Silver [Ag]

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H01L2924/01047

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/01047Silver [Ag]

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Thermocompression bonding with passivated silver-based contacting m...
- Patent number 12,363,878
- Issue date Jul 15, 2025
- SET North America, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermocompression bonding with passivated gold contacting metal
- Patent number 12,363,877
- Issue date Jul 15, 2025
- SET North America, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermocompression bonding with passivated tin-based contacting metal
- Patent number 12,356,553
- Issue date Jul 8, 2025
- SET North America, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and related methods
- Patent number 12,347,813
- Issue date Jul 1, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Chee Hiong Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor components having conductive vias with aligned back s...
- Patent number 12,347,731
- Issue date Jul 1, 2025
- Micron Technology, Inc.
- Jin Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Edge removal for through-resist plating in an electro-plating cup a...
- Patent number 12,331,421
- Issue date Jun 17, 2025
- Lam Research Corporation
- Bryan L. Buckalew
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electronics assemblies with power electronic devices and three-dime...
- Patent number 12,300,653
- Issue date May 13, 2025
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper alloy bonding wire for semiconductor devices
- Patent number 12,300,658
- Issue date May 13, 2025
- Nippon Micrometal Corporation
- Daizo Oda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hybrid bonding structures, semiconductor devices having the same, a...
- Patent number 12,288,765
- Issue date Apr 29, 2025
- Samsung Electronics Co., Ltd.
- Kunmo Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor device including forming a first...
- Patent number 12,266,612
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Pin Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Info structure with copper pillar having reversed profile
- Patent number 12,261,074
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating a semiconductor device
- Patent number 12,261,144
- Issue date Mar 25, 2025
- Infineon Technologies Austria AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with multi-layer contact and system
- Patent number 12,255,168
- Issue date Mar 18, 2025
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermocompression bonding using metastable gas atoms
- Patent number 12,245,379
- Issue date Mar 4, 2025
- SET North America, LLC
- Eric Frank Schulte
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermocompression bonding with passivated copper-based contacting m...
- Patent number 12,245,380
- Issue date Mar 4, 2025
- SET North America, LLC
- Eric Frank Schulte
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermocompression bonding with passivated nickel-based contacting m...
- Patent number 12,245,381
- Issue date Mar 4, 2025
- SET North America, LLC
- Eric Frank Schulte
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Superconducting bump bonds for quantum computing systems
- Patent number 12,218,091
- Issue date Feb 4, 2025
- Google LLC
- Zhimin Jamie Yao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Resin composition, resin sheet, cured film, method for producing cu...
- Patent number 12,210,285
- Issue date Jan 28, 2025
- Toray Industries, Inc.
- Keika Hashimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 12,211,821
- Issue date Jan 28, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with intermetallic-compound solder-joint comp...
- Patent number 12,206,056
- Issue date Jan 21, 2025
- Electronics and Telecommunications Research Institute
- Kwang-Seong Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display substrate and preparation method thereof, and display appar...
- Patent number 12,199,081
- Issue date Jan 14, 2025
- BOE Technology Group Co., Ltd.
- Wenqu Liu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Pre-molded leadframes in semiconductor devices
- Patent number 12,191,273
- Issue date Jan 7, 2025
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframes in semiconductor devices
- Patent number 12,183,703
- Issue date Dec 31, 2024
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor devices
- Patent number 12,166,006
- Issue date Dec 10, 2024
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tomohiro Uno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a soldered joint with one or more inter...
- Patent number 12,166,005
- Issue date Dec 10, 2024
- Infineon Technologies Austria AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 12,154,823
- Issue date Nov 26, 2024
- Renesas Electronics Corporation
- Katsuhiko Hotta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with nickel-silver pre-plated leadframe
- Patent number 12,154,845
- Issue date Nov 26, 2024
- Texas Instruments Incorporated
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding member, method for producing bonding member and method for...
- Patent number 12,134,146
- Issue date Nov 5, 2024
- Osaka University
- Katsuaki Suganuma
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bridge interconnection with layered interconnect structures
- Patent number 12,132,002
- Issue date Oct 29, 2024
- Intel Corporation
- Yueli Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor devices
- Patent number 12,132,026
- Issue date Oct 29, 2024
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tomohiro Uno
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE, POWER DEVICE, AND POWER MODULE
- Publication number 20250210574
- Publication date Jun 26, 2025
- Kabushiki Kaisha Toshiba
- Fumiyoshi KAWASHIRO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INFO STRUCTURE WITH COPPER PILLAR HAVING REVERSED PROFILE
- Publication number 20250201617
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Fan-Out Package Structur...
- Publication number 20250140730
- Publication date May 1, 2025
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250132278
- Publication date Apr 24, 2025
- Advanced Semiconductor Engineering, Inc.
- Chih-Jing HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250132214
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES INCLUDING INTERCONNECTS WITH DIFFERENT S...
- Publication number 20250125307
- Publication date Apr 17, 2025
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH COMPRESSIBLE BONDS AND METHODS...
- Publication number 20250125309
- Publication date Apr 17, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Kai-Hsiang Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLANAR INTEGRATED CIRCUIT PACKAGE INTERCONNECTS
- Publication number 20250118641
- Publication date Apr 10, 2025
- Intel Corporation
- Robert L. Sankman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS
- Publication number 20250118705
- Publication date Apr 10, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20250096057
- Publication date Mar 20, 2025
- STMicroelectronics International N.V.
- Michael DE CRUZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL, MECHANICAL, COMPUTING, AND/OR OTHER DEVICES FORMED OF E...
- Publication number 20250098551
- Publication date Mar 20, 2025
- Ambature Inc.
- Douglas J. GILBERT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH NICKEL-SILVER PRE-PLATED LEADFRAME
- Publication number 20250087563
- Publication date Mar 13, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making Face-Up Wafer-Level Packa...
- Publication number 20250079380
- Publication date Mar 6, 2025
- STATS ChipPAC Pte Ltd.
- YongMoo Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250079251
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Fung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20250046653
- Publication date Feb 6, 2025
- RENESAS ELECTRONICS CORPORATION
- Katsuhiko HOTTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Integrating eWLB with E-bar Stru...
- Publication number 20250038101
- Publication date Jan 30, 2025
- STATS ChipPAC Pte Ltd.
- Ming-Che Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BRIDGE INTERCONNECTION WITH LAYERED INTERCONNECT STRUCTURES
- Publication number 20250015004
- Publication date Jan 9, 2025
- Intel Corporation
- Yueli Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH RELIABILITY LEAD-FREE SOLDER ALLOYS FOR HARSH ENVIRONMENT ELEC...
- Publication number 20250001530
- Publication date Jan 2, 2025
- Indium Corporation
- Weiping Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGED INTEGRATED CIRCUIT DEVICES WITH THROUGH-BODY CONDUCTIVE VI...
- Publication number 20240421131
- Publication date Dec 19, 2024
- Lodestar Licensing Group LLC
- Tongbi Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PERMANENT CONNECTION OF TWO METAL SURFACES
- Publication number 20240421109
- Publication date Dec 19, 2024
- EV GROUP E. THALLNER GMBH
- Viorel Dragio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTOELECTRONIC SYSTEM
- Publication number 20240421266
- Publication date Dec 19, 2024
- EPISTAR CORPORATION
- Min-Hsun HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240413026
- Publication date Dec 12, 2024
- Samsung Electronics Co., Ltd.
- Yeongbeom KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240404904
- Publication date Dec 5, 2024
- InnoLux Corporation
- Ker-Yih KAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240404921
- Publication date Dec 5, 2024
- Samsung Electronics Co., Ltd.
- Choongbin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING ROUTABLE ENCAPSULATED CONDUCTIVE SUBST...
- Publication number 20240404902
- Publication date Dec 5, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Won Bae BANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20240404908
- Publication date Dec 5, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Ki Yeul Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Forming a Semiconductor Device Having TSV Formed Through...
- Publication number 20240387393
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Pin Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, METHOD OF FORMING SEMICONDUCTOR PACKAGE, AND...
- Publication number 20240363501
- Publication date Oct 31, 2024
- Shenzhen STS Microelectronics Co., Ltd.
- Qian LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead-Free Solder Ball
- Publication number 20240363571
- Publication date Oct 31, 2024
- SENJU METAL INDUSTRY CO., LTD.
- Yoshie Yamanaka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Device and Method of Forming Stress Relief Vias in Mu...
- Publication number 20240355760
- Publication date Oct 24, 2024
- STATS ChipPAC Pte Ltd.
- Peik Eng Ooi
- H01 - BASIC ELECTRIC ELEMENTS

