Small preforms other than balls

Industry

CPC
H05K2203/0415

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/0415Small preforms other than balls

Industries

Patents Grantslast 30 patents

Information Patent Grant
Metal composition, intermetallic compound member and joined body
- Patent number 11,746,398
- Issue date Sep 5, 2023
- Murata Manufacturing Co., Ltd.
- Masumi Noguchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and method for manufacturing the same
- Patent number 11,617,263
- Issue date Mar 28, 2023
- Avary Holding (Shenzhen) Co., Limited.
- Lin-Jie Gao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fine pitch copper pillar package and method
- Patent number 11,088,064
- Issue date Aug 10, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Robert Francis Darveaux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing an electric circuit comprising a circuit carri...
- Patent number 11,056,460
- Issue date Jul 6, 2021
- Siemens Aktiengesellschaft
- Stefan Pfefferlein
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tall and fine pitch interconnects
- Patent number 10,818,629
- Issue date Oct 27, 2020
- Invensas Corporation
- Cyprian Emeka Uzoh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a chip component
- Patent number 10,763,016
- Issue date Sep 1, 2020
- Rohm Co., Ltd.
- Hiroshi Tamagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to form a stacked electronic structure
- Patent number 10,741,531
- Issue date Aug 11, 2020
- Cyntec Co., Ltd.
- Chi-Feng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Curtain airbag device mounting structure and curtain airbag deploym...
- Patent number 10,723,306
- Issue date Jul 28, 2020
- Toyota Jidosha Kabushiki Kaisha
- Takamichi Komura
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Bonding member, method for manufacturing bonding member, and bondin...
- Patent number 10,625,376
- Issue date Apr 21, 2020
- MURATA MANUFACTURING CO., LTD.
- Seitaro Washizuka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Voiding control using solid solder preforms embedded in solder paste
- Patent number 10,537,030
- Issue date Jan 14, 2020
- Indium Corporation
- Zhenxi Wei
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Contact bump connection and contact bump and method for producing a...
- Patent number 10,292,270
- Issue date May 14, 2019
- SMARTRAC TECHNOLOGY GmbH
- Carsten Nieland
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Chip component
- Patent number 10,210,971
- Issue date Feb 19, 2019
- Rohm Co., Ltd.
- Hiroshi Tamagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked electronic structure
- Patent number 10,199,361
- Issue date Feb 5, 2019
- Cyntec Co., Ltd.
- Chi-Feng Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Materials for use with interconnects of electrical devices and rela...
- Patent number 10,123,430
- Issue date Nov 6, 2018
- Alpha Assembly Solutions Inc.
- Michael T. Marczi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tall and fine pitch interconnects
- Patent number 10,103,121
- Issue date Oct 16, 2018
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board assembly, electrical device, and method for as...
- Patent number 9,793,189
- Issue date Oct 17, 2017
- Fujitsu Limited
- Manabu Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device for assembling a chip on a substrate by providing a solder-f...
- Patent number 9,706,665
- Issue date Jul 11, 2017
- Valeo Etudes Electroniques
- Laurent Vivet
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip component
- Patent number 9,646,747
- Issue date May 9, 2017
- Rohm Co., Ltd.
- Hiroshi Tamagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder piece, chip solder and method of fabricating solder piece
- Patent number 9,327,364
- Issue date May 3, 2016
- Senju Metal Industry Co., Ltd.
- Masahiko Abe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board, method of producing a printed circuit board...
- Patent number 9,301,388
- Issue date Mar 29, 2016
- Robert Bosch GmbH
- Jens Nowotnick
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for assembling a chip on a substrate
- Patent number 9,167,703
- Issue date Oct 20, 2015
- Valeo Etudes Electroniques
- Laurent Vivet
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Planar contact with solder
- Patent number 9,155,200
- Issue date Oct 6, 2015
- Interplex Industries, Inc.
- Jack Seidler
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounting component, electronic device, and mounting method
- Patent number 9,124,057
- Issue date Sep 1, 2015
- Omron Corporation
- Jiro Koyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder piece, chip solder and method of fabricating solder piece
- Patent number 8,991,679
- Issue date Mar 31, 2015
- Senju Metal Industry Co., Ltd.
- Masahiko Abe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of bonding a member to a support by addition of material, an...
- Patent number 8,952,288
- Issue date Feb 10, 2015
- Valeo Equipements Electriques Monteur
- Jean-Michel Morelle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for making a solder joint
- Patent number 8,925,793
- Issue date Jan 6, 2015
- DunAn Microstaq, Inc.
- Parthiban Arunasalam
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder bump formation on a circuit board using a transfer sheet
- Patent number 8,701,973
- Issue date Apr 22, 2014
- Senju Metal Industry Co., Ltd.
- Takeo Kuramoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip package and manufacturing method thereof
- Patent number 8,592,958
- Issue date Nov 26, 2013
- Advanced Semiconductor Engineering, Inc.
- Dongkyun Ko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 8,580,620
- Issue date Nov 12, 2013
- Renesas Electronics Corporation
- Kazuyuki Nakagawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Planar contact with solder
- Patent number 8,497,429
- Issue date Jul 30, 2013
- Interplex Industries, Inc.
- Jack Seidler
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC SYSTEM ASSEMBLY
- Publication number 20240341041
- Publication date Oct 10, 2024
- EPIRUS, INC.
- Meletios Mastrodemos
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240179829
- Publication date May 30, 2024
- Unimicron Technology Corp.
- Chun Hung KUO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DOUBLE-SIDED ARRANGEMENT TYPE ELECTRONIC COMPONENT MODULE AND ELECT...
- Publication number 20230371180
- Publication date Nov 16, 2023
- Samsung Electronics Co., Ltd.
- Yohan MOON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20230199954
- Publication date Jun 22, 2023
- Avary Holding (Shenzhen) Co., Limited.
- LIN-JIE GAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING MULTI-LAYER CIRCUIT BOARD INCLUDING EXTREME...
- Publication number 20230147650
- Publication date May 11, 2023
- TSE CO., LTD.
- Byeong Yong LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD WITH A CONTACT POINT
- Publication number 20230105384
- Publication date Apr 6, 2023
- Knorr-Bremse Systeme fuer Nutzfahrzeuge GmbH
- Markus Deeg
- B60 - VEHICLES IN GENERAL
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220338348
- Publication date Oct 20, 2022
- Avary Holding (Shenzhen) Co., Limited.
- LIN-JIE GAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING AN ELECTRIC CIRCUIT
- Publication number 20190393187
- Publication date Dec 26, 2019
- SIEMENS AKTIENGESELLSCHAFT
- STEFAN PFEFFERLEIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A CHIP COMPONENT
- Publication number 20190148040
- Publication date May 16, 2019
- Rohm Co., Ltd.
- Hiroshi Tamagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method to Form a Stacked Electronic Structure
- Publication number 20190131286
- Publication date May 2, 2019
- CYNTEC CO., LTD.
- Chi-Feng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TALL AND FINE PITCH INTERCONNECTS
- Publication number 20190013287
- Publication date Jan 10, 2019
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked Electronic Structure
- Publication number 20180308829
- Publication date Oct 25, 2018
- CYNTEC CO., LTD.
- Chi-Feng Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Tall and Fine Pitch Interconnects
- Publication number 20180096960
- Publication date Apr 5, 2018
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VOIDING CONTROL USING SOLID SOLDER PREFORMS EMBEDDED IN SOLDER PASTE
- Publication number 20160057869
- Publication date Feb 25, 2016
- Indium Corporation
- Zhenxi Wei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRE-SOLDERING METAL SURFACES ONTO METALIZED SUBSTRATES U...
- Publication number 20150298232
- Publication date Oct 22, 2015
- CERAMTEC GMBH
- Klaus Herrmann
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE FOR ASSEMBLING A CHIP ON A SUBSTRATE BY PROVIDING A SOLDER-F...
- Publication number 20140304984
- Publication date Oct 16, 2014
- VALEO ETUDES ELECTRONIQUES
- Laurent VIVET
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM
- Publication number 20140027169
- Publication date Jan 30, 2014
- BENQ MATERIALS CORPORATION
- Chien-Huang HUANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Planar Contact with Solder
- Publication number 20130283608
- Publication date Oct 31, 2013
- Jack Seidler
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD, METHOD OF PRODUCING A PRINTED CIRCUIT BOARD...
- Publication number 20130271177
- Publication date Oct 17, 2013
- ROBERT BOSCH GmbH
- Jens Nowotnick
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF FABRICATING PRINTED-WIRING BOARD, AND PRINTED-WIRING BOARD
- Publication number 20130213705
- Publication date Aug 22, 2013
- Fujitsu Limited
- Mitsuo SUEHIRO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method For Making A Solder Joint
- Publication number 20130175330
- Publication date Jul 11, 2013
- DunAn Microstaq, Inc.
- Parthiban Arunasalam
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER PIECE, CHIP SOLDER AND METHOD OF FABRICATING SOLDER PIECE
- Publication number 20130082087
- Publication date Apr 4, 2013
- SENJU METAL INDUSTRY CO., LTD.
- Masahiko Abe
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Application
METHOD OF BONDING A MEMBER TO A SUPPORT BY ADDITION OF MATERIAL, AN...
- Publication number 20130062326
- Publication date Mar 14, 2013
- VALEO ELECTRONIQUE ET SYSTEMES DE LIAISON
- Jean-Michel Morelle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20120098109
- Publication date Apr 26, 2012
- Dongkyun Ko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDERING PREFORM
- Publication number 20120074210
- Publication date Mar 29, 2012
- ABB TECHNOLOGY AG
- Franc DUGAL
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER BUMP FORMATION ON A CIRCUIT BOARD USING A TRANSFER SHEET
- Publication number 20110297433
- Publication date Dec 8, 2011
- SENJU METAL INDUSTRY CO., LTD.
- Takeo Kuramoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MOUNTING COMPONENT, ELECTRONIC DEVICE, AND MOUNTING METHOD
- Publication number 20110201217
- Publication date Aug 18, 2011
- Omron Corporation
- Jiro Koyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20110039375
- Publication date Feb 17, 2011
- Renesas Electronics Corporation
- Kazuyuki Nakagawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Controlled Application of Solder Blocks to Establish Solder Connect...
- Publication number 20100270363
- Publication date Oct 28, 2010
- Seagate Technology LLC
- Tiangfee Yin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PLANAR CONTACT WITH SOLDER
- Publication number 20100236815
- Publication date Sep 23, 2010
- Interplex Industries, Inc.
- Jack Seidler
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Small preforms other than balls

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Metal composition, intermetallic compound member and joined body

Circuit board and method for manufacturing the same

Fine pitch copper pillar package and method

Method for producing an electric circuit comprising a circuit carri...

Tall and fine pitch interconnects

Method of manufacturing a chip component

Method to form a stacked electronic structure

Curtain airbag device mounting structure and curtain airbag deploym...

Bonding member, method for manufacturing bonding member, and bondin...

Voiding control using solid solder preforms embedded in solder paste

Contact bump connection and contact bump and method for producing a...

Chip component

Stacked electronic structure

Materials for use with interconnects of electrical devices and rela...

Tall and fine pitch interconnects

Printed wiring board assembly, electrical device, and method for as...

Device for assembling a chip on a substrate by providing a solder-f...

Chip component

Solder piece, chip solder and method of fabricating solder piece

Printed circuit board, method of producing a printed circuit board...

Method for assembling a chip on a substrate

Planar contact with solder

Mounting component, electronic device, and mounting method

Solder piece, chip solder and method of fabricating solder piece

Method of bonding a member to a support by addition of material, an...

Method for making a solder joint

Solder bump formation on a circuit board using a transfer sheet

Chip package and manufacturing method thereof

Method of manufacturing semiconductor device

Planar contact with solder

Patents Applicationslast 30 patents

ELECTRONIC SYSTEM ASSEMBLY

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

DOUBLE-SIDED ARRANGEMENT TYPE ELECTRONIC COMPONENT MODULE AND ELECT...

CIRCUIT BOARD

METHOD OF MANUFACTURING MULTI-LAYER CIRCUIT BOARD INCLUDING EXTREME...

PRINTED CIRCUIT BOARD WITH A CONTACT POINT

CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

METHOD FOR PRODUCING AN ELECTRIC CIRCUIT

METHOD OF MANUFACTURING A CHIP COMPONENT

Method to Form a Stacked Electronic Structure

TALL AND FINE PITCH INTERCONNECTS

Stacked Electronic Structure

Tall and Fine Pitch Interconnects

VOIDING CONTROL USING SOLID SOLDER PREFORMS EMBEDDED IN SOLDER PASTE

METHOD FOR PRE-SOLDERING METAL SURFACES ONTO METALIZED SUBSTRATES U...

DEVICE FOR ASSEMBLING A CHIP ON A SUBSTRATE BY PROVIDING A SOLDER-F...

ANISOTROPIC CONDUCTIVE FILM

Planar Contact with Solder

PRINTED CIRCUIT BOARD, METHOD OF PRODUCING A PRINTED CIRCUIT BOARD...

METHOD OF FABRICATING PRINTED-WIRING BOARD, AND PRINTED-WIRING BOARD

Method For Making A Solder Joint

SOLDER PIECE, CHIP SOLDER AND METHOD OF FABRICATING SOLDER PIECE

METHOD OF BONDING A MEMBER TO A SUPPORT BY ADDITION OF MATERIAL, AN...

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

SOLDERING PREFORM

SOLDER BUMP FORMATION ON A CIRCUIT BOARD USING A TRANSFER SHEET

MOUNTING COMPONENT, ELECTRONIC DEVICE, AND MOUNTING METHOD

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Controlled Application of Solder Blocks to Establish Solder Connect...

PLANAR CONTACT WITH SOLDER