconductor device with bump interconnec...
- Patent number 12,002,783
- Issue date Jun 4, 2024
- SK hynix Inc.
- Jun Yong Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Info structure with copper pillar having reversed profile
- Patent number 11,984,342
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency transmission line with finish plating on conductive...
- Patent number 11,984,423
- Issue date May 14, 2024
- Skyworks Solutions, Inc.
- Sandra Louise Petty-Weeks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for low temperature bonding using nanoparticles
- Patent number 11,973,056
- Issue date Apr 30, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having improved thermal interface between sem...
- Patent number 11,967,570
- Issue date Apr 23, 2024
- Mediatek Inc.
- Chia-Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BRIDGE INTERCONNECTION WITH LAYERED INTERCONNECT STRUCTURES
- Publication number 20250015004
- Publication date Jan 9, 2025
- Intel Corporation
- Yueli Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH RELIABILITY LEAD-FREE SOLDER ALLOYS FOR HARSH ENVIRONMENT ELEC...
- Publication number 20250001530
- Publication date Jan 2, 2025
- Indium Corporation
- Weiping Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGED INTEGRATED CIRCUIT DEVICES WITH THROUGH-BODY CONDUCTIVE VI...
- Publication number 20240421131
- Publication date Dec 19, 2024
- Lodestar Licensing Group LLC
- Tongbi Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PERMANENT CONNECTION OF TWO METAL SURFACES
- Publication number 20240421109
- Publication date Dec 19, 2024
- EV GROUP E. THALLNER GMBH
- Viorel Dragio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTOELECTRONIC SYSTEM
- Publication number 20240421266
- Publication date Dec 19, 2024
- EPISTAR CORPORATION
- Min-Hsun HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240413026
- Publication date Dec 12, 2024
- Samsung Electronics Co., Ltd.
- Yeongbeom KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240404904
- Publication date Dec 5, 2024
- InnoLux Corporation
- Ker-Yih KAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240404921
- Publication date Dec 5, 2024
- Samsung Electronics Co., Ltd.
- Choongbin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING ROUTABLE ENCAPSULATED CONDUCTIVE SUBST...
- Publication number 20240404902
- Publication date Dec 5, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Won Bae BANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20240404908
- Publication date Dec 5, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Ki Yeul Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Forming a Semiconductor Device Having TSV Formed Through...
- Publication number 20240387393
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Pin Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, METHOD OF FORMING SEMICONDUCTOR PACKAGE, AND...
- Publication number 20240363501
- Publication date Oct 31, 2024
- Shenzhen STS Microelectronics Co., Ltd.
- Qian LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead-Free Solder Ball
- Publication number 20240363571
- Publication date Oct 31, 2024
- SENJU METAL INDUSTRY CO., LTD.
- Yoshie Yamanaka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Device and Method of Forming Stress Relief Vias in Mu...
- Publication number 20240355760
- Publication date Oct 24, 2024
- STATS ChipPAC Pte Ltd.
- Peik Eng Ooi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES
- Publication number 20240312954
- Publication date Sep 19, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240282692
- Publication date Aug 22, 2024
- ROHM CO., LTD.
- Yo MOCHIZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240282744
- Publication date Aug 22, 2024
- Fuji Electric Co., Ltd.
- Takafumi YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND POWER CONVERTING DEVICE
- Publication number 20240274557
- Publication date Aug 15, 2024
- Mitsubishi Electric Corporation
- Yo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20240266313
- Publication date Aug 8, 2024
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tomohiro UNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME
- Publication number 20240250062
- Publication date Jul 25, 2024
- STATS ChipPAC Pte Ltd.
- JinHee Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULANT-DEFINED LAND GRID ARRAY (LGA) PACKAGE AND METHOD FOR MA...
- Publication number 20240213202
- Publication date Jun 27, 2024
- Deca Technologies USA, Inc.
- Robin Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, PACKAGE FORMING METHOD, AND POWER SUPPLY MODULE
- Publication number 20240203843
- Publication date Jun 20, 2024
- Shenzhen STS Microelectronics Co., Ltd.
- Lin LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METALLIZED SEMICONDUCTOR DIE AND MANUFACTURING METHOD
- Publication number 20240194623
- Publication date Jun 13, 2024
- TDK Electronics AG
- Mehrdad Shayganpoor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING SEED STRUCTURE AND METHOD OF MANUFA...
- Publication number 20240194627
- Publication date Jun 13, 2024
- Samsung Electronics Co., Ltd.
- Seungmin Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH NICKEL-SILVER PRE-PLATED LEADFRAME
- Publication number 20240153853
- Publication date May 9, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDERING DEVICE INCLUDING PULSED LIGHT IRRADIATOR, SOLDERING METHO...
- Publication number 20240128230
- Publication date Apr 18, 2024
- Samsung Electronics Co., Ltd.
- Sinyeop LEE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ASSEMBLY OF AN INTEGRATED CIRCUIT IN A CHIP SCALE BALL GRID ARRAY
- Publication number 20240113062
- Publication date Apr 4, 2024
- Azimuth Industrial Company, Inc.
- David Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Fabricating a Power Semiconductor Device
- Publication number 20240096842
- Publication date Mar 21, 2024
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH MULTI-LAYER CONTACT AND SYSTEM
- Publication number 20240088087
- Publication date Mar 14, 2024
- INFINEON TECHNOLOGIES AG
- Alexander HEINRICH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240079392
- Publication date Mar 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chuei-Tang WANG
- H01 - BASIC ELECTRIC ELEMENTS

Silver [Ag]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package with intermetallic-compound solder-joint comp...

Display substrate and preparation method thereof, and display appar...

Pre-molded leadframes in semiconductor devices

Leadframes in semiconductor devices

Bonding wire for semiconductor devices

Semiconductor device having a soldered joint with one or more inter...

Semiconductor device and a method of manufacturing the same

Semiconductor package with nickel-silver pre-plated leadframe

Bonding member, method for producing bonding member and method for...

Bridge interconnection with layered interconnect structures

Bonding wire for semiconductor devices

Method for permanent connection of two metal surfaces

Two-step decapsulation technique for semiconductor package having s...

Connection structure and manufacturing method therefor

High reliability lead-free solder alloys for harsh environment elec...

Semiconductor chip with redundant thru-silicon-vias

Packaged integrated circuit devices with through-body conductive vi...

Package with different types of semiconductor dies attached to a fl...

Semiconductor device and method to minimize stress on stack via

Semiconductor die contact structure and method

Semiconductor package having routable encapsulated conductive subst...

Electrical, mechanical, computing, and/or other devices formed of e...

Semiconductor structure and method for manufacturing semiconductor...

Semiconductor device and electronic device

Structures for low temperature bonding using nanoparticles

Methods of manufacturing semiconductor device with bump interconnec...

Info structure with copper pillar having reversed profile

Radio frequency transmission line with finish plating on conductive...

Methods for low temperature bonding using nanoparticles

Semiconductor package having improved thermal interface between sem...

Patents Applicationslast 30 patents

BRIDGE INTERCONNECTION WITH LAYERED INTERCONNECT STRUCTURES

HIGH RELIABILITY LEAD-FREE SOLDER ALLOYS FOR HARSH ENVIRONMENT ELEC...

PACKAGED INTEGRATED CIRCUIT DEVICES WITH THROUGH-BODY CONDUCTIVE VI...

METHOD FOR PERMANENT CONNECTION OF TWO METAL SURFACES

OPTOELECTRONIC SYSTEM

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE HAVING ROUTABLE ENCAPSULATED CONDUCTIVE SUBST...

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

Method for Forming a Semiconductor Device Having TSV Formed Through...

SEMICONDUCTOR PACKAGE, METHOD OF FORMING SEMICONDUCTOR PACKAGE, AND...

Lead-Free Solder Ball

Semiconductor Device and Method of Forming Stress Relief Vias in Mu...

STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND POWER CONVERTING DEVICE

BONDING WIRE FOR SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME

ENCAPSULANT-DEFINED LAND GRID ARRAY (LGA) PACKAGE AND METHOD FOR MA...

SEMICONDUCTOR PACKAGE, PACKAGE FORMING METHOD, AND POWER SUPPLY MODULE

METALLIZED SEMICONDUCTOR DIE AND MANUFACTURING METHOD

SEMICONDUCTOR DEVICES INCLUDING SEED STRUCTURE AND METHOD OF MANUFA...

SEMICONDUCTOR PACKAGE WITH NICKEL-SILVER PRE-PLATED LEADFRAME

SOLDERING DEVICE INCLUDING PULSED LIGHT IRRADIATOR, SOLDERING METHO...

ASSEMBLY OF AN INTEGRATED CIRCUIT IN A CHIP SCALE BALL GRID ARRAY

Method for Fabricating a Power Semiconductor Device

ELECTRONIC DEVICE WITH MULTI-LAYER CONTACT AND SYSTEM

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF