Smoothing; Planarisation

Industry

CPC
H01L21/7684

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/7684Smoothing; Planarisation

Industries

Patents Grantslast 30 patents

Information Patent Grant
Micro bump, method for forming micro bump, chip interconnection str...
- Patent number 12,176,311
- Issue date Dec 24, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Zengyan Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor package
- Patent number 12,176,282
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Ming Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,176,290
- Issue date Dec 24, 2024
- Samsung Electronics Co., Ltd.
- Sungyu Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a transition metal containing film on a substrate...
- Patent number 12,173,402
- Issue date Dec 24, 2024
- ASM IP Holding B.V.
- Timo Hatanpää
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device with contact structure
- Patent number 12,170,246
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chung-Liang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded metal lines
- Patent number 12,170,268
- Issue date Dec 17, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Stephen Morein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conformal titanium nitride-based thin films and methods of forming...
- Patent number 12,165,918
- Issue date Dec 10, 2024
- Eugenus, Inc.
- Niloy Mukherjee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Air spacer surrounding conductive features and method forming same
- Patent number 12,165,914
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Nien Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FinFET device structure having dielectric features between a plural...
- Patent number 12,165,926
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Ting Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming interconnect structure having a barrier layer
- Patent number 12,165,975
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shu-Cheng Chin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit interconnect structures with ultra-thin metal ch...
- Patent number 12,165,917
- Issue date Dec 10, 2024
- Intel Corporation
- Carl Naylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor structure and semiconductor...
- Patent number 12,165,879
- Issue date Dec 10, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Xinman Cao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate structure and semiconductor device having the same
- Patent number 12,166,126
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Chieh Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,165,916
- Issue date Dec 10, 2024
- Samsung Electronics Co., Ltd.
- Won Keun Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for fabricating a semiconductor...
- Patent number 12,159,836
- Issue date Dec 3, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Chih-Cheng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical direct pattern plating method
- Patent number 12,159,837
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Jiun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an interconnect structure having an air gap and s...
- Patent number 12,159,838
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ping Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tungsten molybdenum structures
- Patent number 12,159,804
- Issue date Dec 3, 2024
- Applied Materials, Inc.
- Xi Cen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 12,154,823
- Issue date Nov 26, 2024
- Renesas Electronics Corporation
- Katsuhiko Hotta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure and manufacturing method thereof
- Patent number 12,154,852
- Issue date Nov 26, 2024
- United Microelectronics Corp.
- Min-Shiang Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory layout for reduced line loading
- Patent number 12,156,409
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Yang Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact conductive feature formation and structure
- Patent number 12,148,659
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ken-Yu Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low resistance and high reliability metallization module
- Patent number 12,148,660
- Issue date Nov 19, 2024
- Applied Materials, Inc.
- Roey Shaviv
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shutter disk
- Patent number 12,148,629
- Issue date Nov 19, 2024
- Applied Materials, Inc.
- Kang Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,148,701
- Issue date Nov 19, 2024
- Samsung Electronics Co., Ltd.
- Hongsik Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing an electronic device
- Patent number 12,148,658
- Issue date Nov 19, 2024
- Innolux Corporation
- Cheng-Chi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via for component electrode connection
- Patent number 12,142,524
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing electronic device
- Patent number 12,142,522
- Issue date Nov 12, 2024
- Mitsui Chemicals Tohcello, Inc.
- Toru Miura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Different via configurations for different via interface requirements
- Patent number 12,142,565
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih-Che Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and semiconductor device having the same
- Patent number 12,142,521
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Bo-Jiun Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Embedding Metal-Insulator-Metal Structure In Silicon Oxide In A Cop...
- Publication number 20240429156
- Publication date Dec 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIFFUSION BARRIER FOR INTERCONNECTS
- Publication number 20240429094
- Publication date Dec 26, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH PROTECTION LINERS AND AIR GAPS AND METHOD...
- Publication number 20240429171
- Publication date Dec 26, 2024
- NANYA TECHNOLOGY CORPORATION
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOSCALE RESOLUTION, SPATIALLY-CONTROLLED CONDUCTIVITY MODULATION...
- Publication number 20240429092
- Publication date Dec 26, 2024
- Northwestern University
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE SELF-ASSEMBLED MONOLAYER (SAM) REMOVAL
- Publication number 20240420996
- Publication date Dec 19, 2024
- Applied Materials, Inc.
- Jiajie Cen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reduction of Air Gaps in FinFET Structures
- Publication number 20240420998
- Publication date Dec 19, 2024
- Applied Material, Inc.
- Joni Oskari Raisanen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME
- Publication number 20240421070
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Sunjung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ATOMIC LAYER DEPOSITION OF BARRIER METAL LAYER FOR ELECTRODE OF GAL...
- Publication number 20240420995
- Publication date Dec 19, 2024
- MACOM Technology Solutions Holdings, Inc.
- Timothy E. Boles
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCTION OF MIDDLE-OF-LINE RESISTANCE AND CAPACITANCE
- Publication number 20240421078
- Publication date Dec 19, 2024
- International Business Machines Corporation
- Brent A. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR WAFER, MEMORY DEVICE, AND ELECT...
- Publication number 20240421155
- Publication date Dec 19, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei YAMAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL STRUCTURES AND METHODS OF FORMING THE SAME
- Publication number 20240421066
- Publication date Dec 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Liang CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADVANCED INTERCONNECTS WITH HYPERBOLOID PROFILE
- Publication number 20240421076
- Publication date Dec 19, 2024
- International Business Machines Corporation
- Oscar van der Straten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THEREOF
- Publication number 20240421090
- Publication date Dec 19, 2024
- Samsung Electronics Co., LTD
- Seo Woo Nam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE LINER DEPOSITION FOR VIA RESISTANCE REDUCTION
- Publication number 20240420997
- Publication date Dec 19, 2024
- Applied Materials, Inc.
- Yang Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240413010
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen Ju Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES AND CONFIGURATIONS TO REDUCE TRANSISTOR GATE SHORT DEFECTS
- Publication number 20240413016
- Publication date Dec 12, 2024
- Intel Corporation
- Sridhar GOVINDARAJU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTERCONNECTION STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240413074
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A POROUS DIELECTRIC LAYER, AND METHO...
- Publication number 20240413076
- Publication date Dec 12, 2024
- Adeia Semiconductor Solutions LLC
- Benjamin David Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structure and Method of Forming Thereof
- Publication number 20240413087
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shu-Cheng Chin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240404877
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsai-Ming HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL SILICIDE PROCESS USING RUTHENIUM SILICIDE
- Publication number 20240404888
- Publication date Dec 5, 2024
- Applied Materuals, Inc.
- Thomas Anthony Empante
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240404899
- Publication date Dec 5, 2024
- Innolux Corporation
- Ching-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20240395874
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARBON-BASED LINER TO REDUCE CONTACT RESISTANCE
- Publication number 20240395612
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Hsien CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ATOM PROBE TOMOGRAPHY SPECIMEN PREPARATION
- Publication number 20240395636
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shih-Wei HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLUE LAYER ETCHING FOR IMPROVING DEVICE PERFORMANCE AND PROVIDING C...
- Publication number 20240395608
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Hao CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT METALLIZATION PROCESS
- Publication number 20240395611
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tien-Pei CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bl-LAYER ALLOY LINER FOR INTERCONNECT METALLIZATION AND METHODS OF...
- Publication number 20240395617
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Huei-Wen Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTERCONNECT STRUCTURE WITH DOUBLE CONDUCTORS
- Publication number 20240395702
- Publication date Nov 28, 2024
- TESSERA LLC
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR DEVICE
- Publication number 20240393677
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Min WANG
- H01 - BASIC ELECTRIC ELEMENTS

Smoothing; Planarisation

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Micro bump, method for forming micro bump, chip interconnection str...

Manufacturing method of semiconductor package

Semiconductor device

Method of forming a transition metal containing film on a substrate...

Semiconductor device with contact structure

Embedded metal lines

Conformal titanium nitride-based thin films and methods of forming...

Air spacer surrounding conductive features and method forming same

FinFET device structure having dielectric features between a plural...

Method of forming interconnect structure having a barrier layer

Integrated circuit interconnect structures with ultra-thin metal ch...

Method for manufacturing semiconductor structure and semiconductor...

Gate structure and semiconductor device having the same

Semiconductor device

Semiconductor structure and method for fabricating a semiconductor...

Chemical direct pattern plating method

Method of forming an interconnect structure having an air gap and s...

Tungsten molybdenum structures

Semiconductor device and a method of manufacturing the same

Interconnection structure and manufacturing method thereof

Memory layout for reduced line loading

Contact conductive feature formation and structure

Low resistance and high reliability metallization module

Shutter disk

Semiconductor device

Method for manufacturing an electronic device

Via for component electrode connection

Method for manufacturing electronic device

Different via configurations for different via interface requirements

Interconnect structure and semiconductor device having the same

Patents Applicationslast 30 patents

Embedding Metal-Insulator-Metal Structure In Silicon Oxide In A Cop...

DIFFUSION BARRIER FOR INTERCONNECTS

SEMICONDUCTOR DEVICE WITH PROTECTION LINERS AND AIR GAPS AND METHOD...

NANOSCALE RESOLUTION, SPATIALLY-CONTROLLED CONDUCTIVITY MODULATION...

SELECTIVE SELF-ASSEMBLED MONOLAYER (SAM) REMOVAL

Reduction of Air Gaps in FinFET Structures

SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME

ATOMIC LAYER DEPOSITION OF BARRIER METAL LAYER FOR ELECTRODE OF GAL...

REDUCTION OF MIDDLE-OF-LINE RESISTANCE AND CAPACITANCE

SEMICONDUCTOR DEVICE, SEMICONDUCTOR WAFER, MEMORY DEVICE, AND ELECT...

METAL-INSULATOR-METAL STRUCTURES AND METHODS OF FORMING THE SAME

ADVANCED INTERCONNECTS WITH HYPERBOLOID PROFILE

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THEREOF

SELECTIVE LINER DEPOSITION FOR VIA RESISTANCE REDUCTION

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME

TECHNIQUES AND CONFIGURATIONS TO REDUCE TRANSISTOR GATE SHORT DEFECTS

INTERCONNECTION STRUCTURE AND METHODS OF FORMING THE SAME

SEMICONDUCTOR DEVICE INCLUDING A POROUS DIELECTRIC LAYER, AND METHO...

Interconnect Structure and Method of Forming Thereof

METHODS OF MANUFACTURING SEMICONDUCTOR DEVICE

DUAL SILICIDE PROCESS USING RUTHENIUM SILICIDE

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

CARBON-BASED LINER TO REDUCE CONTACT RESISTANCE

ATOM PROBE TOMOGRAPHY SPECIMEN PREPARATION

GLUE LAYER ETCHING FOR IMPROVING DEVICE PERFORMANCE AND PROVIDING C...

CONTACT METALLIZATION PROCESS

Bl-LAYER ALLOY LINER FOR INTERCONNECT METALLIZATION AND METHODS OF...

SEMICONDUCTOR INTERCONNECT STRUCTURE WITH DOUBLE CONDUCTORS

METHOD FOR FORMING SEMICONDUCTOR DEVICE