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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2924/00
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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H01L2924/01047
Silver [Ag]
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Patents Grants
last 30 patents
Information
Patent Grant
Methods for low temperature bonding using nanoparticles
Patent number
11,973,056
Issue date
Apr 30, 2024
ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package having improved thermal interface between sem...
Patent number
11,967,570
Issue date
Apr 23, 2024
Mediatek Inc.
Chia-Hao Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor devices including seed structure and method of manufa...
Patent number
11,935,858
Issue date
Mar 19, 2024
Samsung Electronics Co., Ltd.
Seungmin Baek
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Process for manufacturing a chip-card module with soldered electron...
Patent number
11,894,295
Issue date
Feb 6, 2024
Linxens Holding
Christophe Mathieu
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor structure having silver-indium transient liquid phase...
Patent number
11,894,284
Issue date
Feb 6, 2024
LMDJ MANAGEMENT LLC
Yongjun Huo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Coreless organic packages with embedded die and magnetic inductor s...
Patent number
11,881,463
Issue date
Jan 23, 2024
Intel Corporation
Andrew J. Brown
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor components having conductive vias with aligned back s...
Patent number
11,869,809
Issue date
Jan 9, 2024
Micron Technology, Inc.
Jin Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonding process with inhibited oxide formation
Patent number
11,869,870
Issue date
Jan 9, 2024
SiTime Corporation
Paul M. Hagelin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for forming a semiconductor device having TSV formed through...
Patent number
11,854,990
Issue date
Dec 26, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Hsien-Pin Hu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package with nickel-silver pre-plated leadframe
Patent number
11,848,258
Issue date
Dec 19, 2023
Texas Instruments Incorporated
Nazila Dadvand
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic device with multi-layer contact and system
Patent number
11,842,975
Issue date
Dec 12, 2023
Infineon Technologies AG
Alexander Heinrich
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Solder material and method for die attachment
Patent number
11,842,974
Issue date
Dec 12, 2023
Alpha Assembly Solutions Inc.
Angelo Gulino
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor package and related methods
Patent number
11,830,856
Issue date
Nov 28, 2023
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Chee Hiong Chew
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thermal bonding sheet and thermal bonding sheet with dicing tape
Patent number
11,817,415
Issue date
Nov 14, 2023
Nitto Denko Corporation
Satoshi Honda
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having through silicon vias and manufacturing...
Patent number
11,817,427
Issue date
Nov 14, 2023
LONGITUDE LICENSING LIMITED
Ryohei Kitada
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method for fabricating a semiconductor device
Patent number
11,817,417
Issue date
Nov 14, 2023
Infineon Technologies Austria AG
Alexander Heinrich
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
BGA STIM package architecture for high performance systems
Patent number
11,817,364
Issue date
Nov 14, 2023
Intel Corporation
Rajasekaran Swaminathan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Silicon interposer sandwich structure for ESD, EMC, and EMC shieldi...
Patent number
11,810,893
Issue date
Nov 7, 2023
International Business Machines Corporation
William Emmett Bernier
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor packaging structure
Patent number
11,791,310
Issue date
Oct 17, 2023
TONGFU MICROELECTRONICS CO., LTD.
Lei Shi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Circuit board structure and method for manufacturing a circuit boar...
Patent number
11,792,941
Issue date
Oct 17, 2023
IMBERATEK, LLC
Risto Tuominen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device including a solder compound containing a compo...
Patent number
11,776,927
Issue date
Oct 3, 2023
Infineon Technologies AG
Thomas Behrens
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor memory device structure
Patent number
11,742,307
Issue date
Aug 29, 2023
OVONYX MEMORY TECHNOLOGY, LLC
John Moore
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package-on-package assembly with wire bond vias
Patent number
11,735,563
Issue date
Aug 22, 2023
Invensas LLC
Ellis Chau
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interconnect structure and method of forming same
Patent number
11,728,296
Issue date
Aug 15, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Hsiao Yun Lo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method for production of semiconductor device
Patent number
11,715,752
Issue date
Aug 1, 2023
Sony Group Corporation
Atsushi Okuyama
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Structures and methods for low temperature bonding using nanoparticles
Patent number
11,710,718
Issue date
Jul 25, 2023
ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package having improved thermal interface between sem...
Patent number
11,705,413
Issue date
Jul 18, 2023
Mediatek Inc.
Chia-Hao Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods for attachment and devices produced using the methods
Patent number
11,699,632
Issue date
Jul 11, 2023
Alpha Assembly Solutions Inc.
Monnir Boureghda
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bridge interconnection with layered interconnect structures
Patent number
11,694,960
Issue date
Jul 4, 2023
Intel Corporation
Yueli Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming interposer with opening...
Patent number
11,688,612
Issue date
Jun 27, 2023
STATS ChipPAC Pte. Ltd.
Reza A. Pagaila
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR PACKAGE WITH NICKEL-SILVER PRE-PLATED LEADFRAME
Publication number
20240153853
Publication date
May 9, 2024
TEXAS INSTRUMENTS INCORPORATED
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SOLDERING DEVICE INCLUDING PULSED LIGHT IRRADIATOR, SOLDERING METHO...
Publication number
20240128230
Publication date
Apr 18, 2024
Samsung Electronics Co., Ltd.
Sinyeop LEE
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
ASSEMBLY OF AN INTEGRATED CIRCUIT IN A CHIP SCALE BALL GRID ARRAY
Publication number
20240113062
Publication date
Apr 4, 2024
Azimuth Industrial Company, Inc.
David Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for Fabricating a Power Semiconductor Device
Publication number
20240096842
Publication date
Mar 21, 2024
Infineon Technologies Austria AG
Ralf Otremba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE WITH MULTI-LAYER CONTACT AND SYSTEM
Publication number
20240088087
Publication date
Mar 14, 2024
INFINEON TECHNOLOGIES AG
Alexander HEINRICH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20240079392
Publication date
Mar 7, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chuei-Tang WANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Die Structures and Methods of Forming the Same
Publication number
20240079364
Publication date
Mar 7, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Chia-Hao Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Two-In-One Lead Frame Package
Publication number
20240071878
Publication date
Feb 29, 2024
Littelfuse Semiconductor (Wuxi) Co., Ltd
Lei Shi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND RELATED METHODS
Publication number
20240072009
Publication date
Feb 29, 2024
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Chee Hiong CHEW
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE COMPRISING THE SAME
Publication number
20240065002
Publication date
Feb 22, 2024
Samsung Electronics Co., Ltd.
Dongkyu Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER CHIP PACKAGE AND POWER MODULE
Publication number
20240047302
Publication date
Feb 8, 2024
Ganstronic INC.
Cheng-Chuan CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method for Fabricating a Semiconductor Device
Publication number
20240038714
Publication date
Feb 1, 2024
Infineon Technologies Austria AG
Alexander Heinrich
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20240030198
Publication date
Jan 25, 2024
Powertech Technology Inc.
Ching-Wei Liao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BGA STIM PACKAGE ARCHITECTURE FOR HIGH PERFORMANCE SYSTEMS
Publication number
20240030086
Publication date
Jan 25, 2024
Intel Corporation
Rajasekaran SWAMINATHAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LIGHT-EMITTING DIODE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
Publication number
20240021593
Publication date
Jan 18, 2024
UNITED MICROELECTRONICS CORP.
ZHIBIAO ZHOU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20240014193
Publication date
Jan 11, 2024
Rohm Co., Ltd.
Hiroto SAKAI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE
Publication number
20230411317
Publication date
Dec 21, 2023
Walton Advanced Engineering, Inc
HONG-CHI YU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP ARRANGEMENT AND METHOD FOR FORMING A SINTERED CONTACT CONNECTION
Publication number
20230369284
Publication date
Nov 16, 2023
Pac Tech - Packaging Technologies GmbH
RICARDO GEELHAAR
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...
Publication number
20230369279
Publication date
Nov 16, 2023
STMicroelectronics S.r.l
Thomas GOTTARDI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Packages and Methods of Forming RDL and Side and Back...
Publication number
20230343668
Publication date
Oct 26, 2023
UTAC Headquarters Pte. Ltd.
Il Kwon Shim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Info Structure with Copper Pillar Having Reversed Profile
Publication number
20230335426
Publication date
Oct 19, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Hsi-Kuei Cheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES
Publication number
20230335531
Publication date
Oct 19, 2023
ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SEMICONDUCTOR...
Publication number
20230223367
Publication date
Jul 13, 2023
CHANGXIN MEMORY TECHNOLOGIES, INC
Luguang WANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Superconducting Bump Bonds for Quantum Computing Systems
Publication number
20230207507
Publication date
Jun 29, 2023
Google LLC
Zhimin Jamie Yao
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
PACKAGED INTEGRATED CIRCUIT DEVICES WITH THROUGH-BODY CONDUCTIVE VI...
Publication number
20230197690
Publication date
Jun 22, 2023
Micron Technology, Inc.
Tongbi Jiang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SOLDER GRID ARRAY FOR ATTACHMENT OF A DIE PACKAGE
Publication number
20230197659
Publication date
Jun 22, 2023
Intel Corporation
Mukund Ayalasomayajula
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC ASSEMBLIES INCLUDING INTERCONNECTS WITH DIFFERENT S...
Publication number
20230197679
Publication date
Jun 22, 2023
Intel Corporation
Jeremy Ecton
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
Publication number
20230187275
Publication date
Jun 15, 2023
RENESAS ELECTRONICS CORPORATION
Katsuhiko HOTTA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TWO-STEP DECAPSULATION TECHNIQUE FOR SEMICONDUCTOR PACKAGE HAVING S...
Publication number
20230138508
Publication date
May 4, 2023
Silicon Laboratories Inc.
Erwin Hendarto
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHODS FOR LOW TEMPERATURE BONDING USING NANOPARTICLES
Publication number
20230132060
Publication date
Apr 27, 2023
ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS