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Solder masks

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  • CPC
  • H05K3/3452
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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/3452Solder masks
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    METHOD OF MANUFACTURING CIRCUIT BOARD
    • Publication number 20250071909
    • Publication date Feb 27, 2025
    • HAESUNG DS CO., LTD.
    • Soon-Chul KWON
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Solder Mask Arrangement for a Component Carrier
    • Publication number 20250056735
    • Publication date Feb 13, 2025
    • AT&S (Chongqing) Company Limited
    • Ismadi Bin Ismail
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRE-SOLDER BUMP PREVENTIVE OVERCOATING
    • Publication number 20240428821
    • Publication date Dec 26, 2024
    • Western Digital Technologies, Inc.
    • Irizo Naniwa
    • G11 - INFORMATION STORAGE
  • Information Patent Application

    FLEXIBLE CIRCUIT BOARD
    • Publication number 20240414842
    • Publication date Dec 12, 2024
    • LG Innotek Co., Ltd.
    • Jun Young LIM
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
    • Publication number 20240414850
    • Publication date Dec 12, 2024
    • Unimicron Technology Corp.
    • Chin-Sheng Wang
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SENSOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
    • Publication number 20240397633
    • Publication date Nov 28, 2024
    • TONG HSING ELECTRONIC INDUSTRIES, LTD.
    • YU-HSIANG LIU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
    • Publication number 20240389241
    • Publication date Nov 21, 2024
    • DAEDUCK ELECTRONICS CO., LTD.
    • Min-Geun JUNG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME
    • Publication number 20240381530
    • Publication date Nov 14, 2024
    • LG Innotek Co., Ltd.
    • Se Woong NA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Pre-Plating of Solder Layer on Solderable Elements for Diffusion So...
    • Publication number 20240373548
    • Publication date Nov 7, 2024
    • INFINEON TECHNOLOGIES AG
    • Alexander Heinrich
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METHOD OF BONDING COLUMN TYPE DEPOSITS
    • Publication number 20240314939
    • Publication date Sep 19, 2024
    • PROTEC CO., LTD.
    • Youn Sung Ko
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Printed Circuit Board And Method For Soldering A Chip Housing In A...
    • Publication number 20240292514
    • Publication date Aug 29, 2024
    • LISA DRAXLMAIER GMBH
    • Andreas Brinkmann
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
    • Publication number 20240276642
    • Publication date Aug 15, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Keesu Jeon
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ORGANIC SUBSTRATE-BASED WEARABLE PLATFORM AND METHODS FOR ON-BODY S...
    • Publication number 20240268037
    • Publication date Aug 8, 2024
    • Takaroa Corporation, Inc.
    • Ethan M. Devine
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20240260178
    • Publication date Aug 1, 2024
    • KIOXIA Corporation
    • Motoshi SETO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    REWORKING SOLDER COMPONENT WITHOUT PART REMOVAL
    • Publication number 20240237228
    • Publication date Jul 11, 2024
    • International Business Machines Corporation
    • Theron Lee Lewis
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LIGHT-EMITTING DIODE ARRAY WITH PRECISE POSITION ASSEMBLY FOR AUTOM...
    • Publication number 20240206072
    • Publication date Jun 20, 2024
    • Lumileds LLC
    • Say Chun OOI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Terminal Device
    • Publication number 20240172367
    • Publication date May 23, 2024
    • Honor Device Co., Ltd.
    • Yihe Zhang
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20240164026
    • Publication date May 16, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Jung Soo KIM
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    REWORKING SOLDER COMPONENT WITHOUT PART REMOVAL
    • Publication number 20240138074
    • Publication date Apr 25, 2024
    • International Business Machines Corporation
    • Theron Lee Lewis
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20240114620
    • Publication date Apr 4, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Seung Min LEE
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    STRESS-RELEASING SOLDER MASK PATTERN FOR SEMICONDUCTOR DEVICES AND...
    • Publication number 20240057265
    • Publication date Feb 15, 2024
    • Micron Technology, Inc.
    • Kelvin Tan Aik Boo
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    FLEXIBLE CIRCUIT BOARD
    • Publication number 20230345632
    • Publication date Oct 26, 2023
    • LG Innotek Co., Ltd.
    • Jun Young LIM
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD WITH SOLDER MASK ON INTERNAL COPPER PAD
    • Publication number 20230328896
    • Publication date Oct 12, 2023
    • DSBJ PTE. LTD.
    • Pui Yin YU
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PACKAGE SUBSTRATE MANUFACTURING METHOD
    • Publication number 20230326765
    • Publication date Oct 12, 2023
    • Zhuhai ACCESS Semiconductor Co., Ltd
    • Xianming CHEN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    TOMBSTONE PREVENTION FOR A SURFACE MOUNT DEVICE
    • Publication number 20230284388
    • Publication date Sep 7, 2023
    • Western Digital Technologies, Inc.
    • Joyce Chen
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD WITH MOLD ADHESION BOUNDARY FOR DIE ATTACH PAD
    • Publication number 20230262901
    • Publication date Aug 17, 2023
    • Skyworks Solutions, Inc.
    • Andrew Christopher Laib
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD
    • Publication number 20230199954
    • Publication date Jun 22, 2023
    • Avary Holding (Shenzhen) Co., Limited.
    • LIN-JIE GAO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD
    • Publication number 20230180394
    • Publication date Jun 8, 2023
    • LG Innotek Co., Ltd.
    • Se Woong NA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Inkjet Ink for Printed Circuit Boards
    • Publication number 20230174805
    • Publication date Jun 8, 2023
    • AGFA-GEVAERT N.V.
    • Marion Sauvageot
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    FLEXIBLE INLAY AND MANUFACTURING METHOD THEREOF
    • Publication number 20230101831
    • Publication date Mar 30, 2023
    • IDEX Biometrics ASA
    • David N. Light
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR