Sintering

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H01L2224/8384

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/8384Sintering

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor module with a first substrate, a second substrate and...
- Patent number 12,125,817
- Issue date Oct 22, 2024
- Danfoss Silicon Power GmbH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low pressure sintering powder
- Patent number 12,113,039
- Issue date Oct 8, 2024
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Semiconductor device having an antenna arranged over an active main...
- Patent number 12,094,842
- Issue date Sep 17, 2024
- Infineon Technologies AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid nanosilver/liquid metal ink composition and uses thereof
- Patent number 12,096,554
- Issue date Sep 17, 2024
- Xerox Corporation
- Naveen Chopra
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Bonding structure production method and bonding structure
- Patent number 12,094,850
- Issue date Sep 17, 2024
- Osaka University
- Katsuaki Suganuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thick-silver layer interface
- Patent number 12,094,801
- Issue date Sep 17, 2024
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with different types of semiconductor dies attached to a fl...
- Patent number 12,080,660
- Issue date Sep 3, 2024
- MACOM Technology Solutions Holdings, Inc.
- Xikun Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 12,057,375
- Issue date Aug 6, 2024
- Rohm Co., Ltd.
- Maiko Hatano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sinterable films and pastes and methods for use thereof
- Patent number 12,042,883
- Issue date Jul 23, 2024
- Henkel AG & Co. KGaA
- Pukun Zhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pressure sintering device and method for manufacturing an electroni...
- Patent number 12,046,576
- Issue date Jul 23, 2024
- Danfoss Silicon Power GmbH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded body and method for manufacturing same
- Patent number 12,030,125
- Issue date Jul 9, 2024
- Mitsui Mining & Smelting Co., Ltd.
- Kei Anai
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Systems and methods for fabricating silicon die stacks for electron...
- Patent number 12,027,489
- Issue date Jul 2, 2024
- Ukyo Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 12,021,043
- Issue date Jun 25, 2024
- Fuji Electric Co., Ltd.
- Hiroaki Hokazono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages using package in package systems and related...
- Patent number 11,984,424
- Issue date May 14, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Inpil Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,923,270
- Issue date Mar 5, 2024
- Kabushiki Kaisha Toshiba
- Tatsuya Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and production method thereof, and semiconduc...
- Patent number 11,901,341
- Issue date Feb 13, 2024
- Mitsubishi Electric Corporation
- Yosuke Nakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing bonded object and semiconductor device and cop...
- Patent number 11,890,681
- Issue date Feb 6, 2024
- Resonac Corporation
- Yuki Kawana
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Manufacturing method of power semiconductor device, power semicondu...
- Patent number 11,894,337
- Issue date Feb 6, 2024
- Mitsubishi Electric Corporation
- Keisuke Kawamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Member connection method
- Patent number 11,887,960
- Issue date Jan 30, 2024
- Resonac Corporation
- Motohiro Negishi
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Power semiconductor device and substrate with dimple region
- Patent number 11,842,968
- Issue date Dec 12, 2023
- Mitsubishi Electric Corporation
- Kohei Yabuta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inverter
- Patent number 11,837,523
- Issue date Dec 5, 2023
- Tesla, Inc.
- Wenjun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sintering press for sintering electronic components on a substrate
- Patent number 11,820,095
- Issue date Nov 21, 2023
- AMX—AUTOMATRIX S.R.L.
- Nicola Schivalocchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display device
- Patent number 11,810,886
- Issue date Nov 7, 2023
- Japan Display Inc.
- Masanobu Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor element bonding structure, method for producing semic...
- Patent number 11,810,885
- Issue date Nov 7, 2023
- Waseda University
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal particle aggregates, method for producing same, paste-like me...
- Patent number 11,801,556
- Issue date Oct 31, 2023
- Mitsubishi Materials Corporation
- Tomohiko Yamaguchi
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Connecting clip design for pressure sintering
- Patent number 11,804,421
- Issue date Oct 31, 2023
- Semiconductor Components Industries, LLC
- Atapol Prajuckamol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermosetting resin composition, semiconductor device, and electric...
- Patent number 11,784,153
- Issue date Oct 10, 2023
- Kyocera Corporation
- Masakazu Fujiwara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process and device for low-temperature pressure sintering
- Patent number 11,776,932
- Issue date Oct 3, 2023
- Danfoss Silicon Power GmbH
- Ronald Eisele
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method for forming a pre-connection layer on a surface of a connect...
- Patent number 11,749,568
- Issue date Sep 5, 2023
- Infineon Technologies AG
- Sebastian Nordhoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die-substrate assemblies having sinter-bonded backside via structur...
- Patent number 11,749,639
- Issue date Sep 5, 2023
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LOW PRESSURE SINTERING POWDER
- Publication number 20240413117
- Publication date Dec 12, 2024
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Application
SINTER BONDING SHEET
- Publication number 20240413116
- Publication date Dec 12, 2024
- Nitto Denko Corporation
- Ryota MITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THICK-SILVER LAYER INTERFACE
- Publication number 20240404914
- Publication date Dec 5, 2024
- NXP USA, Inc.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR FABRICATING SILICON DIE STACKS FOR ELECTRON...
- Publication number 20240371819
- Publication date Nov 7, 2024
- NANO-X IMAGING LTD.
- Ukyo JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING PASTE, BONDING LAYER, BONDED BODY, AND METHOD FOR PRODUCING...
- Publication number 20240321806
- Publication date Sep 26, 2024
- MITSUBISHI MATERIALS CORPORATION
- Koutarou Iwata
- B22 - CASTING POWDER METALLURGY
Information Patent Application
POWER MODULE, ELECTRICAL DEVICE AND METHOD FOR PRODUCING A POWER MO...
- Publication number 20240304587
- Publication date Sep 12, 2024
- SIEMENS AKTIENGESELLSCHAFT
- Claus Florian Wagner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINTERING FILM FRAMES AND RELATED METHODS
- Publication number 20240304596
- Publication date Sep 12, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Dukyong LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF INTEGRATING POWER MODULE WITH IN...
- Publication number 20240304603
- Publication date Sep 12, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jinchang ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE ARRANGEMENT
- Publication number 20240304538
- Publication date Sep 12, 2024
- INFINEON TECHNOLOGIES AG
- Christoph Bayer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS AND MANUFACTURING METHOD
- Publication number 20240290741
- Publication date Aug 29, 2024
- Advantest Corporation
- Shinji SUGATANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240266310
- Publication date Aug 8, 2024
- Mitsubishi Electric Corporation
- Tsuyoshi TANIGAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES USING PACKAGE IN PACKAGE SYSTEMS AND RELATED...
- Publication number 20240258268
- Publication date Aug 1, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Inpil YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY, METHOD FOR MANUFACTURING SAME, AND A...
- Publication number 20240243095
- Publication date Jul 18, 2024
- CHONGQING ALPHA AND OMEGA SEMICONDUCTOR LIMITED
- LIMIN WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE FOR A VEHICLE
- Publication number 20240194576
- Publication date Jun 13, 2024
- ROBERT BOSCH GmbH
- Juergen Zipprich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making a Semiconductor Package w...
- Publication number 20240194629
- Publication date Jun 13, 2024
- STATS ChipPAC Pte Ltd.
- YongMoo Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDE COOLED POWER MODULES
- Publication number 20240178126
- Publication date May 30, 2024
- Virginia Tech Intellectual Properties, Inc.
- Guo-Quan LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE, POWER SUPPLY CIRCUIT, AND CHIP
- Publication number 20240170439
- Publication date May 23, 2024
- Huawei Technologies Co., Ltd
- Fengqun Lang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JOINT STRUCTURE
- Publication number 20240149340
- Publication date May 9, 2024
- Mitsui Mining and Smelting Co., Ltd.
- Shinichi YAMAUCHI
- B22 - CASTING POWDER METALLURGY
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240105561
- Publication date Mar 28, 2024
- Kabushiki Kaisha Toshiba
- Fumiyoshi KAWASHIRO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE
- Publication number 20240079384
- Publication date Mar 7, 2024
- Mitsubishi Electric Corporation
- Yosuke NAKATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF INTEGRATING POWER MODULE WITH IN...
- Publication number 20240072008
- Publication date Feb 29, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jinchang ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240055392
- Publication date Feb 15, 2024
- Fuji Electric Co., Ltd.
- Takashi SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE
- Publication number 20240055422
- Publication date Feb 15, 2024
- Fuji Electric Co., Ltd.
- Tatsuo NISHIZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE
- Publication number 20240055391
- Publication date Feb 15, 2024
- Fuji Electric Co., Ltd.
- Tatsuo NISHIZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR FABRICATING SILICON DIE STACKS FOR ELECTRON...
- Publication number 20240047415
- Publication date Feb 8, 2024
- NANO-X IMAGING LTD
- Ukyo JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR APPLYING A SINTERING FORCE VIA A COMPRESSIBLE FILM
- Publication number 20240030181
- Publication date Jan 25, 2024
- ASMPT SINGAPORE PTE. LTD
- Jiapei DING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier With Electronic Components and Thermally Conducti...
- Publication number 20240014142
- Publication date Jan 11, 2024
- Mike Morianz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230369276
- Publication date Nov 16, 2023
- Fuji Electric Co., Ltd.
- Takashi SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILVER SINTERED MOLYBDENUM (SSM) PACKAGING FOR POWER SEMICONDUCTOR...
- Publication number 20230352372
- Publication date Nov 2, 2023
- McMaster University
- Yuhang Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND MOLDING PRESS MACHINE
- Publication number 20230343611
- Publication date Oct 26, 2023
- Mitsubishi Electric Corporation
- Kiyohiro UCHIDA
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor module with a first substrate, a second substrate and...

