Sintering

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CPC
H01L2224/8184

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/8184Sintering

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Sintering a nanoparticle paste for semiconductor chip join
- Patent number 12,199,059
- Issue date Jan 14, 2025
- International Business Machines Corporation
- Katsuyuki Sakuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low pressure sintering powder
- Patent number 12,113,039
- Issue date Oct 8, 2024
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 11,967,577
- Issue date Apr 23, 2024
- Rohm Co., Ltd.
- Yosui Futamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tapeless leadframe package with exposed integrated circuit die
- Patent number 11,916,090
- Issue date Feb 27, 2024
- STMicroelectronics, Inc.
- Aaron Cadag
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure for semiconductor with ultra-fine pitch and...
- Patent number 11,742,316
- Issue date Aug 29, 2023
- GUANGDONG UNIVERSITY OF TECHNOLOGY
- Yu Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sintering materials and attachment methods using same
- Patent number 11,389,865
- Issue date Jul 19, 2022
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
System and method for extreme performance die attach
- Patent number 11,373,976
- Issue date Jun 28, 2022
- Rockwell Collins, Inc.
- Nathan P. Lower
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low temperature hybrid bonding structures and manufacturing method...
- Patent number 11,205,635
- Issue date Dec 21, 2021
- Shun-Ping Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly comprising hybrid interconnecting means including intermed...
- Patent number 11,011,490
- Issue date May 18, 2021
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Rabih Khazaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low pressure sintering powder
- Patent number 10,998,284
- Issue date May 4, 2021
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Die stack assembly using an edge separation structure for connectiv...
- Patent number 10,854,581
- Issue date Dec 1, 2020
- Littelfuse, Inc.
- Elmar Wisotzki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for electrical coupling and electric coupling arrangement
- Patent number 10,833,049
- Issue date Nov 10, 2020
- International Business Machines Corporation
- Thomas J. Brunschwiler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip packages with sintered interconnects formed out of pads
- Patent number 10,777,496
- Issue date Sep 15, 2020
- International Business Machines Corporation
- Thomas J. Brunschwiler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronics package having a multi-thickness conductor layer and me...
- Patent number 10,770,444
- Issue date Sep 8, 2020
- General Electric Company
- Risto Ilkka Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die stack assembly using an edge separation structure for connectiv...
- Patent number 10,734,362
- Issue date Aug 4, 2020
- Littelfuse, Inc.
- Elmar Wisotzki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Engineered polymer-based electronic materials
- Patent number 10,682,732
- Issue date Jun 16, 2020
- Alpha Assembly Solutions Inc.
- Ramakrishna Hosur Venkatagiriyappa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive paste having dilatancy, electrode connection structure i...
- Patent number 10,651,143
- Issue date May 12, 2020
- SHARP KABUSHIKI KAISHA
- Tomotoshi Satoh
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Sintered body made from silver fine particles
- Patent number 10,369,667
- Issue date Aug 6, 2019
- NAMICS CORPORATION
- Makoto Kobayashi
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Bonding structure and method for producing bonding structure
- Patent number 10,332,853
- Issue date Jun 25, 2019
- Osaka University
- Katsuaki Suganuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical shielding and interconnect for SIP modules
- Patent number 10,292,258
- Issue date May 14, 2019
- Apple Inc.
- Lan H. Hoang
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Conductive connecting member and manufacturing method of same
- Patent number 10,177,079
- Issue date Jan 8, 2019
- Furukawa Electric Co., Ltd.
- Hideo Nishikubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device and method for producing an electronic device
- Patent number 10,147,696
- Issue date Dec 4, 2018
- Osram Opto Semiconductors GmbH
- Andreas Ploessl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing metal powder
- Patent number 10,130,995
- Issue date Nov 20, 2018
- Alpha Assembly Solutions Inc.
- Nirmalya Kumar Chaki
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Electrically conductive paste, and electrically conducive connectio...
- Patent number 10,046,418
- Issue date Aug 14, 2018
- Furukawa Electric Co., Ltd.
- Shunji Masumori
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
IC package
- Patent number 10,026,684
- Issue date Jul 17, 2018
- TDK-MICRONAS GMBH
- Klaus Heberle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of bonding with silver paste
- Patent number 9,972,597
- Issue date May 15, 2018
- Hyundai Motor Company
- Kyoung-Kook Hong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sintered conductive matrix material on wire bond
- Patent number 9,905,502
- Issue date Feb 27, 2018
- Tessera, Inc.
- Wael Zohni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC package
- Patent number 9,893,005
- Issue date Feb 13, 2018
- TDK-MICRONAS GMBH
- Klaus Heberle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component module and method for manufacturing electronic...
- Patent number 9,860,989
- Issue date Jan 2, 2018
- Murata Manufacturing Co., Ltd.
- Shinya Kiyono
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structures and methods for low temperature bonding using nanoparticles
- Patent number 9,818,713
- Issue date Nov 14, 2017
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LOW PRESSURE SINTERING POWDER
- Publication number 20240413117
- Publication date Dec 12, 2024
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Application
POWER MODULE PACKAGE AND MANUFACTURE METHOD THEREOF
- Publication number 20240404958
- Publication date Dec 5, 2024
- Nexperia Technology (Shanghai) Ltd.
- Regnerus Hermannus Poelma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRAFINE-PITCH ALL-COPPER INTERCONNECT STRUCTURE AND FORMING METHO...
- Publication number 20240113068
- Publication date Apr 4, 2024
- Guangdong University of Technology
- Yu ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Joining and Insulating Power Electronic Semiconductor Components
- Publication number 20230215838
- Publication date Jul 6, 2023
- SIEMENS AKTIENGESELLSCHAFT
- Bernd Müller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230215830
- Publication date Jul 6, 2023
- Sony Semiconductor Solutions Corporation
- Mutsuo TSUJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED HEAT DISSIPATION POWER SEMICONDUCTOR MODULE AND METHOD...
- Publication number 20230187309
- Publication date Jun 15, 2023
- LX Semicon Co., Ltd.
- Deog Soo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE FOR SEMICONDUCTOR WITH ULTRA-FINE PITCH AND...
- Publication number 20220415846
- Publication date Dec 29, 2022
- Guangdong University of Technology
- Yu ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINTERING A NANOPARTICLE PASTE FOR SEMICONDUCTOR CHIP JOIN
- Publication number 20220262754
- Publication date Aug 18, 2022
- International Business Machines Corporation
- Katsuyuki Sakuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220115347
- Publication date Apr 14, 2022
- Yosui Futamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TAPELESS LEADFRAME PACKAGE WITH EXPOSED INTEGRATED CIRCUIT DIE
- Publication number 20220005857
- Publication date Jan 6, 2022
- STMICROELECTRONICS, INC.
- Aaron CADAG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW TEMPERATURE HYBRID BONDING STRUCTURES AND MANUFACTURING METHOD...
- Publication number 20210242166
- Publication date Aug 5, 2021
- SHUN-PING HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and Method for Extreme Performance Die Attach
- Publication number 20210202433
- Publication date Jul 1, 2021
- Rockwell Collins, Inc.
- Nathan P. Lower
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Stack Assembly Using An Edge Separation Structure For Connectiv...
- Publication number 20200266174
- Publication date Aug 20, 2020
- LITTELFUSE, INC.
- Elmar Wisotzki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE PASTE, ELECTRODE CONNECTION STRUCTURE, AND ELECTRODE CON...
- Publication number 20190157229
- Publication date May 23, 2019
- SHARP KABUSHIKI KAISHA
- Tomotoshi SATOH
- B22 - CASTING POWDER METALLURGY
Information Patent Application
CHIP PACKAGES WITH SINTERED INTERCONNECTS FORMED OUT OF PADS
- Publication number 20190109084
- Publication date Apr 11, 2019
- International Business Machines Corporation
- Thomas J. Brunschwiler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLY COMPRISING HYBRID INTERCONNECTING MEANS INCLUDING INTERMED...
- Publication number 20180374813
- Publication date Dec 27, 2018
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Rabih KHAZAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC PACKAGE
- Publication number 20180130729
- Publication date May 10, 2018
- TDK - Micronas GmbH
- Klaus HEBERLE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES AND METHODS FOR LOW TEMPERATURE BONDING USING NANOPARTICLES
- Publication number 20170194279
- Publication date Jul 6, 2017
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POROUS METALLIC FILM AS DIE ATTACH AND INTERCONNECT
- Publication number 20170092611
- Publication date Mar 30, 2017
- Infineon Technologies Americas Corp.
- Gretchen Adema
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT MODULE AND METHOD FOR MANUFACTURING ELECTRONIC...
- Publication number 20160338201
- Publication date Nov 17, 2016
- Murata Manufacturing Co., Ltd.
- Shinya KIYONO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH SILICON VIAS AND THERMOCOMPRESSION BONDING USING INKJET-PRI...
- Publication number 20160148840
- Publication date May 26, 2016
- The Regents of the University of California
- Vivek Subramanian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINTERED BODY OF SILVER FINE PARTICLE
- Publication number 20150041974
- Publication date Feb 12, 2015
- NAMICS CORPORATION
- Makoto Kobayashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20140361445
- Publication date Dec 11, 2014
- Norihiro NASHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20140246783
- Publication date Sep 4, 2014
- Fuji Electric Co., Ltd.
- Tatsuo NISHIZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP PACKAGE FOR DRAM WITH TWO UNDERFILL MATERIALS
- Publication number 20140141568
- Publication date May 22, 2014
- Invensas Corporation
- Kazuo Sakuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Porous Metallic Film as Die Attach and Interconnect
- Publication number 20130256894
- Publication date Oct 3, 2013
- INTERNATIONAL RECTIFIER CORPORATION
- Gretchen Adema
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR BUILDING VERTICAL PILLAR INTERCONNECT
- Publication number 20130196499
- Publication date Aug 1, 2013
- FlipChip International, LLC
- Guy F. Burgess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Group III-V and Group IV Composite Diode
- Publication number 20130175542
- Publication date Jul 11, 2013
- INTERNATIONAL RECTIFIER CORPORATION
- Michael A. Bríere
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP PACKAGE FOR DRAM WITH TWO UNDERFILL MATERIALS
- Publication number 20130134602
- Publication date May 30, 2013
- Invensas Corporation
- Kazuo Sakuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL NANOINK AND PROCESS FOR PRODUCING THE METAL NANOINK, AND DIE...
- Publication number 20130001280
- Publication date Jan 3, 2013
- SHINKAWA LTD.
- Toru MAEDA
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Sintering a nanoparticle paste for semiconductor chip join

