Patent Application
20180014402
The present invention relates to a wiring board for transmitting high frequency signals and, in particular, to a wiring board for transmitting differential signals of a high frequency range.
With the development of an information and communication society, data communication and signal processing have come to be performed in a large capacity and at high speed, and increase in speed of transmitted signals is progressing. With the progress of increasing the signal speed, the influence of loss and delay of signals in their transmission on a wiring board has become not negligible. Accordingly, signal wirings of an electronic device such as for processing a large capacity of data at high speed need to be designed with wiring widths and wiring lengths satisfying required characteristics. On the other hand, in a wiring board for mounting semiconductor devices and the like which are compatible with the increase in capacity and speed, the number of signal wirings increases and also the wiring density does, and accordingly, the wiring design has become complicated. Therefore, in a wiring board for transmitting signals at high speed, it is desirable that flexibility in determining line widths, arrangement positions and the like of the signal wirings is secured as much as possible.
The signal transmission speed has become beyond 10 Gbps (Giga bit per second), and increasing of the speed has progressed further into giga ranges such as 28 Gbps and 56 Gbps, and accordingly, differential signal wiring has become a mainstream in signal wiring on a wiring board such as a printed circuit board. There, differential signals are transmitted in the form of two signals having opposite phases on two signal wirings. To correctly process the differential signals at an output side, it is required that the difference in delay time between the two signals having opposite phases is suppressed to be as small as possible. However, if a difference is generated between delay times of the two signals having opposite phases by the influence of electrical characteristics of signal wirings and insulating layers, a state at the output side deviates from the opposite phase state, and it accordingly may become impossible for a semiconductor device at the output side to correctly perform signal detection. Therefore, in a wiring board such as a printed circuit board for transmitting high speed differential signals, it is required that the delay difference between the two signals is suppressed.
To suppress loss and delay of a signal on a wiring board, it has been conducted to decrease the dielectric permittivity of an insulating material constituting the wiring board. Further, in a wiring board such as a printed circuit board, a glass cloth may be used as a structural material for the purpose of maintaining the mechanical strength of the board. Glass fibers in such a glass cloth have a higher relative dielectric constant than an insulating layer having a reduced dielectric permittivity.
A glass cloth used for a printed circuit board is formed by plain weaving of glass fibers bundled into some number of fiber bundles, in the longitudinal and lateral directions. In the glass cloth, gaps are generated between the fiber bundles aligned in the longitudinal and lateral directions. Accordingly, a signal transmitted on a signal wiring formed on the printed circuit board passes portions where the glass cloth is present and also portions where only an insulating resin is present. Because the relative dielectric constant is different between the glass fibers and the insulating resin in the glass cloth, there occurs a difference in the amounts of delay and loss of a signal between when passing a portion having the glass fibers and when passing a portion having only the resin. As a result, there occurs a difference in the amount of delay between signals transmitted on two differential signal wirings each passing different positions from those the other passes. When the difference in the amount of delay between two signals constituting differential signals becomes large, phase deviation between the signals becomes large, and there accordingly occurs abnormality in signal processing at the output side as a result of an increase in the insertion loss. Therefore, it is desirable that there is a technology which, in differential signal wirings formed on a printed circuit board, can suppress the difference in the amount of delay between the signals while securing flexibility in design. As a technology for suppressing signal delay in a wiring board for transmitting high speed differential signals, for example, a technology of Patent Literature 1 (PTL 1) is disclosed.
PTL 1 relates to a wiring board provided with differential signal wirings which are formed respectively as signal wirings for positive and negative signals and respectively in two different wiring layers. In the wiring board of PTL 1, differential signal wirings are formed in two different wiring layers, respectively. In the wiring board of PTL 1, two wirings together corresponding to one pair in terms of differential signal wirings are formed respectively in two different wiring layers, in a manner not to overlap with each other. In PTL 1, design values are set such that a predetermined parameter calculated on the basis of the amount of deviation between two signal wirings constituting one pair, widths of the signal wirings and the thickness of an insulating layer between the signal wirings be within a certain range. PTL 1 describes that the transmission loss of differential signals can be suppressed by designing in a manner to make the predetermined parameter satisfy a condition.
Patent Literature 2 (PTL 2) discloses a method of optimally arranging vias in a wiring board. In PTL 2, vias are arranged at respective lattice points, and whether the via arrangement is appropriate or not is determined on the basis of presence or absence of a via at each of the lattice points and wiring characteristics. PTL 2 describes that, by thus arranging vias at respective lattice points and performing evaluation, a state of excess or lack of vias can be prevented.
Further, Patent Literature 3 (PTL 3) discloses a technology which suppresses the difference in the amount of delay between differential signal wirings by appropriately setting line widths of the signal wirings. PTL 3 relates to a wiring board provided with differential signal wirings formed on an insulating layer including a glass cloth inside. In PTL 3, line widths of signal wirings are each set to be 75 to 95% of the weave interval of the glass cloth, that is, the interval of glass fibers. Thus, PTL3 describes that, by setting wiring widths to be within a certain range with reference to the weave interval of a glass cloth, change of a transmission time difference can be suppressed.
However, the technology of PTL 1 is unsatisfactory in terms of the following point. While the technology of PTL 1 takes into account average characteristics of the insulating layer intervening between the two signal wirings formed in different layers, it does not take into account a difference in characteristics between the glass cloth and the resin at portions where the wirings actually pass. Accordingly, in PTL 1, when two signal wirings are formed on respective insulating layers having different electrical characteristics in a case the electrical characteristics of the insulating layers varies laterally with position, there occurs a difference in loss and the amount of delay between the signals. The technology of PTL 2 is the one for via arrangement in lateral direction. PTL 2 also does not take into account lateral variation, with portion where the wirings actually pass, of the electrical characteristics of the insulating layer. Accordingly, similarly to PTL 1, between two signal wirings used as differential signal wirings, there may occur a difference in loss and the amount of delay due to a difference in the electrical characteristics of the insulating layer. For these reasons, the technologies of PTL 1 and PTL 2 are unsatisfactory as those for suppressing a delay difference between two signal wirings constituting differential signal wirings.
The technology of PTL 3 sets wiring widths to be within a certain range with reference to the interval of the glass cloth in the insulating layer. Accordingly, in PTL 3, the wiring widths are largely limited by the interval of the glass cloth. In signal wirings to be used as a transmission line of high frequency signals, there is also large limitation on the electrical characteristics of the signal wirings in terms of transmitting the high frequency signals in a manner of suppressing their attenuation or the like. Therefore, when the wiring widths are limited to be within a certain range, the electrical characteristics need to be secured by adjusting parameters such as thicknesses of the wirings, which may cause large limitation on the design or make it impossible to design an operable wiring board. Further, in the technology of PTL 3, no rule is prescribed for positions where wirings are to be formed, and accordingly, in some cases of respective positions of two differential signal wirings, there may occur a difference in the amount of delay between the signals due to a difference in the electrical characteristics of the insulating layer. For this reason, the technology of PTL 3 is unsatisfactory as that for suppressing a difference in delay between two signal wirings constituting differential signal wirings while securing flexibility in design.
The present invention is aimed at achieving a wiring board which can suppress a difference in the amount of delay between two signal wirings constituting differential signal wirings while securing flexibility in design.
To solve the above-described problem, a wiring board of the present invention includes a first insulation layer, a first signal wiring and a second signal wiring. The first insulating layer includes fibers having the long axis in a first direction and aligned approximately parallel to each other at a first interval, and an insulating material filling gaps between the fibers. The first signal wiring is formed approximately parallel to the first direction on the first insulating layer. The second signal wiring is formed parallel to the first signal wiring such that the interval between the first and second signal wirings be approximately an integral multiple of the first interval, and transmits a differential signal of a signal transmitted on the first signal wiring.
A wiring board fabrication method of the present invention includes forming a first signal wiring and a second signal wiring on a first insulating layer including fibers having the long axis in a first direction and aligned approximately parallel to each other at a first interval, and a first insulating material filling gaps between the fibers of the first direction. The first signal wiring is formed approximately parallel to the first direction. The second signal wiring is formed parallel to the first signal wiring such that the interval between the first and second signal wirings be approximately an integral multiple of the first interval.
A wiring board design method of the present invention includes selecting, as glass cloths to be used for a first insulating layer and a second insulating layer, a first glass cloth in which fibers having the long axis in a first direction are aligned approximately parallel to each other at a first fiber interval and a second glass cloth in which fibers having the long axis in a third direction are aligned approximately parallel to each other at a third fiber interval, in a manner to have the first and third fiber intervals coincide with each other. The wiring board design method of the present invention includes arranging, between the first and second insulating layers, a first signal wiring and a second signal wiring to transmit a differential signal of a signal transmitted on the first signal wiring. The wiring board design method of the present invention includes arranging the first and second signal wirings parallel to the first direction such that the interval between the first and second signal wirings be approximately an integral multiple of the first fiber interval.
According to the present invention, it becomes possible to suppress the difference in the amount of delay between two signal wirings constituting differential signal wirings while securing flexibility in design.
A first example embodiment of the present invention will be described in detail, with reference to drawings.
In the wiring board of the present example embodiment, the first signal wiring 2 is formed, on the first insulating layer 1, to be approximately parallel to the fibers 4 which have the long axis in the first direction and are aligned approximately parallel to each other at the first interval. Further, in parallel to the first signal wiring 2, the second signal wiring 3 for transmitting a differential signal of a signal transmitted on the first signal wiring 2 is formed such that the interval between the first signal wiring 2 and the second signal wiring 3 be approximately an integral multiple of the first interval.
By thus setting the interval between the first signal wiring 2 and the second signal wiring 3 to be an integral multiple of the first interval of the fibers 4 in the first insulating layer 1, the area ratio between the fibers 4 and the insulating material 5 becomes almost the same for portions where the first signal wiring 2 passes and portions where the second signal wiring 3 passes. Accordingly, the influences which a signal transmitted on the first signal wiring 2 and that transmitted on the second signal wiring 3 respectively receive from the electrical characteristics of the first insulating layer 1 become almost the same. As a result, it becomes possible to suppress the difference in the amount of delay between the differential signals transmitted on the first signal wiring 2 and the second signal wiring 3. Further, as the interval between the first signal wiring 2 and the second signal wiring 3 can be selected to be an integral multiple of the first interval of the fibers 4 of the first insulating layer 1, it becomes possible to suppress decrease of flexibility in the wiring design. Thus, in the wiring board of the present example embodiment, it becomes possible to suppress the difference in the amount of delay between two signal wirings constituting differential signal wirings while securing flexibility in design.
A second example embodiments of the present invention will be described in detail, with reference to drawings.
The wiring board of the present example embodiment includes a first insulating layer 11, a second insulating layer 12, a first signal wiring 13, a second signal wiring 14, a first electrode 15 and a second electrode 16. Further, above the second insulating layer 12, a third insulating layer 17 is laminated across the second electrode 16 intervening in-between.
The wiring board of the present example embodiment is a printed circuit board having a multilayer wiring structure. In the wiring board of the present example embodiment, the first insulating layer 11 and the third insulating layer 17 each function as a core material. Further, the second insulating layer 12 is a prepreg material used when forming a laminated multilayer wiring board by pressure bonding. The first signal wiring 13 and the second signal wiring 14 are signal wirings for transmitting differential signals in a high frequency range. In the present example embodiment, positive and negative signals are transmitted, respectively, on the first signal wiring 13 and the second signal wiring 14.
The first insulating layer 11 includes a glass cloth 21 and a resin 22. The first insulating layer 11 serves a function to maintain the structure and mechanical strength of the wiring board, as a core material of the wiring board.
The glass cloth 21 functions as a structural material of the first insulating layer 11. In the glass cloth 21, as shown in the upper section of
The resin 22 has an insulating property. Gaps between the glass fibers in the glass cloth 21 are filled with the resin 22. For example, epoxy resin may be used for the resin 22. The first insulating layer 11 of the present example embodiment corresponds to the first insulating layer 1 of the first example embodiment. The resin 22 of the present example embodiment corresponds to the insulating material 5. The glass fibers in the glass cloth 21 of the present example embodiment correspond to fibers 4 of the first example embodiment.
The second insulating layer 12 includes a glass cloth 23 and a resin 24. Materials of the glass cloth 23 and of the resin 24 are the same as, respectively, those of the glass cloth 21 and of the resin 22 of the first insulating layer 11. The intervals of glass fibers in the glass cloth 23 used for the second insulating layer 12 of the present example embodiment are the same as those in the glass cloth 21 of the insulating layer 11.
The first signal wiring 13 and the second signal wiring 14 are provided as wirings for transmitting high frequency differential signals. On the first signal wiring 13 and the second signal wiring 14, signals having phases opposite to each other are transmitted. The first signal wiring 13 and the second signal wiring 14 are formed to be parallel to each other. Further, the first signal wiring 13 and the second signal wiring 14 are formed with their straight portions aligned parallel to the first or second direction. The “being parallel to the first direction” means that straight portions of the signal wirings can be regarded as almost parallel to the first direction. Similarly, the “being parallel to the second direction” means that straight portions of the signal wirings can be regarded as almost parallel to the second direction. For example, when the first signal wiring 13 (parallel to the first direction) is in a state of not intersecting with any of a plurality of glass fiber bundles having the long axis in the first direction, the first signal wiring 13 can be regarded as parallel to the first direction. The interval between the first signal wiring 13 and the second signal wiring 14 is set to be a positive integral multiple of the interval of the glass fibers having the long axis in a direction parallel to the signal wirings.
The first signal wiring 13 of the present example embodiment corresponds to the first signal wiring 2 of the first example embodiment. Similarly, the second signal wiring 14 of the present example embodiment corresponds to the second signal wiring 3 of the first example embodiment.
When Pdx denotes the interval between the first signal wiring 13 and the second signal wiring 14 which are parallel to the first direction, the wiring interval Pdx is set to satisfy Pdx=NxXPg(x). Nx is a natural number. It is desirable that a value of the wiring interval Pdx calculated from the interval of the glass cloth Pg(x) has accuracy to the second or lower decimal place in millimeter, in consideration of fabrication error. Accordingly, a value of Nx denoting the rate of integral multiplication also is not required to be exactly an integer, and an Nx value whose deviation from a certain integer is at the second or lower decimal place, that is, less than 0.10 may be regarded as the integer. Therefore, hereafter, what to be called an integer multiple includes also a value in a state of being approximately an integer multiple where the value deviates from an integer by less than 0.10.
When Pdy denotes the interval between the first signal wiring 13 and the second signal wiring 14 which are parallel to the second direction, the wiring interval Pdy is set to satisfy Pdy=NxXPg(y). Ny is a natural number. Similarly to the case of the first direction, it is desirable that a value of the wiring interval Pdy calculated from the interval of the glass cloth Pg(y) has accuracy to the second or lower decimal place in millimeter. Accordingly, also a value of Ny denoting the rate of integral multiplication is not required to be exactly an integer, and an Ny value whose deviation from a certain integer is at the second or lower decimal place, that is, less than 0.10 may be regarded as the integer.
Nx and Ny may be values different from each other. When signal wirings of the first direction and those of the second direction are connected to form electrically continuous signal wirings, it is desirable to set Pdx and Pdy to be the same. By thus making the interval of wirings constant even at a bending section, it becomes possible to increase the possibility of making constant the ratio between the glass cloth and resin in every portion where the wirings pass, and thereby to decrease the difference in the amount of delay between the signals even at the bending section.
It is not necessarily required to employ entirely over the wiring board the configuration of arranging signal wirings parallel to the direction of glass fibers and at an interval equivalent to a positive integral multiple of the interval of the glass fibers. For example, the configuration is not necessarily required to be applied to global wirings such as common power supply and ground wirings and to wirings for transmitting low speed signals. Applying the structure of the present example embodiment to differential signal wirings for transmitting giga range high speed signals between semiconductor devices and electronic components mounted on a wiring board, it becomes possible to achieve an effect of suppressing the amount delay. Further, a particularly large effect can be achieved when employed in an area of a narrow wiring pitch within a wiring board. It is because the influence of electrical characteristics of the insulating layers on signal delay is larger for finer wirings.
Line widths and thicknesses of the first signal wiring 13 and of the second signal wiring 14 are set to make characteristic impedances be in accordance with a design of the wiring board. The first signal wiring 13 and the second signal wiring 14 of the present example embodiment are formed using copper. The first signal wiring 13 and the second signal wiring 14 may also be formed using another metal or formed as an alloy of a plurality of metals.
The first electrode 15 is arranged on the opposite side to the first signal wiring 13 and the second signal wiring 14, across the first insulating layer 11. The first electrode 15 is formed using copper. The first electrode 15 may also be formed using another metal or as an alloy of a plurality of metals. The first electrode 15 of the present example embodiment constitutes strip lines, together with the first signal wiring 13 and the second signal wiring 14. A GND voltage is applied to the first electrode 15. While the signal wirings are configured in the form of strip lines in the present example embodiment, they may also be configured in the form of microstrip lines.
The second electrode 16 is arranged on the opposite side to the first signal wiring 13 and the second signal wiring 14, across the second insulating layer 12. The material of the second electrode 16 is the same as that of the first electrode 15. The GND voltage is applied to the second electrode 16 of the present example embodiment. To the first electrode 15 and the second electrode 16, a power supply voltage may also be applied.
The third insulating layer 17 has the same configuration as that of the first insulating layer 11.
With reference to
The differential signal wirings 25 formed of two signal wirings at the center of
Similarly, deviation between the signal wiring for positive signals and glass fibers of the glass cloth 23 in the second insulating layer 12 is denoted by ΔDpp, and deviation between the signal wiring for negative signals and glass fibers in the second insulating layer 12 is denoted by ΔDnp. Then, it turns out that ΔDpp=ΔDnp, and accordingly, the overlap width between the signal wiring for positive signals and glass fibers in the second insulating layer 12 becomes the same as that between the signal wiring for negative signals and glass fibers in the second insulating layer 12. Therefore, the influence in electrical characteristics received from the second insulating layer 12 is almost the same for the positive and negative signals. As a result, the influence in electrical characteristics received from both the first insulating layer 11 and the second insulating layer 12 becomes the same for the positive and negative signals, and accordingly, the amount of delay becomes the same for the positive and negative signals.
Further, in the wiring board of the present example embodiment, (the difference in) the amount of delay becomes the same for the positive and negative signals when the glass cloth 21 in the first insulating layer 11 and the glass cloth 23 in the second insulating layer 12 have the same interval and their long axis directions are parallel to each other. That is, the positive and negative signals receive the same influence even when positions of glass fibers of the glass cloth 21 in the first insulating layer 11 viewed from a direction perpendicular to the wiring board are not in coincidence with those of glass fibers of the glass cloth 23 in the second insulating layer 12. In the wiring board of the present example embodiment, it is only necessary, in laminating together the first insulating layer 11 and the second insulating layer 12, to adjust directions of glass fibers in the glass cloths, and the fabrication accordingly becomes easy.
The differential signal wirings 25 formed of two signal wirings at the left side of the wiring board in
The effect of suppressing the difference in the amount of delay between positive and negative signals can be achieved even when horizontal positions of glass fibers of the first insulating layer 11 are not in coincidence with those of glass fibers of the second insulating layer 12. That is, by setting the wiring interval to be a positive integral multiple of the interval of glass fibers, the influence of deviation in a direction perpendicular to the long axis on the difference in the amount of delay between positive and negative signals becomes small. In the wiring board of the present example embodiment, when laminating together the core material and the glass fibers in fabrication of the wiring board, it is not required to exactly manage the amount of deviation of the glass fibers in a direction perpendicular to the long axis of both the glass fibers and signal wirings, and accordingly, complication of the fabrication process can be prevented.
Operation of the wiring board of the present example embodiment will be described below. In the wiring board of the present example embodiment, a high frequency positive signal is input to the first signal wiring 13 from one end of the signal wiring, transmitted to the output side and is output there. Further, a negative signal having the same frequency as and the opposite phase to the positive signal is input to the second signal wiring 14 from one end of the signal wiring, transmitted to the output side and is output there. The positive and negative signals are transmitted on strip lines configured with the first signal wiring 13, the second signal wiring 14 and the first electrode 15. The positive signal to be transmitted on the first signal wiring 13 and the negative signal to be transmitted on the second signal wiring 14 are input as differential signals, and the differential signals are processed by a semiconductor device or an electronic device connected to the output side.
A description will be given of the effect of suppressing the difference in the amount of delay between positive and negative signals when using the wiring board of the present example embodiment.
In the example of
Next, a design method of the wiring board of the present example embodiment will be described.
(Step 1) In selecting a core material and a prepreg material, that is, structural materials for the first insulating layer 11 and for the second insulating layer 12, glass cloths having the same glass cloth number are selected as glass cloths having the same characteristics.
By using glass cloths having the same glass cloth number, the interval of glass fibers becomes the same for the glass cloth 21 in the first insulating layer 11 and for the glass cloth 23 in the second insulating layer 12. That is, in the step 1, selection of glass cloths having the same glass fiber interval is performed, as glass cloths to be used for the first insulating layer 11 and for the second insulating layer 12.
(Step 2) The interval of glass cloth Pg is calculated from the glass cloth density of the selected glass cloths.
(Step 3) Based on the interval of glass cloth Pg, the wiring interval of differential signal wirings Pd is set. That is, the wiring interval Pd between the first signal wiring 13 and the second signal wiring 14 is set to be a positive integral multiple of Pg. When the glass cloths have an interval Pg(x) in one direction and a different interval Pg(y) in a direction perpendicular to the one direction, wiring intervals are set for the respective directions separately. It is desirable that a value of the wiring interval Pd calculated from the interval of glass cloth Pg is set to the second or lower decimal place in millimeter, in consideration of fabrication error.
(Step 4) A width of the wirings is determined to obtain a predetermined impedance. The predetermined impedance is determined, in accordance with required characteristics of the wiring board, on the basis of characteristics affecting the electrical characteristics of the wirings, such as the relative dielectric constant, a width of the wirings, a wiring interval and insulating layer thicknesses.
Based on a wiring interval design rule thus obtained, design of a wiring pattern to be formed on the wiring board of the present example embodiment is performed.
Glass cloth densities of
Next, a fabrication method of the wiring board of the present example embodiment will be described. First, on the first insulating layer 11, a wiring pattern for the first signal wiring 13 and the second signal wiring 14 and the first electrode 15 are formed. Straight portions of the wiring pattern for the first signal wiring 13 and the second signal wiring 14 are formed along the long axis direction of glass fibers in the glass cloth. The long axis direction of glass fibers in the glass cloth was arranged to be directed in a predetermined direction when forming the first insulating layer 11. When it is assumed to be rectangular or square, the wiring board of the present example embodiment is formed such that each of the first and second directions of the glass cloth be a direction parallel to an end surface of the wiring board. The case of assuming a rectangular or square wiring board is referred to as a case where, when a notch or the like is present on an end surface of the board, a contour of the board is estimated assuming that the notch portion is absent.
Diagonally bending portions of the signal wirings are formed such that the parallel state between the first signal wiring 13 and the second signal wiring 14 is maintained and the interval between them is kept the same as that in straight portions. Metal layers used for the first signal wiring 13, the second signal wiring 14 and the first electrode 15 are each formed by sticking a copper foil sheet on a surface of the first insulating layer 11. Alternatively, the metal layers may be deposited by sputtering. In the present example embodiment, copper is used for the metal layers. Further, the wiring pattern for the first signal wiring 13 and the second signal wiring 14 is formed by photolithography after the metal layer formation.
When forming the wiring pattern by photolithography, signal wirings parallel to a long axis of glass fibers can be formed by aligning the direction of the signal wiring with the long axis direction of the glass fibers using an alignment marker formed on the wiring board in advance. The direction alignment in the formation of signal wirings may also be performed using the contour of the wiring board.
After the formation of the wiring pattern or the like on it, the first insulating layer 11 is laminated with a prepreg material used as the second insulating layer 12 and the third insulating layer 17 connected across the prepreg material. On the third insulating layer 17, a wiring pattern and an electrode are formed similarly to on the first insulating layer 11. The number of insulating layers made of core materials to be laminated as above may be three or larger. Further, the wiring board may be that including only the first insulating layer 11.
When laminating the first insulating layer 11 with the prepreg material for the second insulating layer 12, the lamination is performed such that the axis directions of glass cloth be in coincidence between the two layers. The axis directions of glass cloth is referred to as the long axis directions of glass fibers constituting the glass cloth. Further, along each axis, the interval is the same for glass fibers in the glass cloth constituting the first insulating layer 11 and for those in the glass cloth constituting the prepreg material for the second insulating layer 12. In the present example embodiment, the design is made such that the axis directions of glass cloth can be adjusted by making adjustment using the contour.
After laminating together the first insulating layer 11, the second insulating layer 12 being a prepreg material and other insulating layers, the layers are formed into a single wiring board by pressure bonding. After the formation of a single wiring board, the wiring board is completed by forming through holes and a wiring pattern on the most external layer, as necessary, cutting the board and the like. On the completed wiring board, semiconductor devices and electronic components are mounted, which are then used as an electronic circuit for transmitting high frequency signals.
In the wiring board of the present example embodiment, the first signal wiring 13 and the second signal wiring 14 are formed, as differential signal wirings, on the first insulating layer 11 corresponding to a core material of the wiring board. The wiring interval between the first signal wiring 13 and the second signal wiring 14 is set to be a positive integral multiple of the interval of glass fibers in the first insulating layer 11 which have the long axis in the same direction as the longitudinal direction of both the first signal wiring 13 and the second signal wiring 14. By setting the wiring interval between the differential signal wirings to be an integral multiple of the interval of glass fibers in the insulating layer, the volume ratio between glass fibers and a resin becomes the same for a portion where the positive signal passes and for a portion where the negative signal passes. As a result, the influence from electrical characteristics of the insulating layer becomes almost the same for positive and negative signals transmitted on the differential signal wirings.
The same effect can be achieved in relation to also the interval of glass fibers in the prepreg material used for the second insulating layer 12, by setting the wiring interval between the first signal wiring 13 and the second signal wiring 14 to be a positive integral multiple of the interval of glass fibers in the second insulating layer 12. As a result, the influence received from electrical characteristics of both the above and underlying insulating layers becomes almost the same for the two signal wirings constituting the differential signal wirings. By thus making the influence from the insulating layers almost the same, it becomes possible to suppress the difference in the amount of delay between positive and negative signals transmitted on the differential signal wirings. As a result of thus suppressing the difference in the amount of delay between positive and negative signals transmitted on the differential signal wirings, it becomes possible to reduce the insertion loss of differential signals transmitted on the wiring board of the present example embodiment.
In the wiring board of the present example embodiment, it is only required that the wiring interval between the first signal wiring 13 and the second signal wiring 14 is a positive integral multiple of the interval of glass fibers constituting the first insulating layer 11 and of those constituting the second insulating layer 12, and it accordingly becomes possible to prevent decrease of flexibility in arrangement of the signal wirings. Therefore, in the wiring board of the present example embodiment, flexibility in wiring design can be secured. Thus, in the wiring board of the present example embodiment, it is possible to suppress the difference in the amount of delay between two signal wirings constituting differential signal wirings while securing flexibility in design.
Further, in the wiring board of the present example embodiment, as long as the long axis direction of glass fibers constituting the first insulating layer 11 and that of glass fibers constituting the second insulating layer 12 are almost parallel to each other, the suppression of the difference in the amount of delay can be achieved even when glass fibers' positions in a direction perpendicular to the long axis direction are not in coincidence between the two insulating layers. Accordingly, lamination of the first insulating layer 11 and the second insulating layer 12 becomes easy. As a result, the wiring board of the present example embodiment becomes easy to fabricate.
In the second example embodiment, the description has been given of an example of application to a wiring board including strip lines composed of differential signal wirings and a GND electrode formed on a side of an insulating layer opposite to the differential signal wirings. The configuration with the wiring interval between differential signal wirings being set to be a positive integral multiple of the fiber interval of a glass cloth may be applied also to planar lines. That is, the configuration with the wiring interval between differential signal wirings being set to be a positive integral multiple of the fiber interval of a glass cloth may be applied to a wiring structure in which differential wirings are formed parallel to a GND wiring which is formed in the same layer as or a different layer from that of the differential wirings.
In the example of
While the example of
The present invention has been described above taking the example embodiments as exemplary ones. However, the present invention is not limited to the example embodiments described above. That is, to the present invention, various aspects which can be understood by those skilled in the art may be applied within the scope of the present invention.
This application is based upon and claims the benefit of priority from Japanese Patent Application No. 2015-9817 filed on Jan. 21, 2015, the disclosure which is incorporated herein in its entirety by reference.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2015-009817 | Jan 2015 | JP | national |
| Filing Document | Filing Date | Country | Kind |
|---|---|---|---|
| PCT/JP2016/000205 | 1/15/2016 | WO | 00 |