Silver [Ag]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Thermocompression bonding with passivated silver-based contacting m...

Thermocompression bonding with passivated gold contacting metal

Thermocompression bonding with passivated tin-based contacting metal

Semiconductor package and related methods

Semiconductor components having conductive vias with aligned back s...

Edge removal for through-resist plating in an electro-plating cup a...

Electronics assemblies with power electronic devices and three-dime...

Copper alloy bonding wire for semiconductor devices

Hybrid bonding structures, semiconductor devices having the same, a...

Method for forming a semiconductor device including forming a first...

Info structure with copper pillar having reversed profile

Semiconductor device and method for fabricating a semiconductor device

Electronic device with multi-layer contact and system

Thermocompression bonding using metastable gas atoms

Thermocompression bonding with passivated copper-based contacting m...

Thermocompression bonding with passivated nickel-based contacting m...

Superconducting bump bonds for quantum computing systems

Resin composition, resin sheet, cured film, method for producing cu...

Package-on-package assembly with wire bond vias

Semiconductor package with intermetallic-compound solder-joint comp...

Display substrate and preparation method thereof, and display appar...

Pre-molded leadframes in semiconductor devices

Leadframes in semiconductor devices

Bonding wire for semiconductor devices

Semiconductor device having a soldered joint with one or more inter...

Semiconductor device and a method of manufacturing the same

Semiconductor package with nickel-silver pre-plated leadframe

Bonding member, method for producing bonding member and method for...

Bridge interconnection with layered interconnect structures

Bonding wire for semiconductor devices

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE, POWER DEVICE, AND POWER MODULE

INFO STRUCTURE WITH COPPER PILLAR HAVING REVERSED PROFILE

Semiconductor Device and Method of Forming Fan-Out Package Structur...

ELECTRONIC DEVICE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

MICROELECTRONIC ASSEMBLIES INCLUDING INTERCONNECTS WITH DIFFERENT S...

SEMICONDUCTOR DEVICE STRUCTURE WITH COMPRESSIBLE BONDS AND METHODS...

PLANAR INTEGRATED CIRCUIT PACKAGE INTERCONNECTS

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS

ELECTRONIC COMPONENT

ELECTRICAL, MECHANICAL, COMPUTING, AND/OR OTHER DEVICES FORMED OF E...

SEMICONDUCTOR PACKAGE WITH NICKEL-SILVER PRE-PLATED LEADFRAME

Semiconductor Device and Method of Making Face-Up Wafer-Level Packa...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

Semiconductor Device and Method of Integrating eWLB with E-bar Stru...

BRIDGE INTERCONNECTION WITH LAYERED INTERCONNECT STRUCTURES

HIGH RELIABILITY LEAD-FREE SOLDER ALLOYS FOR HARSH ENVIRONMENT ELEC...

PACKAGED INTEGRATED CIRCUIT DEVICES WITH THROUGH-BODY CONDUCTIVE VI...

METHOD FOR PERMANENT CONNECTION OF TWO METAL SURFACES

OPTOELECTRONIC SYSTEM

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE HAVING ROUTABLE ENCAPSULATED CONDUCTIVE SUBST...

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

Method for Forming a Semiconductor Device Having TSV Formed Through...

SEMICONDUCTOR PACKAGE, METHOD OF FORMING SEMICONDUCTOR PACKAGE, AND...

Lead-Free Solder Ball

Semiconductor Device and Method of Forming Stress Relief Vias in Mu...