Silver [Ag]

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CPC
H01L2924/01047

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/01047Silver [Ag]

Industries

Patents Grantslast 30 patents

Information Patent Grant
Bonding member, method for producing bonding member and method for...
- Patent number 12,134,146
- Issue date Nov 5, 2024
- Osaka University
- Katsuaki Suganuma
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bridge interconnection with layered interconnect structures
- Patent number 12,132,002
- Issue date Oct 29, 2024
- Intel Corporation
- Yueli Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor devices
- Patent number 12,132,026
- Issue date Oct 29, 2024
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tomohiro Uno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for permanent connection of two metal surfaces
- Patent number 12,107,057
- Issue date Oct 1, 2024
- EV Group E. Thallner GmbH
- Viorel Dragoi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two-step decapsulation technique for semiconductor package having s...
- Patent number 12,106,973
- Issue date Oct 1, 2024
- Silicon Laboratories Inc.
- Erwin Hendarto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connection structure and manufacturing method therefor
- Patent number 12,100,923
- Issue date Sep 24, 2024
- Resonac Corporation
- Kunihiko Akai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High reliability lead-free solder alloys for harsh environment elec...
- Patent number 12,090,579
- Issue date Sep 17, 2024
- Indium Corporation
- Weiping Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor chip with redundant thru-silicon-vias
- Patent number 12,094,853
- Issue date Sep 17, 2024
- Advanced Micro Devices, Inc.
- Bryan Black
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged integrated circuit devices with through-body conductive vi...
- Patent number 12,087,738
- Issue date Sep 10, 2024
- Tongbi Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with different types of semiconductor dies attached to a fl...
- Patent number 12,080,660
- Issue date Sep 3, 2024
- MACOM Technology Solutions Holdings, Inc.
- Xikun Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method to minimize stress on stack via
- Patent number 12,080,600
- Issue date Sep 3, 2024
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die contact structure and method
- Patent number 12,074,127
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having routable encapsulated conductive subst...
- Patent number 12,062,588
- Issue date Aug 13, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Won Bae Bang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical, mechanical, computing, and/or other devices formed of e...
- Patent number 12,063,874
- Issue date Aug 13, 2024
- Ambature, Inc.
- Douglas J. Gilbert
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Semiconductor structure and method for manufacturing semiconductor...
- Patent number 12,040,296
- Issue date Jul 16, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Luguang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and electronic device
- Patent number 12,033,922
- Issue date Jul 9, 2024
- Denso Corporation
- Akihiro Fukatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures for low temperature bonding using nanoparticles
- Patent number 12,027,487
- Issue date Jul 2, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing semiconductor device with bump interconnec...
- Patent number 12,002,783
- Issue date Jun 4, 2024
- SK hynix Inc.
- Jun Yong Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Info structure with copper pillar having reversed profile
- Patent number 11,984,342
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency transmission line with finish plating on conductive...
- Patent number 11,984,423
- Issue date May 14, 2024
- Skyworks Solutions, Inc.
- Sandra Louise Petty-Weeks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for low temperature bonding using nanoparticles
- Patent number 11,973,056
- Issue date Apr 30, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having improved thermal interface between sem...
- Patent number 11,967,570
- Issue date Apr 23, 2024
- Mediatek Inc.
- Chia-Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including seed structure and method of manufa...
- Patent number 11,935,858
- Issue date Mar 19, 2024
- Samsung Electronics Co., Ltd.
- Seungmin Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for manufacturing a chip-card module with soldered electron...
- Patent number 11,894,295
- Issue date Feb 6, 2024
- Linxens Holding
- Christophe Mathieu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor structure having silver-indium transient liquid phase...
- Patent number 11,894,284
- Issue date Feb 6, 2024
- LMDJ MANAGEMENT LLC
- Yongjun Huo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coreless organic packages with embedded die and magnetic inductor s...
- Patent number 11,881,463
- Issue date Jan 23, 2024
- Intel Corporation
- Andrew J. Brown
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor components having conductive vias with aligned back s...
- Patent number 11,869,809
- Issue date Jan 9, 2024
- Micron Technology, Inc.
- Jin Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding process with inhibited oxide formation
- Patent number 11,869,870
- Issue date Jan 9, 2024
- SiTime Corporation
- Paul M. Hagelin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor device having TSV formed through...
- Patent number 11,854,990
