Sockets for un-leaded IC's having matrix type contact fields

Industry

CPC
G01R1/0483

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Parent Industries

GPHYSICS G01Measuring instruments G01RMEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00

Current Industry

G01R1/0483Sockets for un-leaded IC's having matrix type contact fields

Industries

Patents Grantslast 30 patents

Information Patent Grant
Module substrate for semiconductor module, semiconductor module and...
- Patent number 12,130,306
- Issue date Oct 29, 2024
- Samsung Electronics Co., Ltd.
- Kwangkyu Bang
- G01 - MEASURING TESTING
Information Patent Grant
Socket
- Patent number 12,099,077
- Issue date Sep 24, 2024
- Enplas Corporation
- Yuki Ueyama
- G01 - MEASURING TESTING
Information Patent Grant
Resonant-coupled transmission line
- Patent number 12,004,288
- Issue date Jun 4, 2024
- Teradyne, Inc.
- Andrew Westwood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC chip holder
- Patent number 11,982,687
- Issue date May 14, 2024
- Brother Kogyo Kabushiki Kaisha
- Hidekazu Komiya
- G01 - MEASURING TESTING
Information Patent Grant
Apparatuses and methods for monitoring health of probing u-bump clu...
- Patent number 11,740,282
- Issue date Aug 29, 2023
- Intel Corporation
- Jagat Shakya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Socket and inspection socket
- Patent number 11,714,105
- Issue date Aug 1, 2023
- Enplas Corporation
- Leo Azumi
- G01 - MEASURING TESTING
Information Patent Grant
Localized onboard socket heating elements for burn-in test boards
- Patent number 11,650,246
- Issue date May 16, 2023
- Western Digital Technologies, Inc.
- Tony Leong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inspecting device and its testing socket
- Patent number 11,624,759
- Issue date Apr 11, 2023
- Global Unichip Corporation
- Chih-Chieh Liao
- G01 - MEASURING TESTING
Information Patent Grant
Testing holders for chip unit and die package
- Patent number 11,579,190
- Issue date Feb 14, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Mill-Jer Wang
- G01 - MEASURING TESTING
Information Patent Grant
IC chip holder
- Patent number 11,499,991
- Issue date Nov 15, 2022
- Brother Kogyo Kabushiki Kaisha
- Hidekazu Komiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for depopulating pins from contactor test socke...
- Patent number 11,493,535
- Issue date Nov 8, 2022
- Texas Instruments Incorporated
- Kay Chan Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact and test socket device for testing semiconductor device
- Patent number 11,486,896
- Issue date Nov 1, 2022
- Dong Weon Hwang
- G01 - MEASURING TESTING
Information Patent Grant
Contact and test socket device for testing semiconductor device
- Patent number 11,486,897
- Issue date Nov 1, 2022
- Dong Weon Hwang
- G01 - MEASURING TESTING
Information Patent Grant
Method for testing semiconductor devices
- Patent number 11,408,913
- Issue date Aug 9, 2022
- Texas Instruments Incorporated
- Dale Lee Anderson
- G01 - MEASURING TESTING
Information Patent Grant
Contactor with angled depressible probes in shifted bores
- Patent number 11,378,588
- Issue date Jul 5, 2022
- Essai, Inc.
- Nasser Barabi
- G01 - MEASURING TESTING
Information Patent Grant
Pressing assembly and chip testing apparatus
- Patent number 11,366,136
- Issue date Jun 21, 2022
- ONE TEST SYSTEMS
- Chen-Lung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Testing holders for chip unit and die package
- Patent number 11,340,291
- Issue date May 24, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Mill-Jer Wang
- G01 - MEASURING TESTING
Information Patent Grant
Conductive contactor unit
- Patent number 11,293,946
- Issue date Apr 5, 2022
- NHK Spring Co., Ltd.
- Kohei Hironaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Socket with thermal conductor
- Patent number 11,259,399
- Issue date Feb 22, 2022
- Intel Corporation
- Hongfei Yan
- G01 - MEASURING TESTING
Information Patent Grant
Test socket assembly and related methods
- Patent number 11,088,051
- Issue date Aug 10, 2021
- Xcerra Corporation
- Valts Treibergs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array current meter with a current sense mesh
- Patent number 11,054,442
- Issue date Jul 6, 2021
- International Business Machines Corporation
- Layne A. Berge
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus of package enabled ESD protection
- Patent number 11,043,484
- Issue date Jun 22, 2021
- Xilinx, Inc.
- Hong Shi
- G01 - MEASURING TESTING
Information Patent Grant
Universal test mechanism for semiconductor device
- Patent number 11,029,331
- Issue date Jun 8, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Mill-Jer Wang
- G01 - MEASURING TESTING
Information Patent Grant
Vertical probe testing head with improved frequency properties
- Patent number 11,029,337
- Issue date Jun 8, 2021
- Technoprobe S.p.A.
- Roberto Crippa
- G01 - MEASURING TESTING
Information Patent Grant
BGA socket device for testing BGA IC
- Patent number 10,971,843
- Issue date Apr 6, 2021
- Dong Weon Hwang
- G01 - MEASURING TESTING
Information Patent Grant
Contact and test socket device for testing semiconductor device
- Patent number 10,935,572
- Issue date Mar 2, 2021
- Dong Weon Hwang
- G01 - MEASURING TESTING
Information Patent Grant
Multiple insertion testing of test socket
- Patent number 10,838,018
- Issue date Nov 17, 2020
- Xilinx, Inc.
- David M. Mahoney
- G01 - MEASURING TESTING
Information Patent Grant
Universal test socket, semiconductor test device, and method of tes...
- Patent number 10,802,048
- Issue date Oct 13, 2020
- Samsung Electronics Co., Ltd.
- Daisuke Yamada
- G01 - MEASURING TESTING
Information Patent Grant
Current leakage and charge injection mitigating solid state switch
- Patent number 10,725,105
- Issue date Jul 28, 2020
- KEITHLEY INSTRUMENTS, LLC
- Matthew Holtz
- G01 - MEASURING TESTING
Information Patent Grant
Testing holders for chip unit and die package
- Patent number 10,698,026
- Issue date Jun 30, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Mill-Jer Wang
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
SOCKET DEVICE FOR TESTING ICs
- Publication number 20240183879
- Publication date Jun 6, 2024
- HICON CO., LTD.
- Dong Weon HWANG
- G01 - MEASURING TESTING
Information Patent Application
SOCKET BOARD AND METHOD FOR INSPECTING A SEMICONDUCTOR DEVICE
- Publication number 20240094244
- Publication date Mar 21, 2024
- KIOXIA Corporation
- Tsunehiro KITA
- G01 - MEASURING TESTING
Information Patent Application
TECHNOLOGIES FOR TESTING LIQUID METAL ARRAY INTERCONNECT PACKAGES
- Publication number 20230314503
- Publication date Oct 5, 2023
- Intel Corporation
- Gregorio Roberto Murtagian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEST BOARD AND METHOD FOR TESTING SEMICONDUCTOR DEVICE
- Publication number 20230273239
- Publication date Aug 31, 2023
- KIOXIA Corporation
- Hideaki MURAKAMI
- G01 - MEASURING TESTING
Information Patent Application
MODULE SUBSTRATE FOR SEMICONDUCTOR MODULE, SEMICONDUCTOR MODULE AND...
- Publication number 20230213554
- Publication date Jul 6, 2023
- Samsung Electronics Co., Ltd.
- Kwangkyu Bang
- G01 - MEASURING TESTING
Information Patent Application
SOCKET
- Publication number 20230038252
- Publication date Feb 9, 2023
- ENPLAS CORPORATION
- Yuki Ueyama
- G01 - MEASURING TESTING
Information Patent Application
CONTACTOR WITH ANGLED DEPRESSIBLE PROBES IN SHIFTED BORES
- Publication number 20220413010
- Publication date Dec 29, 2022
- ESSAI, INC.
- Nasser Barabi
- G01 - MEASURING TESTING
Information Patent Application
IC CHIP HOLDER
- Publication number 20220413011
- Publication date Dec 29, 2022
- BROTHER KOGYO KABUSHIKI KAISHA
- Hidekazu KOMIYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOCKET AND INSPECTION SOCKET
- Publication number 20220317151
- Publication date Oct 6, 2022
- ENPLAS CORPORATION
- Leo AZUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TESTING HOLDERS FOR CHIP UNIT AND DIE PACKAGE
- Publication number 20220283221
- Publication date Sep 8, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mill-Jer Wang
- G01 - MEASURING TESTING
Information Patent Application
LIDLESS BGA SOCKET APPARATUS FOR TESTING SEMICONDUCTOR DEVICE
- Publication number 20220163561
- Publication date May 26, 2022
- HICON CO., LTD.
- Dong Weon Hwang
- G01 - MEASURING TESTING
Information Patent Application
PRESSING ASSEMBLY AND CHIP TESTING APPARATUS
- Publication number 20220128600
- Publication date Apr 28, 2022
- ONE TEST SYSTEMS
- CHEN-LUNG TSAI
- G01 - MEASURING TESTING
Information Patent Application
CONTACT AND TEST SOCKET DEVICE FOR TESTING SEMICONDUCTOR DEVICE
- Publication number 20210148950
- Publication date May 20, 2021
- Dong Weon Hwang
- G01 - MEASURING TESTING
Information Patent Application
CONTACT AND TEST SOCKET DEVICE FOR TESTING SEMICONDUCTOR DEVICE
- Publication number 20210140997
- Publication date May 13, 2021
- Dong Weon Hwang
- G01 - MEASURING TESTING
Information Patent Application
CONTACTOR WITH ANGLED DEPRESSIBLE PROBES IN SHIFTED BORES
- Publication number 20210102972
- Publication date Apr 8, 2021
- ESSAI, INC.
- Nasser Barabi
- G01 - MEASURING TESTING
Information Patent Application
BALL GRID ARRAY CURRENT METER WITH A CURRENT SENSE MESH
- Publication number 20210096157
- Publication date Apr 1, 2021
- International Business Machines Corporation
- Layne A. Berge
- G01 - MEASURING TESTING
Information Patent Application
TESTING HOLDERS FOR CHIP UNIT AND DIE PACKAGE
- Publication number 20200326370
- Publication date Oct 15, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Mill-Jer WANG
- G01 - MEASURING TESTING
Information Patent Application
IC CHIP HOLDER
- Publication number 20200249257
- Publication date Aug 6, 2020
- BROTHER KOGYO KABUSHIKI KAISHA
- Hidekazu KOMIYA
- G01 - MEASURING TESTING
Information Patent Application
CONTACTOR WITH ANGLED DEPRESSIBLE PROBES
- Publication number 20200225264
- Publication date Jul 16, 2020
- ESSAI, INC.
- Nasser Barabi
- G01 - MEASURING TESTING
Information Patent Application
BGA SOCKET DEVICE FOR TESTING BGA IC
- Publication number 20200176910
- Publication date Jun 4, 2020
- Dong Weon Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE CONTACTOR UNIT
- Publication number 20200141975
- Publication date May 7, 2020
- NHK Spring Co., Ltd.
- Kohei Hironaka
- G01 - MEASURING TESTING
Information Patent Application
VERTICAL PROBE TESTING HEAD WITH IMPROVED FREQUENCY PROPERTIES
- Publication number 20190377006
- Publication date Dec 12, 2019
- Technoprobe S.p.A.
- Roberto CRIPPA
- G01 - MEASURING TESTING
Information Patent Application
Method for Testing Semiconductor Devices
- Publication number 20190120874
- Publication date Apr 25, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Dale Lee Anderson
- G01 - MEASURING TESTING
Information Patent Application
SOCKET
- Publication number 20190064214
- Publication date Feb 28, 2019
- Sensata Technologies, Inc.
- Hideyuki Takahashi
- G01 - MEASURING TESTING
Information Patent Application
TESTING HOLDERS FOR CHIP UNIT AND DIE PACKAGE
- Publication number 20180372796
- Publication date Dec 27, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Mill-Jer WANG
- G01 - MEASURING TESTING
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20180340976
- Publication date Nov 29, 2018
- RENESAS ELECTRONICS CORPORATION
- Toshitsugu ISHII
- G01 - MEASURING TESTING
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, INSPECTION DEVICE OF...
- Publication number 20180277449
- Publication date Sep 27, 2018
- RENESAS ELECTRONICS CORPORATION
- Yu Muto
- G01 - MEASURING TESTING
Information Patent Application
CONTACTOR WITH ANGLED DEPRESSIBLE PROBES
- Publication number 20180172730
- Publication date Jun 21, 2018
- ESSAI, INC.
- Nasser Barabi
- G01 - MEASURING TESTING
Information Patent Application
TEST SOCKET ASSEMBLY AND RELATED METHODS
- Publication number 20180096917
- Publication date Apr 5, 2018
- XCERRA CORPORATION
- Valts Treibergs
- G01 - MEASURING TESTING
Information Patent Application
ELECTRIC COMPONENT SOCKET
- Publication number 20170373416
- Publication date Dec 28, 2017
- ENPLAS CORPORATION
- Yuki UEYAMA
- G01 - MEASURING TESTING

Sockets for un-leaded IC's having matrix type contact fields

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Module substrate for semiconductor module, semiconductor module and...

Socket

Resonant-coupled transmission line

IC chip holder

Apparatuses and methods for monitoring health of probing u-bump clu...

Socket and inspection socket

Localized onboard socket heating elements for burn-in test boards

Inspecting device and its testing socket

Testing holders for chip unit and die package

IC chip holder

Systems and methods for depopulating pins from contactor test socke...

Contact and test socket device for testing semiconductor device

Contact and test socket device for testing semiconductor device

Method for testing semiconductor devices

Contactor with angled depressible probes in shifted bores

Pressing assembly and chip testing apparatus

Testing holders for chip unit and die package

Conductive contactor unit

Socket with thermal conductor

Test socket assembly and related methods

Ball grid array current meter with a current sense mesh

Method and apparatus of package enabled ESD protection

Universal test mechanism for semiconductor device

Vertical probe testing head with improved frequency properties

BGA socket device for testing BGA IC

Contact and test socket device for testing semiconductor device

Multiple insertion testing of test socket

Universal test socket, semiconductor test device, and method of tes...

Current leakage and charge injection mitigating solid state switch

Testing holders for chip unit and die package

Patents Applicationslast 30 patents

SOCKET DEVICE FOR TESTING ICs

SOCKET BOARD AND METHOD FOR INSPECTING A SEMICONDUCTOR DEVICE

TECHNOLOGIES FOR TESTING LIQUID METAL ARRAY INTERCONNECT PACKAGES

TEST BOARD AND METHOD FOR TESTING SEMICONDUCTOR DEVICE

MODULE SUBSTRATE FOR SEMICONDUCTOR MODULE, SEMICONDUCTOR MODULE AND...

SOCKET

CONTACTOR WITH ANGLED DEPRESSIBLE PROBES IN SHIFTED BORES

IC CHIP HOLDER

SOCKET AND INSPECTION SOCKET

TESTING HOLDERS FOR CHIP UNIT AND DIE PACKAGE

LIDLESS BGA SOCKET APPARATUS FOR TESTING SEMICONDUCTOR DEVICE

PRESSING ASSEMBLY AND CHIP TESTING APPARATUS

CONTACT AND TEST SOCKET DEVICE FOR TESTING SEMICONDUCTOR DEVICE

CONTACT AND TEST SOCKET DEVICE FOR TESTING SEMICONDUCTOR DEVICE

CONTACTOR WITH ANGLED DEPRESSIBLE PROBES IN SHIFTED BORES

BALL GRID ARRAY CURRENT METER WITH A CURRENT SENSE MESH

TESTING HOLDERS FOR CHIP UNIT AND DIE PACKAGE

IC CHIP HOLDER

CONTACTOR WITH ANGLED DEPRESSIBLE PROBES

BGA SOCKET DEVICE FOR TESTING BGA IC

CONDUCTIVE CONTACTOR UNIT

VERTICAL PROBE TESTING HEAD WITH IMPROVED FREQUENCY PROPERTIES

Method for Testing Semiconductor Devices

SOCKET

TESTING HOLDERS FOR CHIP UNIT AND DIE PACKAGE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, INSPECTION DEVICE OF...

CONTACTOR WITH ANGLED DEPRESSIBLE PROBES

TEST SOCKET ASSEMBLY AND RELATED METHODS

ELECTRIC COMPONENT SOCKET