Sintering

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CPC
H01L2224/11505

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/11505Sintering

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Sintering materials and attachment methods using same
- Patent number 11,389,865
- Issue date Jul 19, 2022
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
System and method for extreme performance die attach
- Patent number 11,373,976
- Issue date Jun 28, 2022
- Rockwell Collins, Inc.
- Nathan P. Lower
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming of bump structure
- Patent number 11,329,018
- Issue date May 10, 2022
- International Business Machines Corporation
- Takashi Hisada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly comprising hybrid interconnecting means including intermed...
- Patent number 11,011,490
- Issue date May 18, 2021
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Rabih Khazaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a solder bump structure
- Patent number 10,930,609
- Issue date Feb 23, 2021
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 10,741,413
- Issue date Aug 11, 2020
- Mitsubishi Electric Corporation
- Norihisa Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing chip-on-chip structure comprising sinterted...
- Patent number 10,734,346
- Issue date Aug 4, 2020
- ELPIS TECHNOLOGIES INC.
- Richard S. Graf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device and method of fabricating the same
- Patent number 10,700,249
- Issue date Jun 30, 2020
- SEOUL VIOSYS CO., LTD.
- Chang Yeon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a solder bump structure
- Patent number 10,692,829
- Issue date Jun 23, 2020
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive paste having dilatancy, electrode connection structure i...
- Patent number 10,651,143
- Issue date May 12, 2020
- SHARP KABUSHIKI KAISHA
- Tomotoshi Satoh
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Expanded head pillar for bump bonds
- Patent number 10,636,758
- Issue date Apr 28, 2020
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a solder bump structure
- Patent number 10,607,956
- Issue date Mar 31, 2020
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-on-chip structure and methods of manufacture
- Patent number 10,340,241
- Issue date Jul 2, 2019
- International Business Machines Corporation
- Richard S. Graf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device and method of fabricating the same
- Patent number 10,283,685
- Issue date May 7, 2019
- SEOUL VIOSYS CO., LTD.
- Chang Yeon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transfer substrate for forming metal wiring and method for forming...
- Patent number 10,256,113
- Issue date Apr 9, 2019
- Tanaka Kikinzoku Kogyo K.K.
- Toshinori Ogashiwa
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method of manufacturing electronic component module and electronic...
- Patent number 10,177,108
- Issue date Jan 8, 2019
- Murata Manufacturing Co., Ltd.
- Shinya Kiyono
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Method for manufacturing metal powder
- Patent number 10,130,995
- Issue date Nov 20, 2018
- Alpha Assembly Solutions Inc.
- Nirmalya Kumar Chaki
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Formation of solder and copper interconnect structures and associat...
- Patent number 10,068,863
- Issue date Sep 4, 2018
- Intel Corporation
- Edward R. Prack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming pillar bumps on semiconductor wafers
- Patent number 9,831,201
- Issue date Nov 28, 2017
- Guy F. Burgess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for building vertical pillar interconnect
- Patent number 9,627,254
- Issue date Apr 18, 2017
- Guy F. Burgess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing electronic component module and electronic...
- Patent number 9,532,495
- Issue date Dec 27, 2016
- Murata Manufacturing Co., Ltd.
- Shinya Kiyono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation of solder and copper interconnect structures and associat...
- Patent number 9,508,667
- Issue date Nov 29, 2016
- Intel Corporation
- Edward R. Prack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die terminal
- Patent number 8,970,031
- Issue date Mar 3, 2015
- HSIO Technologies, LLC
- James Rathburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump, method for forming the bump, and method for mounting substrat...
- Patent number 8,962,471
- Issue date Feb 24, 2015
- Tanaka Kikinzoku Kogyo K.K.
- Toshinori Ogashiwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of mounting part of semiconductor light emitti...
- Patent number 8,609,444
- Issue date Dec 17, 2013
- Toyoda Gosei Co., Ltd.
- Satoshi Wada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 8,546,185
- Issue date Oct 1, 2013
- Tokyo Electron Limited
- Ken Nakao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump, method for forming the bump, and method for mounting substrat...
- Patent number 8,492,894
- Issue date Jul 23, 2013
- Tanaka Kikinzoku Kogyo K.K.
- Toshinori Ogashiwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of patterning resin insulation laye...
- Patent number 8,405,218
- Issue date Mar 26, 2013
- Denso Corporation
- Manabu Tomisaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and methods of manufacturing the same
- Patent number 8,129,840
- Issue date Mar 6, 2012
- Samsung Electronics Co., Ltd.
- Chajea Jo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic element that includes multilayered bonding interface bet...
- Patent number 7,960,834
- Issue date Jun 14, 2011
- Murata Manufacturing Co., Ltd.
- Tatsuya Funaki
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
SOLDER PASTE, METHOD FOR FORMING SOLDER BUMPS, AND METHOD FOR MANUF...
- Publication number 20240297135
- Publication date Sep 5, 2024
- Resonac Corporation
- Yoshinori EJIRI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230215830
- Publication date Jul 6, 2023
- Sony Semiconductor Solutions Corporation
- Mutsuo TSUJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE PILLAR, METHOD FOR MANUFACTURING THE SAME, AND METHOD FO...
- Publication number 20230041521
- Publication date Feb 9, 2023
- DIC CORPORATION
- Ryota Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICALLY CONDUCTIVE PILLAR, BONDING STRUCTURE, ELECTRONIC DEVIC...
- Publication number 20220293543
- Publication date Sep 15, 2022
- DIC CORPORATION
- Ryota YAMAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and Method for Extreme Performance Die Attach
- Publication number 20210202433
- Publication date Jul 1, 2021
- Rockwell Collins, Inc.
- Nathan P. Lower
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING OF BUMP STRUCTURE
- Publication number 20210125950
- Publication date Apr 29, 2021
- International Business Machines Corporation
- Takashi Hisada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXPANDED HEAD PILLAR FOR BUMP BONDS
- Publication number 20200258856
- Publication date Aug 13, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. KODURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A SOLDER BUMP STRUCTURE
- Publication number 20200152590
- Publication date May 14, 2020
- International Business Machines Corporation
- Toyohiro Aoki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF FORMING A SOLDER BUMP STRUCTURE
- Publication number 20200058612
- Publication date Feb 20, 2020
- International Business Machines Corporation
- Toyohiro Aoki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20200058517
- Publication date Feb 20, 2020
- MITSUBISHI ELECTRIC CORPORATION
- Norihisa MATSUMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE PASTE, ELECTRODE CONNECTION STRUCTURE, AND ELECTRODE CON...
- Publication number 20190157229
- Publication date May 23, 2019
- SHARP KABUSHIKI KAISHA
- Tomotoshi SATOH
- B22 - CASTING POWDER METALLURGY
Information Patent Application
ASSEMBLY COMPRISING HYBRID INTERCONNECTING MEANS INCLUDING INTERMED...
- Publication number 20180374813
- Publication date Dec 27, 2018
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Rabih KHAZAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20180204991
- Publication date Jul 19, 2018
- Seoul Viosys Co., Ltd.
- Chang Yeon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20170279020
- Publication date Sep 28, 2017
- Seoul Viosys Co., Ltd.
- Chang Yeon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMATION OF SOLDER AND COPPER INTERCONNECT STRUCTURES AND ASSOCIAT...
- Publication number 20170033068
- Publication date Feb 2, 2017
- Intel Corporation
- Edward R. Prack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-ON-CHIP STRUCTURE AND METHODS OF MANUFACTURE
- Publication number 20160365328
- Publication date Dec 15, 2016
- International Business Machines Corporation
- Richard S. Graf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING PILLAR BUMPS ON SEMICONDUCTOR WAFERS
- Publication number 20160268223
- Publication date Sep 15, 2016
- Flipchip International LLC
- Guy F. Burgess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMATION OF SOLDER AND COPPER INTERCONNECT STRUCTURES AND ASSOCIAT...
- Publication number 20160181217
- Publication date Jun 23, 2016
- Intel Corporation
- Edward R. Prack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP, METHOD FOR FORMING THE BUMP, AND METHOD FOR MOUNTING SUBSTRAT...
- Publication number 20140295619
- Publication date Oct 2, 2014
- Tanaka Kikinzoku Kogyo K.K.
- TOSHINORI OGASHIWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFER SUBSTRATE FOR FORMING METAL WIRING LINE AND METHOD FOR FOR...
- Publication number 20140262003
- Publication date Sep 18, 2014
- Tanaka Kikinzoku Kogyo K.K.
- Toshinori Ogashiwa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING ELECTRONIC COMPONENT MODULE AND ELECTRONIC...
- Publication number 20140049922
- Publication date Feb 20, 2014
- MURATA MANUFACTURING CO., LTD.
- Shinya KIYONO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR BUILDING VERTICAL PILLAR INTERCONNECT
- Publication number 20130196499
- Publication date Aug 1, 2013
- FlipChip International, LLC
- Guy F. Burgess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solder Bump Bonding In Semiconductor Package Using Solder Balls Hav...
- Publication number 20130043573
- Publication date Feb 21, 2013
- Advanced Analogic Technologies (Hong Kong) Limited
- Richard K. Williams
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20120252164
- Publication date Oct 4, 2012
- TOKYO ELECTRON LIMITED
- Ken NAKAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE TERMINAL
- Publication number 20120049342
- Publication date Mar 1, 2012
- HSIO TECHNOLOGIES, LLC
- James Rathburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus of manufacturing functionally gradient material
- Publication number 20110284158
- Publication date Nov 24, 2011
- FUJIFILM CORPORATION
- Manabu Katsumura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BUMP, METHOD FOR FORMING THE BUMP, AND METHOD FOR MOUNTING SUBSTRAT...
- Publication number 20110272802
- Publication date Nov 10, 2011
- Toshinori Ogashiwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF PATTERNNING RESIN INSULATION LAY...
- Publication number 20110198733
- Publication date Aug 18, 2011
- DENSO CORPORATION
- Manabu Tomisaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND STRUCTURES FOR A VERTICAL PILLAR INTERCONNECT
- Publication number 20110003470
- Publication date Jan 6, 2011
- FlipChip International, LLC
- Guy F. Burgess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing method of mounting part of semiconductor light emitti...
- Publication number 20100219444
- Publication date Sep 2, 2010
- Toyoda Gosei Co., Ltd.
- Satoshi Wada
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Sintering materials and attachment methods using same

System and method for extreme performance die attach

Forming of bump structure

Assembly comprising hybrid interconnecting means including intermed...

Method of forming a solder bump structure

Semiconductor device and method for manufacturing semiconductor device

Method of manufacturing chip-on-chip structure comprising sinterted...

Light emitting device and method of fabricating the same

Method of forming a solder bump structure

Conductive paste having dilatancy, electrode connection structure i...

Expanded head pillar for bump bonds

Method of forming a solder bump structure

Chip-on-chip structure and methods of manufacture

Light emitting device and method of fabricating the same

Transfer substrate for forming metal wiring and method for forming...

Method of manufacturing electronic component module and electronic...

Method for manufacturing metal powder

Formation of solder and copper interconnect structures and associat...

Methods for forming pillar bumps on semiconductor wafers

Method for building vertical pillar interconnect

Method of manufacturing electronic component module and electronic...

Formation of solder and copper interconnect structures and associat...

Semiconductor die terminal

Bump, method for forming the bump, and method for mounting substrat...

Manufacturing method of mounting part of semiconductor light emitti...

Method for manufacturing semiconductor device

Bump, method for forming the bump, and method for mounting substrat...

Semiconductor device and method of patterning resin insulation laye...

Semiconductor package and methods of manufacturing the same

Electronic element that includes multilayered bonding interface bet...

Patents Applicationslast 30 patents

SOLDER PASTE, METHOD FOR FORMING SOLDER BUMPS, AND METHOD FOR MANUF...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

CONDUCTIVE PILLAR, METHOD FOR MANUFACTURING THE SAME, AND METHOD FO...

ELECTRICALLY CONDUCTIVE PILLAR, BONDING STRUCTURE, ELECTRONIC DEVIC...

System and Method for Extreme Performance Die Attach

FORMING OF BUMP STRUCTURE

EXPANDED HEAD PILLAR FOR BUMP BONDS

METHOD OF FORMING A SOLDER BUMP STRUCTURE

METHOD OF FORMING A SOLDER BUMP STRUCTURE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

CONDUCTIVE PASTE, ELECTRODE CONNECTION STRUCTURE, AND ELECTRODE CON...

ASSEMBLY COMPRISING HYBRID INTERCONNECTING MEANS INCLUDING INTERMED...

LIGHT EMITTING DEVICE AND METHOD OF FABRICATING THE SAME

LIGHT EMITTING DEVICE AND METHOD OF FABRICATING THE SAME

FORMATION OF SOLDER AND COPPER INTERCONNECT STRUCTURES AND ASSOCIAT...

CHIP-ON-CHIP STRUCTURE AND METHODS OF MANUFACTURE

METHODS FOR FORMING PILLAR BUMPS ON SEMICONDUCTOR WAFERS

FORMATION OF SOLDER AND COPPER INTERCONNECT STRUCTURES AND ASSOCIAT...

BUMP, METHOD FOR FORMING THE BUMP, AND METHOD FOR MOUNTING SUBSTRAT...

TRANSFER SUBSTRATE FOR FORMING METAL WIRING LINE AND METHOD FOR FOR...

METHOD OF MANUFACTURING ELECTRONIC COMPONENT MODULE AND ELECTRONIC...

METHOD FOR BUILDING VERTICAL PILLAR INTERCONNECT

Solder Bump Bonding In Semiconductor Package Using Solder Balls Hav...

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DIE TERMINAL

Method and apparatus of manufacturing functionally gradient material

BUMP, METHOD FOR FORMING THE BUMP, AND METHOD FOR MOUNTING SUBSTRAT...

SEMICONDUCTOR DEVICE AND METHOD OF PATTERNNING RESIN INSULATION LAY...

METHODS AND STRUCTURES FOR A VERTICAL PILLAR INTERCONNECT

Manufacturing method of mounting part of semiconductor light emitti...