Sintering

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CPC
H01L2224/27505

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/27505Sintering

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Low pressure sintering powder
- Patent number 12,113,039
- Issue date Oct 8, 2024
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Semiconductor device, sintered metal sheet, and method for manufact...
- Patent number 11,437,338
- Issue date Sep 6, 2022
- Hitachi, Ltd.
- Tomohisa Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sintering materials and attachment methods using same
- Patent number 11,389,865
- Issue date Jul 19, 2022
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Low pressure sintering powder
- Patent number 10,998,284
- Issue date May 4, 2021
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Power inverter module with reduced inductance
- Patent number 10,937,747
- Issue date Mar 2, 2021
- GM Global Technology Operations LLC
- Marko Jaksic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 10,879,205
- Issue date Dec 29, 2020
- Kyocera Corporation
- Masakazu Fujiwara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 10,840,206
- Issue date Nov 17, 2020
- Kyocera Corporation
- Masakazu Fujiwara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,784,226
- Issue date Sep 22, 2020
- Shinko Electric Industries Co., Ltd.
- Kei Murayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ag underlayer-attached metallic member, Ag underlayer-attached insu...
- Patent number 10,734,297
- Issue date Aug 4, 2020
- Mitsubishi Materials Corporation
- Shuji Nishimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded air cavity packages and methods for the production thereof
- Patent number 10,529,638
- Issue date Jan 7, 2020
- NXP USA, INC.
- Audel Sanchez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,504,749
- Issue date Dec 10, 2019
- Mitsubishi Materials Corporation
- Shuji Nishimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a circuit board element
- Patent number 10,426,040
- Issue date Sep 24, 2019
- AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT
- Johannes Stahr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded air cavity packages and methods for the production thereof
- Patent number 10,396,006
- Issue date Aug 27, 2019
- NXP USA, INC.
- Audel Sanchez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier and clip each having sinterable, solidified paste for conne...
- Patent number 10,347,566
- Issue date Jul 9, 2019
- Heraeus Deutschland GmbH & Co. KG
- Michael Benedikt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module assembly with dual substrates and reduced inductance
- Patent number 10,283,475
- Issue date May 7, 2019
- GM Global Technology Operations LLC
- Terence G. Ward
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded air cavity packages and methods for the production thereof
- Patent number 10,199,302
- Issue date Feb 5, 2019
- NXP USA, INC.
- Audel Sanchez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for permanently bonding wafers by a connecting layer by mean...
- Patent number 10,163,681
- Issue date Dec 25, 2018
- EV Group E. Thallner GmbH
- Klaus Martinschitz
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing metal powder
- Patent number 10,130,995
- Issue date Nov 20, 2018
- Alpha Assembly Solutions Inc.
- Nirmalya Kumar Chaki
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Mixed alloy solder paste
- Patent number 10,118,260
- Issue date Nov 6, 2018
- Indium Corporation
- Hongwen Zhang
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Laser sintered interconnections between die
- Patent number 9,935,079
- Issue date Apr 3, 2018
- NXP USA, INC.
- Chee Seng Foong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices with semiconductor die attached with sintered me...
- Patent number 9,875,987
- Issue date Jan 23, 2018
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mixed alloy solder paste
- Patent number 9,636,784
- Issue date May 2, 2017
- Indium Corporation
- Hongwen Zhang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 9,627,350
- Issue date Apr 18, 2017
- Mitsubishi Electric Corporation
- Yasunari Hino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices with semiconductor die coupled to a thermally co...
- Patent number 9,589,860
- Issue date Mar 7, 2017
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding material and bonding body, and bonding method
- Patent number 9,486,879
- Issue date Nov 8, 2016
- Dowa Electronics Materials Co., Ltd.
- Satoru Kurita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder joint structure, power module, power module substrate with h...
- Patent number 9,355,986
- Issue date May 31, 2016
- Mitsubishi Materials Corporation
- Shuji Nishimoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing a high-temperature and temperature-change resi...
- Patent number 9,287,232
- Issue date Mar 15, 2016
- Danfoss Silicon Power GmbH
- Mathias Kock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit arrangement for a thermally conductive chip assembly and a...
- Patent number 9,224,666
- Issue date Dec 29, 2015
- Rhode & Schwarz GmbH & Co. KG
- Robert Ziegler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solderless die attach to a direct bonded aluminum substrate
- Patent number 9,111,782
- Issue date Aug 18, 2015
- IXYS Corporation
- Nathan Zommer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mixed alloy solder paste
- Patent number 9,017,446
- Issue date Apr 28, 2015
- Indium Corporation
- Hongwen Zhang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
LOW PRESSURE SINTERING POWDER
- Publication number 20240413117
- Publication date Dec 12, 2024
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Application
SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE
- Publication number 20240213207
- Publication date Jun 27, 2024
- Panasonic Holdings Corporation
- Masato MAEDE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, SINTERED METAL SHEET, AND METHOD FOR MANUFACT...
- Publication number 20210265298
- Publication date Aug 26, 2021
- Hitachi, Ltd
- Tomohisa SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER INVERTER MODULE WITH REDUCED INDUCTANCE
- Publication number 20210020588
- Publication date Jan 21, 2021
- GM GLOBAL TECHNOLOGY OPERATIONS LLC
- Marko Jaksic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHEET FOR SINTERING BONDING, SHEET FOR SINTERING BONDING WITH BASE...
- Publication number 20200294952
- Publication date Sep 17, 2020
- Nitto Denko Corporation
- Ryota MITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHEET FOR SINTERING BONDING AND SHEET FOR SINTERING BONDING WITH BA...
- Publication number 20200294961
- Publication date Sep 17, 2020
- Nitto Denko Corporation
- Ryota MITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20190393181
- Publication date Dec 26, 2019
- Kyocera Corporation
- Masakazu FUJIWARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190371757
- Publication date Dec 5, 2019
- Shinko Electric Industries Co., Ltd.
- Kei Murayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED AIR CAVITY PACKAGES AND METHODS FOR THE PRODUCTION THEREOF
- Publication number 20190051571
- Publication date Feb 14, 2019
- NXP USA, Inc.
- AUDEL SANCHEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED AIR CAVITY PACKAGES AND METHODS FOR THE PRODUCTION THEREOF
- Publication number 20190043774
- Publication date Feb 7, 2019
- NXP USA, Inc.
- AUDEL SANCHEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE ADHESIVE LAYER FOR SEMICONDUCTOR DEVICES AND PACKAGES
- Publication number 20180342463
- Publication date Nov 29, 2018
- Intel Corporation
- Taylor GAINES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR JOINING ELECTRONIC PART USING A JOINING SILVER SHEET
- Publication number 20180331063
- Publication date Nov 15, 2018
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Satoru KURITA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE ADHESIVE LAYER FOR SEMICONDUCTOR DEVICES AND PACKAGES
- Publication number 20180190593
- Publication date Jul 5, 2018
- Intel Corporation
- Taylor GAINES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE ASSEMBLY WITH DUAL SUBSTRATES AND REDUCED INDUCTANCE
- Publication number 20180166410
- Publication date Jun 14, 2018
- GM GLOBAL TECHNOLOGY OPERATIONS LLC
- Terence G. Ward
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE JOINING MATERIAL AND CONDUCTIVE JOINING STRUCTURE WHICH...
- Publication number 20180033760
- Publication date Feb 1, 2018
- NIPPON STEEL & SUMITOMO METAL CORPORATION
- Shinji ISHIKAWA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL SINTERING PREPARATION AND THE USE THEREOF FOR THE CONNECTING...
- Publication number 20170326640
- Publication date Nov 16, 2017
- Heraeus Deutschland GmbH & Co. KG
- Wolfgang SCHMITT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Manufacturing Metal Powder
- Publication number 20170028477
- Publication date Feb 2, 2017
- ALPHA METALS, INC.
- Rohan P. Setna
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20160322327
- Publication date Nov 3, 2016
- Mitsubishi Electric Corporation
- Yasunari HINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JOINING SILVER SHEET, METHOD FOR MANUFACTURING SAME, AND METHOD FOR...
- Publication number 20160254243
- Publication date Sep 1, 2016
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Satoru KURITA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER LEVEL PACKAGE WITH REDISTRIBUTION LAYER FORMED WITH METALLIC...
- Publication number 20150200177
- Publication date Jul 16, 2015
- Chee Seng Foong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF JOINING SILVER PASTE
- Publication number 20150187725
- Publication date Jul 2, 2015
- Hyundai Motor Company
- Kyoung-Kook Hong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAYERED COMPOSITE OF A SUBSTRATE FILM AND OF A LAYER ASSEMBLY COMPR...
- Publication number 20140234649
- Publication date Aug 21, 2014
- Thomas Kalich
- B32 - LAYERED PRODUCTS
Information Patent Application
Solderless Die Attach to a Direct Bonded Aluminum Substrate
- Publication number 20140225267
- Publication date Aug 14, 2014
- IXYS Corporation
- Nathan Zommer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PERMANENTLY BONDING WAFERS BY A CONNECTING LAYER BY MEAN...
- Publication number 20140154867
- Publication date Jun 5, 2014
- EV Group E. Thallner GmbH
- Klaus Martinschitz
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solderless Die Attach to a Direct Bonded Aluminum Substrate
- Publication number 20130328204
- Publication date Dec 12, 2013
- IXYS Corporation
- Nathan Zommer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING MATERIAL AND BONDING BODY, AND BONDING METHOD
- Publication number 20130323529
- Publication date Dec 5, 2013
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Satoru Kurita
- B32 - LAYERED PRODUCTS
Information Patent Application
CIRCUIT ARRANGEMENT FOR A THERMALLY CONDUCTIVE CHIP ASSEMBLY AND A...
- Publication number 20130277846
- Publication date Oct 24, 2013
- ROHDE & SCHWARZ GMBH & CO. KG
- Robert Ziegler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT PLACEMENT ON FLEXIBLE AND/OR STRETCHABLE SUBSTRATES
- Publication number 20130133822
- Publication date May 30, 2013
- Nederlandse Organisatie voor Toegepastnatuurwetenschappelijk Onderzoek TNO
- Marinus Marc Koetse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING DIFFUSION SOLDERED LAYER ON SINTERED...
- Publication number 20130049204
- Publication date Feb 28, 2013
- INFINEON TECHNOLOGIES AG
- Niels Oeschler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR ATTACHING A METAL SURFACE TO A CARRIER, A METHOD FOR ATT...
- Publication number 20130001803
- Publication date Jan 3, 2013
- INFINEON TECHNOLOGIES AG
- Manfred Mengel
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Low pressure sintering powder

Semiconductor device, sintered metal sheet, and method for manufact...

Sintering materials and attachment methods using same

Low pressure sintering powder

Power inverter module with reduced inductance

Method of manufacturing semiconductor device

Method of manufacturing semiconductor device

Semiconductor device

Ag underlayer-attached metallic member, Ag underlayer-attached insu...

Molded air cavity packages and methods for the production thereof

Semiconductor device

Method for producing a circuit board element

Molded air cavity packages and methods for the production thereof

Carrier and clip each having sinterable, solidified paste for conne...

Power module assembly with dual substrates and reduced inductance

Molded air cavity packages and methods for the production thereof

Method for permanently bonding wafers by a connecting layer by mean...

Method for manufacturing metal powder

Mixed alloy solder paste

Laser sintered interconnections between die

Electronic devices with semiconductor die attached with sintered me...

Mixed alloy solder paste

Method for manufacturing semiconductor device

Electronic devices with semiconductor die coupled to a thermally co...

Bonding material and bonding body, and bonding method

Solder joint structure, power module, power module substrate with h...

Method for producing a high-temperature and temperature-change resi...

Circuit arrangement for a thermally conductive chip assembly and a...

Solderless die attach to a direct bonded aluminum substrate

Mixed alloy solder paste

Patents Applicationslast 30 patents

LOW PRESSURE SINTERING POWDER

SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE, SINTERED METAL SHEET, AND METHOD FOR MANUFACT...

POWER INVERTER MODULE WITH REDUCED INDUCTANCE

SHEET FOR SINTERING BONDING, SHEET FOR SINTERING BONDING WITH BASE...

SHEET FOR SINTERING BONDING AND SHEET FOR SINTERING BONDING WITH BA...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

MOLDED AIR CAVITY PACKAGES AND METHODS FOR THE PRODUCTION THEREOF

MOLDED AIR CAVITY PACKAGES AND METHODS FOR THE PRODUCTION THEREOF

CONDUCTIVE ADHESIVE LAYER FOR SEMICONDUCTOR DEVICES AND PACKAGES

METHOD FOR JOINING ELECTRONIC PART USING A JOINING SILVER SHEET

CONDUCTIVE ADHESIVE LAYER FOR SEMICONDUCTOR DEVICES AND PACKAGES

POWER MODULE ASSEMBLY WITH DUAL SUBSTRATES AND REDUCED INDUCTANCE

CONDUCTIVE JOINING MATERIAL AND CONDUCTIVE JOINING STRUCTURE WHICH...

METAL SINTERING PREPARATION AND THE USE THEREOF FOR THE CONNECTING...

Method for Manufacturing Metal Powder

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

JOINING SILVER SHEET, METHOD FOR MANUFACTURING SAME, AND METHOD FOR...

WAFER LEVEL PACKAGE WITH REDISTRIBUTION LAYER FORMED WITH METALLIC...

METHOD OF JOINING SILVER PASTE

LAYERED COMPOSITE OF A SUBSTRATE FILM AND OF A LAYER ASSEMBLY COMPR...

Solderless Die Attach to a Direct Bonded Aluminum Substrate

METHOD FOR PERMANENTLY BONDING WAFERS BY A CONNECTING LAYER BY MEAN...

Solderless Die Attach to a Direct Bonded Aluminum Substrate

BONDING MATERIAL AND BONDING BODY, AND BONDING METHOD

CIRCUIT ARRANGEMENT FOR A THERMALLY CONDUCTIVE CHIP ASSEMBLY AND A...

COMPONENT PLACEMENT ON FLEXIBLE AND/OR STRETCHABLE SUBSTRATES

SEMICONDUCTOR DEVICE INCLUDING DIFFUSION SOLDERED LAYER ON SINTERED...

METHOD FOR ATTACHING A METAL SURFACE TO A CARRIER, A METHOD FOR ATT...