Low pressure sintering powder

Semiconductor device and method for manufacturing the same

Tapeless leadframe package with exposed integrated circuit die

Interconnect structure for semiconductor with ultra-fine pitch and...

Sintering materials and attachment methods using same

System and method for extreme performance die attach

Low temperature hybrid bonding structures and manufacturing method...

Assembly comprising hybrid interconnecting means including intermed...

Low pressure sintering powder

Die stack assembly using an edge separation structure for connectiv...

Method for electrical coupling and electric coupling arrangement

Chip packages with sintered interconnects formed out of pads

Electronics package having a multi-thickness conductor layer and me...

Die stack assembly using an edge separation structure for connectiv...

Engineered polymer-based electronic materials

Conductive paste having dilatancy, electrode connection structure i...

Sintered body made from silver fine particles

Bonding structure and method for producing bonding structure

Vertical shielding and interconnect for SIP modules

Conductive connecting member and manufacturing method of same

Electronic device and method for producing an electronic device

Method for manufacturing metal powder

Electrically conductive paste, and electrically conducive connectio...

IC package

Method of bonding with silver paste

Sintered conductive matrix material on wire bond

IC package

Electronic component module and method for manufacturing electronic...

Structures and methods for low temperature bonding using nanoparticles

Patents Applicationslast 30 patents

LOW PRESSURE SINTERING POWDER

POWER MODULE PACKAGE AND MANUFACTURE METHOD THEREOF

ULTRAFINE-PITCH ALL-COPPER INTERCONNECT STRUCTURE AND FORMING METHO...

Joining and Insulating Power Electronic Semiconductor Components

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

DOUBLE-SIDED HEAT DISSIPATION POWER SEMICONDUCTOR MODULE AND METHOD...

INTERCONNECT STRUCTURE FOR SEMICONDUCTOR WITH ULTRA-FINE PITCH AND...

SINTERING A NANOPARTICLE PASTE FOR SEMICONDUCTOR CHIP JOIN

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

TAPELESS LEADFRAME PACKAGE WITH EXPOSED INTEGRATED CIRCUIT DIE

LOW TEMPERATURE HYBRID BONDING STRUCTURES AND MANUFACTURING METHOD...

System and Method for Extreme Performance Die Attach

Die Stack Assembly Using An Edge Separation Structure For Connectiv...

CONDUCTIVE PASTE, ELECTRODE CONNECTION STRUCTURE, AND ELECTRODE CON...

CHIP PACKAGES WITH SINTERED INTERCONNECTS FORMED OUT OF PADS

ASSEMBLY COMPRISING HYBRID INTERCONNECTING MEANS INCLUDING INTERMED...

IC PACKAGE

STRUCTURES AND METHODS FOR LOW TEMPERATURE BONDING USING NANOPARTICLES

POROUS METALLIC FILM AS DIE ATTACH AND INTERCONNECT

ELECTRONIC COMPONENT MODULE AND METHOD FOR MANUFACTURING ELECTRONIC...

THROUGH SILICON VIAS AND THERMOCOMPRESSION BONDING USING INKJET-PRI...

SINTERED BODY OF SILVER FINE PARTICLE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR...

FLIP CHIP PACKAGE FOR DRAM WITH TWO UNDERFILL MATERIALS

Porous Metallic Film as Die Attach and Interconnect

METHOD FOR BUILDING VERTICAL PILLAR INTERCONNECT

Group III-V and Group IV Composite Diode

FLIP CHIP PACKAGE FOR DRAM WITH TWO UNDERFILL MATERIALS

METAL NANOINK AND PROCESS FOR PRODUCING THE METAL NANOINK, AND DIE...