Skew reduction or using delay lines

Industry

CPC
H05K1/0248

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/0248Skew reduction or using delay lines

Industries

Patents Grantslast 30 patents

Information Patent Grant
Bend compensation for conductive traces on printed circuit boards
- Patent number 12,150,240
- Issue date Nov 19, 2024
- Amphenol Corporation
- Michael Rowlands
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resetting different pair skew of printed circuit board traces
- Patent number 12,137,518
- Issue date Nov 5, 2024
- Dell Products L.P.
- Sandor Farkas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reducing timing skew in a circuit path
- Patent number 12,041,713
- Issue date Jul 16, 2024
- Teradyne, Inc.
- Jan Paul Antonie van der Wagt
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Low dielectric substrate for high-speed millimeter-wave communication
- Patent number 12,035,461
- Issue date Jul 9, 2024
- Shin-Etsu Chemical Co., Ltd.
- Toshio Shiobara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microstrip delay matching using printed dielectric material
- Patent number 11,991,819
- Issue date May 21, 2024
- Dell Products L.P.
- Bhyrav Mutnury
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low dielectric substrate for high-speed millimeter-wave communication
- Patent number 11,974,389
- Issue date Apr 30, 2024
- Shin-Etsu Chemical Co., Ltd.
- Toshio Shiobara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Composite materials including filled hollow glass filaments
- Patent number 11,765,825
- Issue date Sep 19, 2023
- International Business Machines Corporation
- Matthew S. Doyle
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Slow wave structure for millimeter wave antennas
- Patent number 11,715,889
- Issue date Aug 1, 2023
- Intel Corporation
- Zhichao Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low dielectric substrate for high-speed millimeter-wave communication
- Patent number 11,678,432
- Issue date Jun 13, 2023
- Shin-Etsu Chemical Co., Ltd.
- Toshio Shiobara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bend compensation for conductive traces on printed circuit boards
- Patent number 11,665,814
- Issue date May 30, 2023
- Amphenol Corporation
- Michael Rowlands
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacked transmission line
- Patent number 11,369,020
- Issue date Jun 21, 2022
- Invensas LLC
- Shaowu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Asymmetric differential via stubs for skew compensation
- Patent number 11,343,905
- Issue date May 24, 2022
- Hewlett Packard Enterprise Development LP
- Hyunjun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for near-end crosstalk reduction
- Patent number 11,304,289
- Issue date Apr 12, 2022
- DY4 SYSTEMS, INC.
- Robert C. Sullivan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for providing an electrical connection and printed circuit b...
- Patent number 11,219,119
- Issue date Jan 4, 2022
- Advantest Corporation
- Sylvia Ehrler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Prepregs and laminates having homogeneous dielectric properties
- Patent number 11,116,078
- Issue date Sep 7, 2021
- Tarun Amla
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Slow wave structure for millimeter wave antennas
- Patent number 11,095,045
- Issue date Aug 17, 2021
- Intel Corporation
- Zhichao Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Terminal device
- Patent number 11,083,079
- Issue date Aug 3, 2021
- Mitsubishi Electric Corporation
- Hidenori Ishibashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Asymmetric dual bend skew compensation for reducing differential mo...
- Patent number 11,057,987
- Issue date Jul 6, 2021
- Cisco Technology, Inc.
- Jianquan Lou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Information handling system comprising a processor coupled to a boa...
- Patent number 11,026,321
- Issue date Jun 1, 2021
- Dell Products L.P.
- Umesh Chandra
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and storage device including printed circuit...
- Patent number 11,006,517
- Issue date May 11, 2021
- Samsung Electronics Co., Ltd.
- Joon Ki Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Differential signal traces including a solder mask disposed thereon
- Patent number 10,973,117
- Issue date Apr 6, 2021
- FCI USA LLC
- Benjamin Reed Staudt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer transmission line plate
- Patent number 10,957,964
- Issue date Mar 23, 2021
- SHOWA DENKO MATERIALS CO., LTD.
- Takao Tanigawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Differential trace pair system
- Patent number 10,897,813
- Issue date Jan 19, 2021
- Dell Products L.P.
- Umesh Chandra
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and storage device including printed circuit...
- Patent number 10,750,610
- Issue date Aug 18, 2020
- Samsung Electronics Co., Ltd.
- Joon Ki Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Differential line time skew compensation for high data rate receivers
- Patent number 10,681,802
- Issue date Jun 9, 2020
- International Business Machines Corporation
- Troy J. Beukema
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Prepregs and laminates having homogeneous dielectric properties
- Patent number 10,582,614
- Issue date Mar 3, 2020
- Isola USA Corp.
- Tarun Amla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Skew-resistant multi-wire channel
- Patent number 10,573,998
- Issue date Feb 25, 2020
- KANDOU LABS, S.A.
- Amin Shokrollahi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Circuit board
- Patent number 10,575,396
- Issue date Feb 25, 2020
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Ryosuke Shiozaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer transmission line plate
- Patent number 10,506,705
- Issue date Dec 10, 2019
- Hitachi Chemical Company, Ltd.
- Yuusuke Kondou
- B32 - LAYERED PRODUCTS
Information Patent Grant
Stubbed differential trace pair system
- Patent number 10,499,492
- Issue date Dec 3, 2019
- Dell Products L.P.
- Umesh Chandra
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
DE-SKEWING DIFFERENTIAL SIGNALS
- Publication number 20240380371
- Publication date Nov 14, 2024
- Dell Products L.P.
- BHYRAV M. MUTNURY
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
STRIP LINE DELAY MATCHING USING PRINTED DIELECTRIC MATERIAL
- Publication number 20240098886
- Publication date Mar 21, 2024
- Dell Products L.P.
- Sandor Farkas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICROSTRIP DELAY MATCHING USING PRINTED DIELECTRIC MATERIAL
- Publication number 20240098883
- Publication date Mar 21, 2024
- Dell Products L.P.
- Bhyrav Mutnury
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESETTING DIFFERENT PAIR SKEW OF PRINTED CIRCUIT BOARD TRACES
- Publication number 20230345626
- Publication date Oct 26, 2023
- Dell Products L.P.
- Sandor FARKAS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BEND COMPENSATION FOR CONDUCTIVE TRACES ON PRINTED CIRCUIT BOARDS
- Publication number 20230254966
- Publication date Aug 10, 2023
- Amphenol Corporation
- Michael Rowlands
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOW DIELECTRIC SUBSTRATE FOR HIGH-SPEED MILLIMETER-WAVE COMMUNICATION
- Publication number 20230247759
- Publication date Aug 3, 2023
- Shin-Etsu Chemical Co., Ltd.
- Toshio SHIOBARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOW DIELECTRIC SUBSTRATE FOR HIGH-SPEED MILLIMETER-WAVE COMMUNICATION
- Publication number 20220248526
- Publication date Aug 4, 2022
- Shin-Etsu Chemical Co., Ltd.
- Toshio SHIOBARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SLOW WAVE STRUCTURE FOR MILLIMETER WAVE ANTENNAS
- Publication number 20220037803
- Publication date Feb 3, 2022
- Intel Corporation
- Zhichao Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASYMMETRIC DIFFERENTIAL VIA STUBS FOR SKEW COMPENSATION
- Publication number 20210274648
- Publication date Sep 2, 2021
- Cray Inc.
- Hyunjun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BEND COMPENSATION FOR CONDUCTIVE TRACES ON PRINTED CIRCUIT BOARDS
- Publication number 20210227683
- Publication date Jul 22, 2021
- Amphenol Corporation
- Michael Rowlands
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD, ELECTRONIC CIRCUIT, DETERMINING METHOD OF WIR...
- Publication number 20210185805
- Publication date Jun 17, 2021
- NEC Corporation
- Kazuhiro Kashiwakura
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PRINTED CIRCUIT BOARD AND STORAGE DEVICE INCLUDING PRINTED CIRCUIT...
- Publication number 20200344876
- Publication date Oct 29, 2020
- Samsung Electronics Co., Ltd.
- Joon Ki PAEK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Prepregs and Laminates Having Homogeneous Dielectric Properties
- Publication number 20200315007
- Publication date Oct 1, 2020
- Isola USA Corp.
- Tarun Amla
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ASYMMETRIC DUAL BEND SKEW COMPENSATION FOR REDUCING DIFFERENTIAL MO...
- Publication number 20200267833
- Publication date Aug 20, 2020
- Cisco Technology, Inc.
- Jianquan Lou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIFFERENTIAL TRACE PAIR SYSTEM
- Publication number 20200092986
- Publication date Mar 19, 2020
- Dell Products L.P.
- Umesh Chandra
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SLOW WAVE STRUCTURE FOR MILLIMETER WAVE ANTENNAS
- Publication number 20200014122
- Publication date Jan 9, 2020
- Intel Corporation
- Zhichao Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND STORAGE DEVICE INCLUDING PRINTED CIRCUIT...
- Publication number 20190373714
- Publication date Dec 5, 2019
- Samsung Electronics Co., Ltd.
- Joon Ki PAEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING SAME
- Publication number 20190357350
- Publication date Nov 21, 2019
- NEC Corporation
- Kazuhiro Kashiwakura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIFFERENTIAL SIGNAL TRACES
- Publication number 20190335578
- Publication date Oct 31, 2019
- FCI USA LLC
- Benjamin Reed Staudt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TERMINAL DEVICE
- Publication number 20190306969
- Publication date Oct 3, 2019
- Mitsubishi Electric Corporation
- Hidenori ISHIBASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITE MATERIALS INCLUDING FILLED HOLLOW GLASS FILAMENTS
- Publication number 20190141832
- Publication date May 9, 2019
- International Business Machines Corporation
- Matthew S. Doyle
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SKEW-RESISTANT MULTI-WIRE CHANNEL
- Publication number 20190123489
- Publication date Apr 25, 2019
- Kandou Labs, SA
- Amin Shokrollahi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCING TIMING SKEW IN A CIRCUIT PATH
- Publication number 20190069394
- Publication date Feb 28, 2019
- Teradyne, Inc.
- Jan Paul Antonie van der Wagt
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ADJUSTING SIGNAL TIMING
- Publication number 20190066757
- Publication date Feb 28, 2019
- Teradyne, Inc.
- Jan Paul Antonie van der Wagt
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
NOVEL HIGH SPEED SIGNAL ROUTING TOPOLOGY FOR BETTER SIGNAL QUALITY
- Publication number 20180220524
- Publication date Aug 2, 2018
- QUALCOMM Incorporated
- Yokesh SUBRAMANIAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIFFERENTIAL SIGNAL TRACES
- Publication number 20180139839
- Publication date May 17, 2018
- FCI USA LLC
- Benjamin Reed Staudt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180098420
- Publication date Apr 5, 2018
- RENESAS ELECTRONICS CORPORATION
- Shuuichi KARIYAZAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND METHOD FOR DESIGNING SAME
- Publication number 20180014402
- Publication date Jan 11, 2018
- NEC Corporation
- Kazuhiro Kashiwakura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20170064817
- Publication date Mar 2, 2017
- SAE MAGNETICS (H. K) LTD.
- Fuk Ming LAM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROPAGATION VELOCITY TUNING WITH FUNCTIONALIZED CARBON NANOMATERIAL...
- Publication number 20160323991
- Publication date Nov 3, 2016
- International Business Machines Corporation
- Dylan J. Boday
- G06 - COMPUTING CALCULATING COUNTING

Skew reduction or using delay lines

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bend compensation for conductive traces on printed circuit boards

Resetting different pair skew of printed circuit board traces

Reducing timing skew in a circuit path

Low dielectric substrate for high-speed millimeter-wave communication

Microstrip delay matching using printed dielectric material

Low dielectric substrate for high-speed millimeter-wave communication

Composite materials including filled hollow glass filaments

Slow wave structure for millimeter wave antennas

Low dielectric substrate for high-speed millimeter-wave communication

Bend compensation for conductive traces on printed circuit boards

Stacked transmission line

Asymmetric differential via stubs for skew compensation

Method and apparatus for near-end crosstalk reduction

Method for providing an electrical connection and printed circuit b...

Prepregs and laminates having homogeneous dielectric properties

Slow wave structure for millimeter wave antennas

Terminal device

Asymmetric dual bend skew compensation for reducing differential mo...

Information handling system comprising a processor coupled to a boa...

Printed circuit board and storage device including printed circuit...

Differential signal traces including a solder mask disposed thereon

Multilayer transmission line plate

Differential trace pair system

Printed circuit board and storage device including printed circuit...

Differential line time skew compensation for high data rate receivers

Prepregs and laminates having homogeneous dielectric properties

Skew-resistant multi-wire channel

Circuit board

Multilayer transmission line plate

Stubbed differential trace pair system

Patents Applicationslast 30 patents

DE-SKEWING DIFFERENTIAL SIGNALS

STRIP LINE DELAY MATCHING USING PRINTED DIELECTRIC MATERIAL

MICROSTRIP DELAY MATCHING USING PRINTED DIELECTRIC MATERIAL

RESETTING DIFFERENT PAIR SKEW OF PRINTED CIRCUIT BOARD TRACES

BEND COMPENSATION FOR CONDUCTIVE TRACES ON PRINTED CIRCUIT BOARDS

LOW DIELECTRIC SUBSTRATE FOR HIGH-SPEED MILLIMETER-WAVE COMMUNICATION

LOW DIELECTRIC SUBSTRATE FOR HIGH-SPEED MILLIMETER-WAVE COMMUNICATION

SLOW WAVE STRUCTURE FOR MILLIMETER WAVE ANTENNAS

ASYMMETRIC DIFFERENTIAL VIA STUBS FOR SKEW COMPENSATION

BEND COMPENSATION FOR CONDUCTIVE TRACES ON PRINTED CIRCUIT BOARDS

PRINTED WIRING BOARD, ELECTRONIC CIRCUIT, DETERMINING METHOD OF WIR...

PRINTED CIRCUIT BOARD AND STORAGE DEVICE INCLUDING PRINTED CIRCUIT...

Prepregs and Laminates Having Homogeneous Dielectric Properties

ASYMMETRIC DUAL BEND SKEW COMPENSATION FOR REDUCING DIFFERENTIAL MO...

DIFFERENTIAL TRACE PAIR SYSTEM

SLOW WAVE STRUCTURE FOR MILLIMETER WAVE ANTENNAS

PRINTED CIRCUIT BOARD AND STORAGE DEVICE INCLUDING PRINTED CIRCUIT...

WIRING BOARD AND METHOD FOR MANUFACTURING SAME

DIFFERENTIAL SIGNAL TRACES

TERMINAL DEVICE

COMPOSITE MATERIALS INCLUDING FILLED HOLLOW GLASS FILAMENTS

SKEW-RESISTANT MULTI-WIRE CHANNEL

REDUCING TIMING SKEW IN A CIRCUIT PATH

ADJUSTING SIGNAL TIMING

NOVEL HIGH SPEED SIGNAL ROUTING TOPOLOGY FOR BETTER SIGNAL QUALITY

DIFFERENTIAL SIGNAL TRACES

SEMICONDUCTOR DEVICE

WIRING BOARD AND METHOD FOR DESIGNING SAME

PRINTED CIRCUIT BOARD

PROPAGATION VELOCITY TUNING WITH FUNCTIONALIZED CARBON NANOMATERIAL...