Soldering or alloying

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H01L2224/80801

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/80801Soldering or alloying

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing semiconductor element, and semiconductor el...
- Patent number 12,132,142
- Issue date Oct 29, 2024
- Kyocera Corporation
- Katsuaki Masaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method for fabricating the same
- Patent number 12,125,838
- Issue date Oct 22, 2024
- Samsung Display Co., Ltd.
- Seung Geun Lee
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Display device and method of manufacturing the display device
- Patent number 12,002,815
- Issue date Jun 4, 2024
- Samsung Display Co., Ltd.
- Jihyun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with low parasitic connection to passive device
- Patent number 11,973,063
- Issue date Apr 30, 2024
- Infineon Technologies AG
- Urban Medic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device having pixels with the same active layer and method...
- Patent number 11,942,025
- Issue date Mar 26, 2024
- Samsung Display Co., Ltd.
- Jin Wan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pads for low temperature hybrid bonding
- Patent number 11,810,891
- Issue date Nov 7, 2023
- Advanced Micro Devices, Inc.
- Priyal Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method for fabricating the same
- Patent number 11,784,177
- Issue date Oct 10, 2023
- Samsung Display Co., Ltd.
- Seung Geun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor package
- Patent number 11,776,882
- Issue date Oct 3, 2023
- Infineon Technologies Austria AG
- Markus Dinkel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor package structure
- Patent number 11,699,694
- Issue date Jul 11, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Hsiu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Serializer-deserializer die for high speed signal interconnect
- Patent number 11,581,282
- Issue date Feb 14, 2023
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module with sealing resin
- Patent number 11,387,400
- Issue date Jul 12, 2022
- Murata Manufacturing Co., Ltd.
- Junpei Yasuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating a semiconductor pac...
- Patent number 11,302,610
- Issue date Apr 12, 2022
- Infineon Technologies Austria AG
- Markus Dinkel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor package structure
- Patent number 11,043,481
- Issue date Jun 22, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Hsiu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package with offset 3D structure
- Patent number 11,018,125
- Issue date May 25, 2021
- Advanced Micro Devices, Inc.
- Milind S. Bhagavat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pads for low temperature hybrid bonding
- Patent number 10,937,755
- Issue date Mar 2, 2021
- Advanced Micro Devices, Inc.
- Priyal Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus and method for preparing the same
- Patent number 10,923,455
- Issue date Feb 16, 2021
- Nanya Technology Corporation
- Po-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing a semiconductor apparatus
- Patent number 10,825,794
- Issue date Nov 3, 2020
- Nanya Technology Corporation
- Po-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing chip cards and chip card obtained by said...
- Patent number 10,804,226
- Issue date Oct 13, 2020
- Linxens Holding
- Cyril Proye
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of manufacturing semiconductor device and semiconductor device
- Patent number 10,741,505
- Issue date Aug 11, 2020
- TOSHIBA MEMORY CORPORATION
- Masaya Shima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package with offset 3D structure
- Patent number 10,714,462
- Issue date Jul 14, 2020
- Advanced Micro Devices, Inc.
- Milind S. Bhagavat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D Compute circuit with high density z-axis interconnects
- Patent number 10,672,743
- Issue date Jun 2, 2020
- Xcelsis Corporation
- Steven L. Teig
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of manufacturing semiconductor package structure
- Patent number 10,665,582
- Issue date May 26, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Hsiu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper structures with intermetallic coating for integrated circuit...
- Patent number 10,461,052
- Issue date Oct 29, 2019
- Monolithic Power Systems, Inc.
- Hunt Hang Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor-on-insulator with back side heat dissipation
- Patent number 10,217,822
- Issue date Feb 26, 2019
- QUALCOMM Incorporated
- Paul A. Nygaard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, metal member, and method of manufacturing sem...
- Patent number 10,199,314
- Issue date Feb 5, 2019
- Fuji Electric Co., Ltd.
- Kenshi Kai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Room temperature metal direct bonding
- Patent number 10,141,218
- Issue date Nov 27, 2018
- INVENSAS BONDING TECHNOLOGIES, INC.
- Qin-Yi Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing element chip, method of manufacturing elect...
- Patent number 9,953,906
- Issue date Apr 24, 2018
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Atsushi Harikai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding substrates
- Patent number 9,859,246
- Issue date Jan 2, 2018
- EV Group E. Thallner GmbH
- Andreas Fehkuhrer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing element chip, method of manufacturing elect...
- Patent number 9,780,021
- Issue date Oct 3, 2017
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Atsushi Harikai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper structures with intermetallic coating for integrated circuit...