Low pressure sintering powder

Semiconductor device having an antenna arranged over an active main...

Hybrid nanosilver/liquid metal ink composition and uses thereof

Bonding structure production method and bonding structure

Thick-silver layer interface

Package with different types of semiconductor dies attached to a fl...

Semiconductor device and method for manufacturing semiconductor device

Sinterable films and pastes and methods for use thereof

Pressure sintering device and method for manufacturing an electroni...

Bonded body and method for manufacturing same

Systems and methods for fabricating silicon die stacks for electron...

Semiconductor device and method for manufacturing semiconductor device

Semiconductor packages using package in package systems and related...

Semiconductor device

Semiconductor package and production method thereof, and semiconduc...

Method for producing bonded object and semiconductor device and cop...

Manufacturing method of power semiconductor device, power semicondu...

Member connection method

Power semiconductor device and substrate with dimple region

Inverter

Sintering press for sintering electronic components on a substrate

Display device

Semiconductor element bonding structure, method for producing semic...

Metal particle aggregates, method for producing same, paste-like me...

Connecting clip design for pressure sintering

Thermosetting resin composition, semiconductor device, and electric...

Process and device for low-temperature pressure sintering

Method for forming a pre-connection layer on a surface of a connect...

Die-substrate assemblies having sinter-bonded backside via structur...

Patents Applicationslast 30 patents

LOW PRESSURE SINTERING POWDER

SINTER BONDING SHEET

THICK-SILVER LAYER INTERFACE

SYSTEMS AND METHODS FOR FABRICATING SILICON DIE STACKS FOR ELECTRON...

BONDING PASTE, BONDING LAYER, BONDED BODY, AND METHOD FOR PRODUCING...

POWER MODULE, ELECTRICAL DEVICE AND METHOD FOR PRODUCING A POWER MO...

SINTERING FILM FRAMES AND RELATED METHODS

SEMICONDUCTOR DEVICE AND METHOD OF INTEGRATING POWER MODULE WITH IN...

SEMICONDUCTOR MODULE ARRANGEMENT

SEMICONDUCTOR APPARATUS AND MANUFACTURING METHOD

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGES USING PACKAGE IN PACKAGE SYSTEMS AND RELATED...

SEMICONDUCTOR DEVICE ASSEMBLY, METHOD FOR MANUFACTURING SAME, AND A...

POWER MODULE FOR A VEHICLE

Semiconductor Device and Method of Making a Semiconductor Package w...

DOUBLE-SIDE COOLED POWER MODULES

POWER MODULE, POWER SUPPLY CIRCUIT, AND CHIP

JOINT STRUCTURE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF INTEGRATING POWER MODULE WITH IN...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE

METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE

SYSTEMS AND METHODS FOR FABRICATING SILICON DIE STACKS FOR ELECTRON...

APPARATUS FOR APPLYING A SINTERING FORCE VIA A COMPRESSIBLE FILM

Component Carrier With Electronic Components and Thermally Conducti...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SILVER SINTERED MOLYBDENUM (SSM) PACKAGING FOR POWER SEMICONDUCTOR...

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND MOLDING PRESS MACHINE