Sintering

Industry

CPC
H01L2224/8084

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/8084Sintering

Industries

Patents Grantslast 30 patents

Information Patent Grant
Package having bonding layers
- Patent number 12,046,579
- Issue date Jul 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and manufacturing method of reconstructed wafer
- Patent number 11,063,022
- Issue date Jul 13, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level packaging method
- Patent number 10,580,823
- Issue date Mar 3, 2020
- United Microelectronics Corp.
- Sheng Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer bonding process and structure
- Patent number 10,128,209
- Issue date Nov 13, 2018
- Taiwan Semiconductor Manufacturing Company
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer bonding process and structure
- Patent number 9,425,155
- Issue date Aug 23, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silver-to-silver bonded IC package having two ceramic substrates ex...
- Patent number 9,082,879
- Issue date Jul 14, 2015
- IXYS Corporation
- Nathan Zommer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated semiconductor chip with external contact pads and manu...
- Patent number 8,338,231
- Issue date Dec 25, 2012
- Infineon Technologies AG
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for the manufacture of electrical contacts upon semiconduct...
- Patent number 4,281,236
- Issue date Jul 28, 1981
- BBC Brown, Boveri & Co Limited
- Martin vonAllmen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
POWER ELECTRONIC SYSTEM INCLUDING A SEMICONDUCTOR MODULE AND A COOL...
- Publication number 20240387325
- Publication date Nov 21, 2024
- INFINEON TECHNOLOGIES AG
- Andreas Grassmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE WITH BALANCED CURRENT FLOW
- Publication number 20240379526
- Publication date Nov 14, 2024
- Navitas Semiconductor Limited
- Oseob Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE
- Publication number 20240347512
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230411344
- Publication date Dec 21, 2023
- KIOXIA Corporation
- Hiroaki ASHIDATE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION STRUCTURAL BODY AND SEMICONDUCTOR DEVICE
- Publication number 20230317650
- Publication date Oct 5, 2023
- Shinko Electric Industries Co., Ltd.
- Mitsuhiro AIZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC CIRCUIT MODULE
- Publication number 20230268278
- Publication date Aug 24, 2023
- ROBERT BOSCH GmbH
- Jan Homoth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PACKAGING METHOD
- Publication number 20180323227
- Publication date Nov 8, 2018
- United Microelectronics Corp.
- Sheng Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Bonding Process and Structure
- Publication number 20150243611
- Publication date Aug 27, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Silver-To-Silver Bonded IC Package Having Two Ceramic Substrates Ex...
- Publication number 20150162304
- Publication date Jun 11, 2015
- IXYS Corporation
- Nathan Zommer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20150130085
- Publication date May 14, 2015
- Mitsubishi Electric Corporation
- Yasunari HINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILVER-TO-SILVER BONDED IC PACKAGE HAVING TWO CERAMIC SUBSTRATES EX...
- Publication number 20140183716
- Publication date Jul 3, 2014
- IXYS Corporation
- Nathan Zommer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Encapsulated Semiconductor Chip with External Contact Pads and Manu...
- Publication number 20110233754
- Publication date Sep 29, 2011
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Package having bonding layers

Package and manufacturing method of reconstructed wafer

Wafer level packaging method

Wafer bonding process and structure

Wafer bonding process and structure

Silver-to-silver bonded IC package having two ceramic substrates ex...

Encapsulated semiconductor chip with external contact pads and manu...

Process for the manufacture of electrical contacts upon semiconduct...

Patents Applicationslast 30 patents

POWER ELECTRONIC SYSTEM INCLUDING A SEMICONDUCTOR MODULE AND A COOL...

POWER MODULE WITH BALANCED CURRENT FLOW

PACKAGE

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

CONNECTION STRUCTURAL BODY AND SEMICONDUCTOR DEVICE

ELECTRONIC CIRCUIT MODULE

WAFER LEVEL PACKAGING METHOD

Wafer Bonding Process and Structure

Silver-To-Silver Bonded IC Package Having Two Ceramic Substrates Ex...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SILVER-TO-SILVER BONDED IC PACKAGE HAVING TWO CERAMIC SUBSTRATES EX...

Encapsulated Semiconductor Chip with External Contact Pads and Manu...