Sintering

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CPC
H01L2224/8584

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/8584Sintering

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Ink printed wire bonding
- Patent number 10,483,238
- Issue date Nov 19, 2019
- STMicroelectronics S.r.l.
- Federico Giovanni Ziglioli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device by laser-induced forming and transfer of shaped m...
- Patent number 10,297,565
- Issue date May 21, 2019
- The United States of America, as represented by the Secretary of the Navy
- Scott A. Mathews
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding methods and systems incorporating metal nanoparticles
- Patent number 10,283,482
- Issue date May 7, 2019
- Lockheed Martin Corporation
- Randall Mark Stoltenberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sintered conductive matrix material on wire bond
- Patent number 9,905,502
- Issue date Feb 27, 2018
- Tessera, Inc.
- Wael Zohni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ink printed wire bonding
- Patent number 9,859,256
- Issue date Jan 2, 2018
- STMicroelectronics S.r.l.
- Federico Giovanni Ziglioli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for multi-chip structure semiconductor package
- Patent number 9,466,588
- Issue date Oct 11, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Fernando A. Santos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip assembly and process with sintering material on metal bumps
- Patent number 9,443,822
- Issue date Sep 13, 2016
- Tessera, Inc.
- Wael Zohni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor devices
- Patent number 9,087,833
- Issue date Jul 21, 2015
- Samsung Electronics Co., Ltd.
- Baik-woo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including cladded base plate
- Patent number 8,963,321
- Issue date Feb 24, 2015
- Infineon Technologies AG
- Andreas Lenniger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for multi-chip structure semiconductor package
- Patent number 8,963,305
- Issue date Feb 24, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Fernando A. Santos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low temperature bonding material comprising coated metal nanopartic...
- Patent number 8,821,676
- Issue date Sep 2, 2014
- Hitachi, Ltd.
- Yusuke Yasuda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding method and bonding material using metal particle
- Patent number 8,821,768
- Issue date Sep 2, 2014
- Hitachi, Ltd.
- Yusuke Yasuda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor module comprising an insert
- Patent number 8,587,116
- Issue date Nov 19, 2013
- Infineon Technologies AG
- Olaf Hohlfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection element for a semiconductor component and method for pro...
- Patent number 8,581,371
- Issue date Nov 12, 2013
- Infineon Technologies AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermoelectric application for waste heat recovery from semiconduct...
- Patent number 8,552,283
- Issue date Oct 8, 2013
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Ercan Mehmet Dede
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Semiconductor device including cladded base plate
- Patent number 8,519,532
- Issue date Aug 27, 2013
- Infineon Technologies AG
- Andreas Lenniger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module having an insert and method for producing a se...
- Patent number 8,446,726
- Issue date May 21, 2013
- Infineon Technologies AG
- Ralf Schloerke
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for fabricating a circuit substrate assembly and a power ele...
- Patent number 8,298,867
- Issue date Oct 30, 2012
- Infineon Technologies AG
- Olaf Hohlfeld
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low temperature bonding material comprising metal particles and bon...
- Patent number 7,955,411
- Issue date Jun 7, 2011
- Hitachi, Ltd.
- Yusuke Yasuda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE WITH STACKED CONDUCTIVE LAYERS AND RELATED MET...
- Publication number 20240128215
- Publication date Apr 18, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Takashi NOMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ARRANGEMENT AND METHOD FOR FORMING A SINTERED CONTACT CONNECTION
- Publication number 20230369284
- Publication date Nov 16, 2023
- Pac Tech - Packaging Technologies GmbH
- RICARDO GEELHAAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPERATURE-STABLE COMPOSITE OF A STRANDED WIRE HAVING A CONTACT PAD
- Publication number 20230318207
- Publication date Oct 5, 2023
- Heraeus Nexensos GmbH
- Matthias MUZIOL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE COMPRISING A SEMICONDUCTOR AND COMPRISING A SH...
- Publication number 20220302072
- Publication date Sep 22, 2022
- DANFOSS SILICON POWER GMBH
- André Bastos Abibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND METHOD FOR MANUFA...
- Publication number 20210366788
- Publication date Nov 25, 2021
- Mitsubishi Electric Corporation
- Yosuke NAKATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INK PRINTED WIRE BONDING
- Publication number 20180114778
- Publication date Apr 26, 2018
- STMicroelectronics S.r.l.
- Federico Giovanni Ziglioli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ARRANGEMENT AND METHOD FOR FORMING A CONTACT CONNECTION
- Publication number 20180047697
- Publication date Feb 15, 2018
- Pac Tech - Packaging Technologies GmbH
- Heinrich Lüdeke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP ASSEMBLY AND PROCESS WITH SINTERING MATERIAL ON METAL BUMPS
- Publication number 20150357304
- Publication date Dec 10, 2015
- Tessera, Inc.
- Wael Zohni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR MULTI-CHIP STRUCTURE SEMICONDUCTOR PACKAGE
- Publication number 20150171057
- Publication date Jun 18, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Fernando A. Santos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICES
- Publication number 20140151744
- Publication date Jun 5, 2014
- Samsung Electronics Co., Ltd.
- Baik-woo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR MULTI-CHIP STRUCTURE SEMICONDUCTOR PACKAGE
- Publication number 20140084432
- Publication date Mar 27, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Fernando A. Santos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING CLADDED BASE PLATE
- Publication number 20130134572
- Publication date May 30, 2013
- INFINEON TECHNOLOGIES AG
- Andreas Lenniger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE SINTERED LAYER FORMING COMPOSITION
- Publication number 20130119322
- Publication date May 16, 2013
- Hitachi Ltd.
- Eiichi Ide
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING CLADDED BASE PLATE
- Publication number 20130062750
- Publication date Mar 14, 2013
- INFINEON TECHNOLOGIES AG
- Andreas Lenniger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP ASSEMBLY AND PROCESS WITH SINTERING MATERIAL ON METAL BUMPS
- Publication number 20120313239
- Publication date Dec 13, 2012
- Tessera, Inc.
- Wael Zohni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW TEMPERATURE BONDING MATERIAL AND BONDING METHOD
- Publication number 20120104618
- Publication date May 3, 2012
- Yusuke Yasuda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR MODULE HAVING AN INSERT AND METHOD FOR PRODUCING A SE...
- Publication number 20120106086
- Publication date May 3, 2012
- INFINEON TECHNOLOGIES AG
- Ralf Schloerke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Module Comprising an Insert and Method for Producing...
- Publication number 20120080799
- Publication date Apr 5, 2012
- INFINEON TECHNOLOGIES AG
- Olaf Hohlfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW TEMPERATURE BONDING MATERIAL AND BONDING METHOD
- Publication number 20110204125
- Publication date Aug 25, 2011
- Yusuke Yasuda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMOELECTRIC APPLICATION FOR WASTE HEAT RECOVERY FROM SEMICONDUCT...
- Publication number 20110168223
- Publication date Jul 14, 2011
- Toyota Motor Engin, & Manufact. N.A. (TEMA)
- Ercan Mehmet DEDE
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Method for Fabricating a Circuit Substrate Assembly and a Power Ele...
- Publication number 20110053319
- Publication date Mar 3, 2011
- INFINEON TECHNOLOGIES AG
- Olaf Hohlfeld
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOW TEMPERATURE BONDING MATERIAL AND BONDING METHOD
- Publication number 20080173398
- Publication date Jul 24, 2008
- Yusuke Yasuda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE SINTERED LAYER FORMING COMPOSITION AND CONDUCTIVE COATIN...
- Publication number 20080160183
- Publication date Jul 3, 2008
- Eiichi Ide
- B22 - CASTING POWDER METALLURGY
Information Patent Application
BONDING METHOD AND BONDING MATERIAL USING METAL PARTICLE
- Publication number 20080156398
- Publication date Jul 3, 2008
- Yusuke Yasuda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Connection element for a semiconductor component and method for pro...
- Publication number 20070018338
- Publication date Jan 25, 2007
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Ink printed wire bonding

Electronic device by laser-induced forming and transfer of shaped m...

Wire bonding methods and systems incorporating metal nanoparticles

Sintered conductive matrix material on wire bond

Ink printed wire bonding

Method and apparatus for multi-chip structure semiconductor package

Flip chip assembly and process with sintering material on metal bumps

Power semiconductor devices

Semiconductor device including cladded base plate

Method and apparatus for multi-chip structure semiconductor package

Low temperature bonding material comprising coated metal nanopartic...

Bonding method and bonding material using metal particle

Semiconductor module comprising an insert

Connection element for a semiconductor component and method for pro...

Thermoelectric application for waste heat recovery from semiconduct...

Semiconductor device including cladded base plate

Semiconductor module having an insert and method for producing a se...

Method for fabricating a circuit substrate assembly and a power ele...

Low temperature bonding material comprising metal particles and bon...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE WITH STACKED CONDUCTIVE LAYERS AND RELATED MET...

CHIP ARRANGEMENT AND METHOD FOR FORMING A SINTERED CONTACT CONNECTION

TEMPERATURE-STABLE COMPOSITE OF A STRANDED WIRE HAVING A CONTACT PAD

SEMICONDUCTOR MODULE COMPRISING A SEMICONDUCTOR AND COMPRISING A SH...

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND METHOD FOR MANUFA...

INK PRINTED WIRE BONDING

CHIP ARRANGEMENT AND METHOD FOR FORMING A CONTACT CONNECTION

FLIP CHIP ASSEMBLY AND PROCESS WITH SINTERING MATERIAL ON METAL BUMPS

METHOD AND APPARATUS FOR MULTI-CHIP STRUCTURE SEMICONDUCTOR PACKAGE

POWER SEMICONDUCTOR DEVICES

METHOD AND APPARATUS FOR MULTI-CHIP STRUCTURE SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE INCLUDING CLADDED BASE PLATE

CONDUCTIVE SINTERED LAYER FORMING COMPOSITION

SEMICONDUCTOR DEVICE INCLUDING CLADDED BASE PLATE

FLIP CHIP ASSEMBLY AND PROCESS WITH SINTERING MATERIAL ON METAL BUMPS

LOW TEMPERATURE BONDING MATERIAL AND BONDING METHOD

SEMICONDUCTOR MODULE HAVING AN INSERT AND METHOD FOR PRODUCING A SE...

Semiconductor Module Comprising an Insert and Method for Producing...

LOW TEMPERATURE BONDING MATERIAL AND BONDING METHOD

THERMOELECTRIC APPLICATION FOR WASTE HEAT RECOVERY FROM SEMICONDUCT...

Method for Fabricating a Circuit Substrate Assembly and a Power Ele...

LOW TEMPERATURE BONDING MATERIAL AND BONDING METHOD

CONDUCTIVE SINTERED LAYER FORMING COMPOSITION AND CONDUCTIVE COATIN...

BONDING METHOD AND BONDING MATERIAL USING METAL PARTICLE

Connection element for a semiconductor component and method for pro...