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Pin Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with nickel-silver pre-plated leadframe
- Patent number 11,848,258
- Issue date Dec 19, 2023
- Texas Instruments Incorporated
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method for Forming a Semiconductor Device Having TSV Formed Through...
- Publication number 20240387393
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Pin Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, METHOD OF FORMING SEMICONDUCTOR PACKAGE, AND...
- Publication number 20240363501
- Publication date Oct 31, 2024
- Shenzhen STS Microelectronics Co., Ltd.
- Qian LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead-Free Solder Ball
- Publication number 20240363571
- Publication date Oct 31, 2024
- SENJU METAL INDUSTRY CO., LTD.
- Yoshie Yamanaka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Device and Method of Forming Stress Relief Vias in Mu...
- Publication number 20240355760
- Publication date Oct 24, 2024
- STATS ChipPAC Pte Ltd.
- Peik Eng Ooi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES
- Publication number 20240312954
- Publication date Sep 19, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240282692
- Publication date Aug 22, 2024
- ROHM CO., LTD.
- Yo MOCHIZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240282744
- Publication date Aug 22, 2024
- Fuji Electric Co., Ltd.
- Takafumi YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND POWER CONVERTING DEVICE
- Publication number 20240274557
- Publication date Aug 15, 2024
- Mitsubishi Electric Corporation
- Yo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20240266313
- Publication date Aug 8, 2024
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tomohiro UNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME
- Publication number 20240250062
- Publication date Jul 25, 2024
- STATS ChipPAC Pte Ltd.
- JinHee Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULANT-DEFINED LAND GRID ARRAY (LGA) PACKAGE AND METHOD FOR MA...
- Publication number 20240213202
- Publication date Jun 27, 2024
- Deca Technologies USA, Inc.
- Robin Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, PACKAGE FORMING METHOD, AND POWER SUPPLY MODULE
- Publication number 20240203843
- Publication date Jun 20, 2024
- Shenzhen STS Microelectronics Co., Ltd.
- Lin LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METALLIZED SEMICONDUCTOR DIE AND MANUFACTURING METHOD
- Publication number 20240194623
- Publication date Jun 13, 2024
- TDK Electronics AG
- Mehrdad Shayganpoor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING SEED STRUCTURE AND METHOD OF MANUFA...
- Publication number 20240194627
- Publication date Jun 13, 2024
- Samsung Electronics Co., Ltd.
- Seungmin Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH NICKEL-SILVER PRE-PLATED LEADFRAME
- Publication number 20240153853
- Publication date May 9, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDERING DEVICE INCLUDING PULSED LIGHT IRRADIATOR, SOLDERING METHO...
- Publication number 20240128230
- Publication date Apr 18, 2024
- Samsung Electronics Co., Ltd.
- Sinyeop LEE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ASSEMBLY OF AN INTEGRATED CIRCUIT IN A CHIP SCALE BALL GRID ARRAY
- Publication number 20240113062
- Publication date Apr 4, 2024
- Azimuth Industrial Company, Inc.
- David Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Fabricating a Power Semiconductor Device
- Publication number 20240096842
- Publication date Mar 21, 2024
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH MULTI-LAYER CONTACT AND SYSTEM
- Publication number 20240088087
- Publication date Mar 14, 2024
- INFINEON TECHNOLOGIES AG
- Alexander HEINRICH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240079392
- Publication date Mar 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chuei-Tang WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Structures and Methods of Forming the Same
- Publication number 20240079364
- Publication date Mar 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Two-In-One Lead Frame Package
- Publication number 20240071878
- Publication date Feb 29, 2024
- Littelfuse Semiconductor (Wuxi) Co., Ltd
- Lei Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND RELATED METHODS
- Publication number 20240072009
- Publication date Feb 29, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Chee Hiong CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE COMPRISING THE SAME
- Publication number 20240065002
- Publication date Feb 22, 2024
- Samsung Electronics Co., Ltd.
- Dongkyu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER CHIP PACKAGE AND POWER MODULE
- Publication number 20240047302
- Publication date Feb 8, 2024
- Ganstronic INC.
- Cheng-Chuan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method for Fabricating a Semiconductor Device
- Publication number 20240038714
- Publication date Feb 1, 2024
- Infineon Technologies Austria AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240030198
- Publication date Jan 25, 2024
- Powertech Technology Inc.
- Ching-Wei Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BGA STIM PACKAGE ARCHITECTURE FOR HIGH PERFORMANCE SYSTEMS
- Publication number 20240030086
- Publication date Jan 25, 2024
- Intel Corporation
- Rajasekaran SWAMINATHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DIODE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240021593
- Publication date Jan 18, 2024
- UNITED MICROELECTRONICS CORP.
- ZHIBIAO ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240014193
- Publication date Jan 11, 2024
- Rohm Co., Ltd.
- Hiroto SAKAI
- H01 - BASIC ELECTRIC ELEMENTS

Silver [Ag]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bonding member, method for producing bonding member and method for...

Bridge interconnection with layered interconnect structures

Bonding wire for semiconductor devices

Method for permanent connection of two metal surfaces

Two-step decapsulation technique for semiconductor package having s...

Connection structure and manufacturing method therefor

High reliability lead-free solder alloys for harsh environment elec...

Semiconductor chip with redundant thru-silicon-vias

Packaged integrated circuit devices with through-body conductive vi...

Package with different types of semiconductor dies attached to a fl...

Semiconductor device and method to minimize stress on stack via

Semiconductor die contact structure and method

Semiconductor package having routable encapsulated conductive subst...

Electrical, mechanical, computing, and/or other devices formed of e...

Semiconductor structure and method for manufacturing semiconductor...

Semiconductor device and electronic device

Structures for low temperature bonding using nanoparticles

Methods of manufacturing semiconductor device with bump interconnec...

Info structure with copper pillar having reversed profile

Radio frequency transmission line with finish plating on conductive...

Methods for low temperature bonding using nanoparticles

Semiconductor package having improved thermal interface between sem...

Semiconductor devices including seed structure and method of manufa...

Process for manufacturing a chip-card module with soldered electron...

Semiconductor structure having silver-indium transient liquid phase...

Coreless organic packages with embedded die and magnetic inductor s...

Semiconductor components having conductive vias with aligned back s...

Bonding process with inhibited oxide formation

Method for forming a semiconductor device having TSV formed through...

Semiconductor package with nickel-silver pre-plated leadframe

Patents Applicationslast 30 patents

Method for Forming a Semiconductor Device Having TSV Formed Through...

SEMICONDUCTOR PACKAGE, METHOD OF FORMING SEMICONDUCTOR PACKAGE, AND...

Lead-Free Solder Ball

Semiconductor Device and Method of Forming Stress Relief Vias in Mu...

STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND POWER CONVERTING DEVICE

BONDING WIRE FOR SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME

ENCAPSULANT-DEFINED LAND GRID ARRAY (LGA) PACKAGE AND METHOD FOR MA...

SEMICONDUCTOR PACKAGE, PACKAGE FORMING METHOD, AND POWER SUPPLY MODULE

METALLIZED SEMICONDUCTOR DIE AND MANUFACTURING METHOD

SEMICONDUCTOR DEVICES INCLUDING SEED STRUCTURE AND METHOD OF MANUFA...

SEMICONDUCTOR PACKAGE WITH NICKEL-SILVER PRE-PLATED LEADFRAME

SOLDERING DEVICE INCLUDING PULSED LIGHT IRRADIATOR, SOLDERING METHO...

ASSEMBLY OF AN INTEGRATED CIRCUIT IN A CHIP SCALE BALL GRID ARRAY

Method for Fabricating a Power Semiconductor Device

ELECTRONIC DEVICE WITH MULTI-LAYER CONTACT AND SYSTEM

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

Die Structures and Methods of Forming the Same

Two-In-One Lead Frame Package

SEMICONDUCTOR PACKAGE AND RELATED METHODS

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE COMPRISING THE SAME

POWER CHIP PACKAGE AND POWER MODULE

Semiconductor Device and Method for Fabricating a Semiconductor Device

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

BGA STIM PACKAGE ARCHITECTURE FOR HIGH PERFORMANCE SYSTEMS

LIGHT-EMITTING DIODE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE