Sintering

Industry

CPC
H01L2224/8284

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/8284Sintering

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method to electrically connect chip with top connectors using 3D pr...
- Patent number 12,046,575
- Issue date Jul 23, 2024
- IO Tech Group Ltd.
- Michael Zenou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for contacting and packetising a semiconductor chip
- Patent number 11,749,638
- Issue date Sep 5, 2023
- Technische Universität Chemnitz
- Johannes Rudolph
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and fixture for chip attachment to physical objects
- Patent number 10,847,384
- Issue date Nov 24, 2020
- Palo Alto Research Center Incorporated
- Ping Mei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for the fluidic assembly of micro-LEDs utilizing...
- Patent number 10,535,640
- Issue date Jan 14, 2020
- eLux Inc.
- Jong-Jan Lee
- G02 - OPTICS
Information Patent Grant
Method to neutralize incorrectly oriented printed diodes
- Patent number 10,412,833
- Issue date Sep 10, 2019
- NthDegree Technologies Worldwide Inc.
- Richard Austin Blanchard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Discrete device mounted on substrate
- Patent number 9,899,339
- Issue date Feb 20, 2018
- Texas Instruments Incorporated
- Matthew David Romig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a fan-out WLP with package
- Patent number 9,337,165
- Issue date May 10, 2016
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out microelectronic unit WLP having interconnects comprising a...
- Patent number 8,890,304
- Issue date Nov 18, 2014
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assemblies and methods of forming electronic assemblies
- Patent number 8,523,071
- Issue date Sep 3, 2013
- intelliPaper, LLC
- Andrew DePaula
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package unit and stacking structure thereof
- Patent number 8,502,378
- Issue date Aug 6, 2013
- Industrial Technology Research Institute
- Yin-Po Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic element that includes multilayered bonding interface bet...
- Patent number 7,960,834
- Issue date Jun 14, 2011
- Murata Manufacturing Co., Ltd.
- Tatsuya Funaki
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
Method for Contacting and Packetising a Semiconductor Chip
- Publication number 20220181291
- Publication date Jun 9, 2022
- TECHNISCHE UNIVERSITAT CHEMNITZ
- Johannes Rudolph
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD FOR MANUFACTURING DISPLAY DEVICE
- Publication number 20220102604
- Publication date Mar 31, 2022
- SAMSUNG DISPLAY CO., LTD.
- Young Rag DO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO ELECTRICALLY CONNECT CHIP WITH TOP CONNECTORS USING 3D PR...
- Publication number 20200350275
- Publication date Nov 5, 2020
- IO TECH GROUP LTD.
- Michael Zenou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and Associated Methods
- Publication number 20140345924
- Publication date Nov 27, 2014
- Nokia Corporation
- Mark Lee ALLEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISCRETE DEVICE MOUNTED ON SUBSTRATE
- Publication number 20140124939
- Publication date May 8, 2014
- TEXAS INSTRUMENTS INCORPORATED
- Matthew David Romig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT WLP WITH PACKAGE
- Publication number 20120313253
- Publication date Dec 13, 2012
- Tessera, Inc.
- Yoshikuni Nakadaira
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE UNIT AND STACKING STRUCTURE THEREOF
- Publication number 20120091581
- Publication date Apr 19, 2012
- Industrial Technology Research Institute
- Yin-Po Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Assemblies and Methods of Forming Electronic Assemblies
- Publication number 20120081868
- Publication date Apr 5, 2012
- Andrew DePaula
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Electronic Element, Electronic Element Device Using the Same, and M...
- Publication number 20090039507
- Publication date Feb 12, 2009
- Murata Manufacturing Co., Ltd.
- Tatsuya Funaki
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method to electrically connect chip with top connectors using 3D pr...

Method for contacting and packetising a semiconductor chip

Method and fixture for chip attachment to physical objects

System and method for the fluidic assembly of micro-LEDs utilizing...

Method to neutralize incorrectly oriented printed diodes

Discrete device mounted on substrate

Method for manufacturing a fan-out WLP with package

Fan-out microelectronic unit WLP having interconnects comprising a...

Electronic assemblies and methods of forming electronic assemblies

Package unit and stacking structure thereof

Electronic element that includes multilayered bonding interface bet...

Patents Applicationslast 30 patents

Method for Contacting and Packetising a Semiconductor Chip

DISPLAY DEVICE AND METHOD FOR MANUFACTURING DISPLAY DEVICE

METHOD TO ELECTRICALLY CONNECT CHIP WITH TOP CONNECTORS USING 3D PR...

Apparatus and Associated Methods

DISCRETE DEVICE MOUNTED ON SUBSTRATE

FAN-OUT WLP WITH PACKAGE

PACKAGE UNIT AND STACKING STRUCTURE THEREOF

Electronic Assemblies and Methods of Forming Electronic Assemblies

Electronic Element, Electronic Element Device Using the Same, and M...