- Patent number 9,754,909
- Issue date Sep 5, 2017
- Monolithic Power Systems, Inc.
- Hunt Hang Jiang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
POWER MODULE WITH BALANCED CURRENT FLOW
- Publication number 20240379526
- Publication date Nov 14, 2024
- Navitas Semiconductor Limited
- Oseob Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE HAVING EMBEDDED ELECTRONIC COMPONENT MOUNTED ON C...
- Publication number 20240373560
- Publication date Nov 7, 2024
- QUALCOMM Incorporated
- Seongryul CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE DISPLAY DEVICE
- Publication number 20240321904
- Publication date Sep 26, 2024
- SAMSUNG DISPLAY CO., LTD.
- Jihyun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240265854
- Publication date Aug 8, 2024
- SAMSUNG DISPLAY CO., LTD.
- Jin Wan KIM
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
A PROCEDURE TO ENABLE DIE REWORK FOR HYBRID BONDING
- Publication number 20230260955
- Publication date Aug 17, 2023
- Ying WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230111670
- Publication date Apr 13, 2023
- SAMSUNG DISPLAY CO., LTD.
- Jin Wan KIM
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20230049315
- Publication date Feb 16, 2023
- SAMSUNG DISPLAY CO., LTD.
- Jin Woo CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR TRANSFERRING ELECTRONIC COMPONENT, METHOD FOR TRANSFE...
- Publication number 20230030227
- Publication date Feb 2, 2023
- Stroke Precision Advanced Engineering Co., Ltd.
- Kuo-Pin Chuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Low Parasitic Connection to Passive Device
- Publication number 20230017391
- Publication date Jan 19, 2023
- INFINEON TECHNOLOGIES AG
- Urban Medic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING A SEMICONDUCTOR PACKAGE
- Publication number 20220230941
- Publication date Jul 21, 2022
- Markus Dinkel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20210313309
- Publication date Oct 7, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Hsiu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PADS FOR LOW TEMPERATURE HYBRID BONDING
- Publication number 20210183810
- Publication date Jun 17, 2021
- ADVANCED MICRO DEVICES, INC.
- PRIYAL SHAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20200286879
- Publication date Sep 10, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Hsiu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method of Fabricating a Semiconductor Pac...
- Publication number 20200135619
- Publication date Apr 30, 2020
- Markus Dinkel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SERIALIZER-DESERIALIZER DIE FOR HIGH SPEED SIGNAL INTERCONNECT
- Publication number 20200075521
- Publication date Mar 5, 2020
- Intel Corporation
- Adel A. Elsherbini
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
BOND PADS FOR LOW TEMPERATURE HYBRID BONDING
- Publication number 20200006280
- Publication date Jan 2, 2020
- Priyal Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Level UGA (UBM Grid Array) & PGA (Pad Grid Array) for Low Cos...
- Publication number 20190267342
- Publication date Aug 29, 2019
- Dialog Semiconductor B.V.
- Shou Cheng Eric Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Manufacturing Chip Cards and Chip Card Obtained by Said...
- Publication number 20190157223
- Publication date May 23, 2019
- LINXENS HOLDING
- Cyril PROYE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20190139908
- Publication date May 9, 2019
- Toshiba Memory Corporation
- Masaya SHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20190131289
- Publication date May 2, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Hsiu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROOM TEMPERATURE METAL DIRECT BONDING
- Publication number 20190115247
- Publication date Apr 18, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Qin-Yi Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC MODULE
- Publication number 20190027676
- Publication date Jan 24, 2019
- Murata Manufacturing Co., Ltd.
- Junpei YASUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE ATTACHMENT FOR ATTACHING A SUBSTRATE THERETO
- Publication number 20180096962
- Publication date Apr 5, 2018
- EV GROUP E. THALLNER GMBH
- Andreas FEHKUHRER
- B32 - LAYERED PRODUCTS
Information Patent Application
COPPER STRUCTURES WITH INTERMETALLIC COATING FOR INTEGRATED CIRCUIT...
- Publication number 20170330853
- Publication date Nov 16, 2017
- Monolithic Power Systems, Inc.
- Hunt Hang Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING ELEMENT CHIP, METHOD OF MANUFACTURING ELECT...
- Publication number 20170229385
- Publication date Aug 10, 2017
- Panasonic Intellectual Property Management Co., Ltd.
- Atsushi HARIKAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING ELEMENT CHIP, METHOD OF MANUFACTURING ELECT...
- Publication number 20170229384
- Publication date Aug 10, 2017
- Panasonic Intellectual Property Management Co., Ltd.
- Atsushi HARIKAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METAL MEMBER, AND METHOD OF MANUFACTURING SEM...
- Publication number 20160343647
- Publication date Nov 24, 2016
- Fuji Electric Co., Ltd.
- Kenshi KAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20160093601
- Publication date Mar 31, 2016
- Semiconductor Manufacturing International (Shanghai) Corporation
- JINGXIU DING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROOM TEMPERATURE METAL DIRECT BONDING
- Publication number 20160086899
- Publication date Mar 24, 2016
- Ziptronix, Inc.
- Qin-Yi Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER-CONTAINING SEMICONDUCTOR DEVICE, MOUNTED SOLDER-CONTAINING S...
- Publication number 20150200265
- Publication date Jul 16, 2015
- Sumitomo Electric Industries, Ltd.
- Tetsuya Kumano
- H01 - BASIC ELECTRIC ELEMENTS

Soldering or alloying

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of manufacturing semiconductor element, and semiconductor el...

Display device and method for fabricating the same

Display device and method of manufacturing the display device

Semiconductor package with low parasitic connection to passive device

Display device having pixels with the same active layer and method...

Bond pads for low temperature hybrid bonding

Display device and method for fabricating the same

Method of fabricating a semiconductor package

Method of manufacturing semiconductor package structure

Serializer-deserializer die for high speed signal interconnect

Electronic module with sealing resin

Semiconductor package and method of fabricating a semiconductor pac...

Method of manufacturing semiconductor package structure

Multi-chip package with offset 3D structure

Bond pads for low temperature hybrid bonding

Semiconductor apparatus and method for preparing the same

Method for preparing a semiconductor apparatus

Method for manufacturing chip cards and chip card obtained by said...

Method of manufacturing semiconductor device and semiconductor device

Multi-chip package with offset 3D structure

3D Compute circuit with high density z-axis interconnects

Method of manufacturing semiconductor package structure

Copper structures with intermetallic coating for integrated circuit...

Semiconductor-on-insulator with back side heat dissipation

Semiconductor device, metal member, and method of manufacturing sem...

Room temperature metal direct bonding

Method of manufacturing element chip, method of manufacturing elect...

Method for bonding substrates

Method of manufacturing element chip, method of manufacturing elect...

Copper structures with intermetallic coating for integrated circuit...

Patents Applicationslast 30 patents

POWER MODULE WITH BALANCED CURRENT FLOW

PACKAGE SUBSTRATE HAVING EMBEDDED ELECTRONIC COMPONENT MOUNTED ON C...

DISPLAY DEVICE AND METHOD OF MANUFACTURING THE DISPLAY DEVICE

DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME

A PROCEDURE TO ENABLE DIE REWORK FOR HYBRID BONDING

DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME

DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME

APPARATUS FOR TRANSFERRING ELECTRONIC COMPONENT, METHOD FOR TRANSFE...

Semiconductor Package with Low Parasitic Connection to Passive Device

METHOD OF FABRICATING A SEMICONDUCTOR PACKAGE

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE STRUCTURE

BOND PADS FOR LOW TEMPERATURE HYBRID BONDING

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE STRUCTURE

Semiconductor Package and Method of Fabricating a Semiconductor Pac...

SERIALIZER-DESERIALIZER DIE FOR HIGH SPEED SIGNAL INTERCONNECT

BOND PADS FOR LOW TEMPERATURE HYBRID BONDING

Wafer Level UGA (UBM Grid Array) & PGA (Pad Grid Array) for Low Cos...

Method for Manufacturing Chip Cards and Chip Card Obtained by Said...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE STRUCTURE

ROOM TEMPERATURE METAL DIRECT BONDING

ELECTRONIC MODULE

SUBSTRATE ATTACHMENT FOR ATTACHING A SUBSTRATE THERETO

COPPER STRUCTURES WITH INTERMETALLIC COATING FOR INTEGRATED CIRCUIT...

METHOD OF MANUFACTURING ELEMENT CHIP, METHOD OF MANUFACTURING ELECT...

METHOD OF MANUFACTURING ELEMENT CHIP, METHOD OF MANUFACTURING ELECT...

SEMICONDUCTOR DEVICE, METAL MEMBER, AND METHOD OF MANUFACTURING SEM...

SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF

ROOM TEMPERATURE METAL DIRECT BONDING

SOLDER-CONTAINING SEMICONDUCTOR DEVICE, MOUNTED SOLDER-CONTAINING S...