Solder filled PTH during processing

Industry

CPC
H05K2203/045

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/045Solder filled PTH during processing

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method of forming a top plane connection in an electro-optic device
- Patent number 12,038,666
- Issue date Jul 16, 2024
- E Ink Corporation
- Matthew Joseph Kayal
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method for producing a printed circuit board having thermal through...
- Patent number 11,116,071
- Issue date Sep 7, 2021
- ZKW GROUP GMBH
- Erik Edlinger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Non-destructive identifying of plating dissolution in soldered, pla...
- Patent number 11,059,120
- Issue date Jul 13, 2021
- International Business Machines Corporation
- Matthew S. Kelly
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Facilitating filling a plated through-hole of a circuit board with...
- Patent number 11,051,407
- Issue date Jun 29, 2021
- International Business Machines Corporation
- Prabjit Singh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming a top plane connection in an electro-optic device
- Patent number 11,022,854
- Issue date Jun 1, 2021
- E Ink Corporation
- Matthew Joseph Kayal
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Repairing defective through-holes
- Patent number 10,952,330
- Issue date Mar 16, 2021
- International Business Machines Corporation
- Prabjit Singh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board with at least one integrated precision resistor
- Patent number 10,627,429
- Issue date Apr 21, 2020
- JUMATECH GMBH
- Markus Wölfel
- G01 - MEASURING TESTING
Information Patent Grant
Electro-optic display with measurement aperture
- Patent number 10,466,564
- Issue date Nov 5, 2019
- E Ink Corporation
- Matthew Joseph Kayal
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Printed circuit board and method for producing a printed circuit board
- Patent number 10,327,325
- Issue date Jun 18, 2019
- ZK W Group GmbH
- Erik Edlinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate on which electronic component is soldered, electronic dev...
- Patent number 10,299,387
- Issue date May 21, 2019
- Fujitsu Limited
- Yoshikazu Hirano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical connector assembly and mounting structure thereof
- Patent number 9,337,566
- Issue date May 10, 2016
- Tyco Electronics Japan G.K.
- Shinichi Hashimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Processes for the production of electro-optic displays
- Patent number 9,238,340
- Issue date Jan 19, 2016
- E Ink Corporation
- Matthew Joseph Kayal
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Adhesive reinforced open hole interconnect
- Patent number 8,354,595
- Issue date Jan 15, 2013
- Raytheon Company
- Kevin C. Rolston
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method for mounting electronic components
- Patent number 8,270,179
- Issue date Sep 18, 2012
- Panasonic Corporation
- Hideaki Yamauchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low-thickness electronic module comprising a stack of electronic pa...
- Patent number 8,243,468
- Issue date Aug 14, 2012
- 3D Plus
- Christian Val
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Illumination device and method for manufacturing the same
- Patent number 8,154,683
- Issue date Apr 10, 2012
- CCS Inc.
- Kenji Yoneda
- F21 - LIGHTING
Information Patent Grant
Method of manufacturing a wired circuit board
- Patent number 8,146,246
- Issue date Apr 3, 2012
- Nitto Denko Corporation
- Hitoki Kanagawa
- G11 - INFORMATION STORAGE
Information Patent Grant
Via design for flux residue mitigation
- Patent number 8,102,057
- Issue date Jan 24, 2012
- Hewlett-Packard Development Company, L.P.
- Alexander Leon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 8,097,944
- Issue date Jan 17, 2012
- Infineon Technologies AG
- Stefan Landau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a wired circuit board
- Patent number 8,015,703
- Issue date Sep 13, 2011
- Nitto Denko Corporation
- Hitoki Kanagawa
- G11 - INFORMATION STORAGE
Information Patent Grant
Microelectronic packages and methods therefor
- Patent number 7,939,934
- Issue date May 10, 2011
- Tessera, Inc.
- Belgacem Haba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible printed circuit board and liquid crystal display device us...
- Patent number 7,929,100
- Issue date Apr 19, 2011
- Samsung Electronics Co., Ltd.
- Wal-Hee Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and radiation detector employing it
- Patent number 7,838,994
- Issue date Nov 23, 2010
- Hamamatsu Photonics K.K.
- Katsumi Shibayama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electric device, stack of electric devices, and method of manufactu...
- Patent number 7,834,462
- Issue date Nov 16, 2010
- Qimonda AG
- Stephan Dobritz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit module and method of forming the same
- Patent number 7,799,605
- Issue date Sep 21, 2010
- Samsung Electronics Co., Ltd.
- Sung-Joo Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board direct connection and method of forming the same
- Patent number 7,766,665
- Issue date Aug 3, 2010
- IVUS Industries, Inc.
- Fred Jessup
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wired circuit board
- Patent number 7,732,900
- Issue date Jun 8, 2010
- Nitto Denko Corporation
- Hitoki Kanagawa
- G11 - INFORMATION STORAGE
Information Patent Grant
Capacitor sheet and electronic circuit board
- Patent number 7,709,929
- Issue date May 4, 2010
- Fujitsu Limited
- Kouichi Kuramitsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical connection between cable and printed circuit board for h...
- Patent number 7,690,930
- Issue date Apr 6, 2010
- Hubert Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and radiation detector employing it
- Patent number 7,663,113
- Issue date Feb 16, 2010
- Hamamatsu Photonics K.K.
- Katsumi Shibayama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
WIRING SUBSTRATE FOR ELECTRONIC CONTROL DEVICE, AND METHOD FOR MANU...
- Publication number 20240357736
- Publication date Oct 24, 2024
- Hitachi Astemo, Ltd.
- Takanori SEKIGUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTION METHOD FOR CHIP AND CIRCUIT BOARD, AND CIRCUIT BOARD ASS...
- Publication number 20230081618
- Publication date Mar 16, 2023
- INTELLIMICRO MEDICAL CO., LTD.
- Yu-chong Tai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
REPAIRING DEFECTIVE THROUGH-HOLES
- Publication number 20200245469
- Publication date Jul 30, 2020
- International Business Machines Corporation
- Prabjit SINGH
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
NON-DESTRUCTIVE IDENTIFYING OF PLATING DISSOLUTION IN SOLDERED, PLA...
- Publication number 20200139466
- Publication date May 7, 2020
- International Business Machines Corporation
- Matthew S. KELLY
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FACILITATING FILLING A PLATED THROUGH-HOLE OF A CIRCUIT BOARD WITH...
- Publication number 20200128676
- Publication date Apr 23, 2020
- International Business Machines Corporation
- Prabjit SINGH
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE ON WHICH ELECTRONIC COMPONENT IS SOLDERED, ELECTRONIC DEV...
- Publication number 20180343748
- Publication date Nov 29, 2018
- Fujitsu Limited
- Yoshikazu Hirano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD MANUFACTURING METHOD AND PRINTED CIRCUIT BOAR...
- Publication number 20180206346
- Publication date Jul 19, 2018
- Kuo-Ping YANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electrical Connector Assembly and Mounting Structure Thereof
- Publication number 20140322936
- Publication date Oct 30, 2014
- Tyco Electronics Japan G.K.
- Shinichi Hashimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSES FOR THE PRODUCTION OF ELECTRO-OPTIC DISPLAYS
- Publication number 20140027044
- Publication date Jan 30, 2014
- Matthew Joseph Kayal
- B32 - LAYERED PRODUCTS
Information Patent Application
PRINTED WIRING BOARD AND SOLDERING METHOD
- Publication number 20130327563
- Publication date Dec 12, 2013
- Takahiro KITAGAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL CONTACT ARRANGEMENT
- Publication number 20130005163
- Publication date Jan 3, 2013
- Phoenix Contact GmbH & Co., KG
- Dieter Holste
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STACKING OF TRANSFER CARRIERS WITH APERTURE ARRAYS AS INTERCONNECTI...
- Publication number 20110278725
- Publication date Nov 17, 2011
- NICHEPAC TECHNOLOGY INC.
- Cheng-Lien CHIANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADHESIVE REINFORCED OPEN HOLE INTERCONNECT
- Publication number 20110261539
- Publication date Oct 27, 2011
- Kevin C. Rolston
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ILLUMINATION DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20110220958
- Publication date Sep 15, 2011
- CCS Inc.
- Kenji Yoneda
- F21 - LIGHTING
Information Patent Application
INTEGRATED DEVICE
- Publication number 20110162204
- Publication date Jul 7, 2011
- QIMONDA AG
- Werner Reiss
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
PRINTED CIRCUIT BOARD AND ELECTRONIC APPARATUS
- Publication number 20110155450
- Publication date Jun 30, 2011
- Daigo Suzuki
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Wired circuit board
- Publication number 20110119911
- Publication date May 26, 2011
- Nitto Denko Corporation
- Hitoki Kanagawa
- G11 - INFORMATION STORAGE
Information Patent Application
ELECTRONIC DEVICE, LAYERED SUBSTRATE, AND METHODS OF MANUFACTURING...
- Publication number 20110001222
- Publication date Jan 6, 2011
- Nozomu Nishimura
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20100276797
- Publication date Nov 4, 2010
- INFINEON TECHNOLOGIES AG
- Stefan Landau
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
ELECTRONIC COMPONENT MOUNTING STRUCTURE AND ELECTRONIC COMPONENT MO...
- Publication number 20100214741
- Publication date Aug 26, 2010
- Fujitsu Limited
- Rie Takada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD FOR MOUNTING ELECTRONIC COMPONENTS
- Publication number 20100157559
- Publication date Jun 24, 2010
- PANASONIC CORPORATION
- HIDEAKI YAMAUCHI
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
FLEX-RIGID WIRING BOARD AND ELECTRONIC DEVICE
- Publication number 20100051326
- Publication date Mar 4, 2010
- IBIDEN CO., LTD.
- Katsumi Sagisaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder interface between integrated connector terminals and printed...
- Publication number 20100008054
- Publication date Jan 14, 2010
- Patrick L. Dotson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Light emission device
- Publication number 20090315064
- Publication date Dec 24, 2009
- Chih-Yang Wang
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Semiconductor package and associated methods
- Publication number 20090257209
- Publication date Oct 15, 2009
- Seong-Chan Han
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
STACKING OF TRANSFER CARRIERS WITH APERTURE ARRAYS AS INTERCONNECTI...
- Publication number 20090206481
- Publication date Aug 20, 2009
- NICHEPAC TECHNOLOGY INC.
- Cheng-Lien Chiang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD DIRECT CONNECTION AND METHOD OF FORMING THE SAME
- Publication number 20090197435
- Publication date Aug 6, 2009
- FRED JESSUP
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Through-Via Laser Reflow Systems And Methods For Surface Mount Comp...
- Publication number 20090120916
- Publication date May 14, 2009
- L3 Communications Corporation
- Robert Bruce
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL CONNECTION BETWEEN CABLE AND PRINTED CIRCUITE BOARD FOR...
- Publication number 20090104813
- Publication date Apr 23, 2009
- Hubert CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electric Device, Stack of Electric Devices, and Method of Manufactu...
- Publication number 20090072374
- Publication date Mar 19, 2009
- Stephan Dobritz
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Solder filled PTH during processing

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of forming a top plane connection in an electro-optic device

Method for producing a printed circuit board having thermal through...

Non-destructive identifying of plating dissolution in soldered, pla...

Facilitating filling a plated through-hole of a circuit board with...

Method of forming a top plane connection in an electro-optic device

Repairing defective through-holes

Printed circuit board with at least one integrated precision resistor

Electro-optic display with measurement aperture

Printed circuit board and method for producing a printed circuit board

Substrate on which electronic component is soldered, electronic dev...

Electrical connector assembly and mounting structure thereof

Processes for the production of electro-optic displays

Adhesive reinforced open hole interconnect

Printed circuit board and method for mounting electronic components

Low-thickness electronic module comprising a stack of electronic pa...

Illumination device and method for manufacturing the same

Method of manufacturing a wired circuit board

Via design for flux residue mitigation

Semiconductor device

Method of manufacturing a wired circuit board

Microelectronic packages and methods therefor

Flexible printed circuit board and liquid crystal display device us...

Semiconductor device and radiation detector employing it

Electric device, stack of electric devices, and method of manufactu...

Integrated circuit module and method of forming the same

Printed circuit board direct connection and method of forming the same

Wired circuit board

Capacitor sheet and electronic circuit board

Electrical connection between cable and printed circuit board for h...

Semiconductor device and radiation detector employing it

Patents Applicationslast 30 patents

WIRING SUBSTRATE FOR ELECTRONIC CONTROL DEVICE, AND METHOD FOR MANU...

CONNECTION METHOD FOR CHIP AND CIRCUIT BOARD, AND CIRCUIT BOARD ASS...

REPAIRING DEFECTIVE THROUGH-HOLES

NON-DESTRUCTIVE IDENTIFYING OF PLATING DISSOLUTION IN SOLDERED, PLA...

FACILITATING FILLING A PLATED THROUGH-HOLE OF A CIRCUIT BOARD WITH...

SUBSTRATE ON WHICH ELECTRONIC COMPONENT IS SOLDERED, ELECTRONIC DEV...

PRINTED CIRCUIT BOARD MANUFACTURING METHOD AND PRINTED CIRCUIT BOAR...

Electrical Connector Assembly and Mounting Structure Thereof

PROCESSES FOR THE PRODUCTION OF ELECTRO-OPTIC DISPLAYS

PRINTED WIRING BOARD AND SOLDERING METHOD

ELECTRICAL CONTACT ARRANGEMENT

STACKING OF TRANSFER CARRIERS WITH APERTURE ARRAYS AS INTERCONNECTI...

ADHESIVE REINFORCED OPEN HOLE INTERCONNECT

ILLUMINATION DEVICE AND METHOD FOR MANUFACTURING THE SAME

INTEGRATED DEVICE

PRINTED CIRCUIT BOARD AND ELECTRONIC APPARATUS

Wired circuit board

ELECTRONIC DEVICE, LAYERED SUBSTRATE, AND METHODS OF MANUFACTURING...

SEMICONDUCTOR DEVICE

ELECTRONIC COMPONENT MOUNTING STRUCTURE AND ELECTRONIC COMPONENT MO...

PRINTED CIRCUIT BOARD AND METHOD FOR MOUNTING ELECTRONIC COMPONENTS

FLEX-RIGID WIRING BOARD AND ELECTRONIC DEVICE

Solder interface between integrated connector terminals and printed...

Light emission device

Semiconductor package and associated methods

STACKING OF TRANSFER CARRIERS WITH APERTURE ARRAYS AS INTERCONNECTI...

PRINTED CIRCUIT BOARD DIRECT CONNECTION AND METHOD OF FORMING THE SAME

Through-Via Laser Reflow Systems And Methods For Surface Mount Comp...

ELECTRICAL CONNECTION BETWEEN CABLE AND PRINTED CIRCUITE BOARD FOR...

Electric Device, Stack of Electric Devices, and Method of Manufactu...